HYBRID-ORIENTATION TECHNOLOGY BURIED N-WELL DESIGN
    81.
    发明申请
    HYBRID-ORIENTATION TECHNOLOGY BURIED N-WELL DESIGN 失效
    混合技术渗透N型设计

    公开(公告)号:US20070232020A1

    公开(公告)日:2007-10-04

    申请号:US11760836

    申请日:2007-06-11

    IPC分类号: H01L21/311

    摘要: A semiconductor structure is provided that includes a hybrid orientated substrate having at least two coplanar surfaces of different surface crystal orientations, wherein one of the coplanar surfaces has bulk-like semiconductor properties and the other coplanar surface has semiconductor-on-insulator (SOI) properties. In accordance with the present invention, the substrate includes a new well design that provides a large capacitance from a retrograde well region of the second conductivity type to the substrate thereby providing noise decoupling with a low number of well contacts. The present invention also provides a method of fabricating such a semiconductor structure.

    摘要翻译: 提供一种半导体结构,其包括具有不同表面晶取向的至少两个共面表面的混合取向基板,其中共面中的一个具有块状半导体特性,而另一共面具有绝缘体上半导体(SOI)性质 。 根据本发明,衬底包括新的阱设计,其从第二导电类型的逆向阱区域向衬底提供大的电容,由此提供具有少量阱接触的噪声解耦。 本发明还提供一种制造这种半导体结构的方法。

    QUASI SELF-ALIGNED SOURCE/DRAIN FinFET PROCESS
    82.
    发明申请
    QUASI SELF-ALIGNED SOURCE/DRAIN FinFET PROCESS 失效
    QUASI自对准源/漏极FinFET工艺

    公开(公告)号:US20070108536A1

    公开(公告)日:2007-05-17

    申请号:US11164215

    申请日:2005-11-15

    IPC分类号: H01L21/8244

    摘要: A method of forming a semiconductor structure including a plurality of finFFET devices in which crossing masks are employed in providing a rectangular patterns to define relatively thin Fins along with a chemical oxide removal (COR) process is provided. The present method further includes a step of merging adjacent Fins by the use of a selective silicon-containing material. The present invention also relates to the resultant semiconductor structure that is formed utilizing the method of the present invention.

    摘要翻译: 提供了一种形成包括多个finFFET器件的半导体结构的方法,其中使用交叉掩模提供矩形图案以限定相对薄的金属丝以及化学氧化物去除(COR)工艺。 本方法还包括通过使用选择性含硅材料来合并相邻的金属丝的步骤。 本发明还涉及利用本发明的方法形成的所得半导体结构。

    ASYMMETRIC FIELD EFFECT TRANSISTORS (FETs)
    84.
    发明申请
    ASYMMETRIC FIELD EFFECT TRANSISTORS (FETs) 有权
    非对称场效应晶体管(FET)

    公开(公告)号:US20060244077A1

    公开(公告)日:2006-11-02

    申请号:US10908095

    申请日:2005-04-27

    申请人: Edward Nowak

    发明人: Edward Nowak

    IPC分类号: H01L29/76

    摘要: A semiconductor structure and a method for forming the same. The structure includes (a) a semiconductor channel region, (b) a semiconductor source block in direct physical contact with the semiconductor channel region; (c) a source contact region in direct physical contact with the semiconductor source block, wherein the source contact region comprises a first electrically conducting material, and wherein the semiconductor source block physically isolates the source contact region from the semiconductor channel region, and (d) a drain contact region in direct physical contact with the semiconductor channel region, wherein the semiconductor channel region is disposed between the semiconductor source block and the drain contact region, and wherein the drain contact region comprises a second electrically conducting material; and (e) a gate stack in direct physical contact with the semiconductor channel region.

