公开(公告)号：US06390901B1

公开(公告)日：2002-05-21

申请号：US09397916

申请日：1999-09-17

申请人： Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa ,  Hisanori Matsuo ,  Tetsuji Togawa ,  Satoshi Wakabayashi

发明人： Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa ,  Hisanori Matsuo ,  Tetsuji Togawa ,  Satoshi Wakabayashi

IPC分类号： B24B2900

CPC分类号： B24B37/11 ,  B24D9/085

摘要： An object of the present invention is to provide a polishing apparatus with a grinding plate that can easily and reliably be installed on and detached from a turntable. The polishing apparatus has a grinding plate tool, fixedly mounted on the turntable, which includes the grinding plate, and a top ring for holding a workpiece to be polished and pressing the workpiece against the grinding plate in sliding contact therewith for polishing a surface of the workpiece to a flat, mirror finish. A clamping mechanism is mounted in the turntable for fixing an outer circumferential flange of the grinding plate tool to the turntable.

摘要翻译： 本发明的目的是提供一种具有研磨板的抛光装置，其可以容易且可靠地安装在转台上和从转盘上拆下。 抛光装置具有固定安装在转盘上的研磨板工具，其包括研磨板，以及用于保持要抛光的工件的顶环，并将工件抵靠研磨板与其滑动接触，以抛光其中的表面 工件平整，镜面光洁。 夹持机构安装在转盘中，用于将研磨板工具的外周凸缘固定到转台上。

公开(公告)号：US06358131B1

公开(公告)日：2002-03-19

申请号：US09625490

申请日：2000-07-25

申请人： Kunihiko Sakurai ,  Satoshi Wakabayashi ,  Tetsuji Togawa

发明人： Kunihiko Sakurai ,  Satoshi Wakabayashi ,  Tetsuji Togawa

IPC分类号： B24B500

CPC分类号： B24B37/345 ,  B24B41/061

摘要： The present invention provides a polishing apparatus comprising a polishing table having a polishing surface, a substrate carrier having an axis about which the substrate carrier is rotatable. The substrate carrier includes a plurality of substrate holders positioned around a circle about the axis of the substrate carrier and spaced apart from each other at equal angular distances, with each of the substrate holders being adapted to hold a substrate and bring it into contact with the polishing surface. The apparatus further comprises a substrate loading device laterally spaced apart from the polishing table, in which device a substrate is picked up by one of the substrate holders which is positioned at the substrate loading device, and a substrate unloading device laterally spaced apart from the polishing table, in which device one of the substrate holders which is positioned at the substrate unloading device releases a wafer onto the unloading device. The substrate carrier is indexably rotated about the stated axis in such a manner that one of the substrate holders is selectively positioned at the loading device, while another substrate holder is positioned at the unloading device and at least one of the other substrate holders is positioned over the polishing surface.

摘要翻译： 本发明提供了一种抛光装置，其包括具有抛光表面的抛光台，具有基板载体可旋转的轴线的基板载体。 衬底载体包括多个衬底保持器，其围绕衬底载体的轴线围绕圆周定位，并以相等的角距彼此间隔开，衬底保持器中的每一个适于保持衬底并使其与 抛光面。 该装置还包括与抛光台横向间隔开的衬底加载装置，其中衬底被位于衬底装载装置的衬底保持器中的一个拾取，以及与抛光件横向间隔开的衬底卸载装置 工作台，其中位于衬底卸载装置的衬底保持器之一的装置将晶片