    摘要翻译: 半导体结构及其形成方法。 该结构包括(a)半导体沟道区,(b)与半导体沟道区直接物理接触的半导体源块; (c)与半导体源极块直接物理接触的源极接触区域,其中源极接触区域包括第一导电材料,并且其中半导体源极块将源极接触区域与半导体沟道区域物理隔离,并且(d )与所述半导体沟道区域直接物理接触的漏极接触区域,其中所述半导体沟道区域设置在所述半导体源极块和所述漏极接触区域之间,并且其中所述漏极接触区域包括第二导电材料; 和(e)与半导体沟道区直接物理接触的栅叠层。

    Method of forming fet with T-shaped gate
    86.
    发明申请
    Method of forming fet with T-shaped gate 有权
    用T形门形成胎儿的方法

    公开(公告)号:US20050104139A1

    公开(公告)日:2005-05-19

    申请号:US11005659

    申请日:2004-12-07

    摘要: An FET has a T-shaped gate. The FET has a halo diffusion self-aligned to the bottom portion of the T and an extension diffusion self aligned to the top portion. The halo is thereby separated from the extension implant, and this provides significant advantages. The top and bottom portions of the T-shaped gate can be formed of layers of two different materials, such as germanium and silicon. The two layers are patterned together. Then exposed edges of the bottom layer are selectively chemically reacted and the reaction products are etched away to provide the notch. In another embodiment, the gate is formed of a single gate conductor. A metal is conformally deposited along sidewalls, recess etched to expose a top portion of the sidewalls, and heated to form silicide along bottom portions. The silicide is etched to provide the notch.

    摘要翻译: FET具有T形门。 FET具有与T的底部自对准的晕圈扩散,并且与顶部自对准的延伸扩散。 因此,光环与延伸植入物分离,这提供了显着的优点。 T形门的顶部和底部可以由两种不同材料的层形成,例如锗和硅。 两层被图案化在一起。 然后,底层的暴露边缘被选择性地化学反应,并且蚀刻掉反应产物以提供凹口。 在另一个实施例中,栅极由单个栅极导体形成。 金属沿着侧壁共形沉积,凹陷蚀刻以暴露侧壁的顶部,并且被加热以沿底部形成硅化物。 蚀刻硅化物以提供凹口。

    ASYMMETRIC FIELD EFFECT TRANSISTORS (FETs)
    88.
    发明申请
    ASYMMETRIC FIELD EFFECT TRANSISTORS (FETs) 有权
    非对称场效应晶体管(FET)

    公开(公告)号:US20080023775A1

    公开(公告)日:2008-01-31

    申请号:US11871289

    申请日:2007-10-12

    申请人: Edward Nowak

    发明人: Edward Nowak

    IPC分类号: H01L29/78 H01L21/336

    摘要: A semiconductor structure and a method for forming the same. The structure includes (a) a semiconductor channel region, (b) a semiconductor source block in direct physical contact with the semiconductor channel region; (c ) a source contact region in direct physical contact with the semiconductor source block, wherein the source contact region comprises a first electrically conducting material, and wherein the semiconductor source block physically isolates the source contact region from the semiconductor channel region, and (d) a drain contact region in direct physical contact with the semiconductor channel region, wherein the semiconductor channel region is disposed between the semiconductor source block and the drain contact region, and wherein the drain contact region comprises a second electrically conducting material; and (e) a gate stack in direct physical contact with the semiconductor channel region.

    摘要翻译: 半导体结构及其形成方法。 该结构包括(a)半导体沟道区,(b)与半导体沟道区直接物理接触的半导体源块; (c)与半导体源极块直接物理接触的源极接触区域,其中源极接触区域包括第一导电材料,并且其中半导体源极块将源极接触区域与半导体沟道区域物理隔离,并且(d )与所述半导体沟道区域直接物理接触的漏极接触区域,其中所述半导体沟道区域设置在所述半导体源极块和所述漏极接触区域之间,并且其中所述漏极接触区域包括第二导电材料; 和(e)与半导体沟道区直接物理接触的栅叠层。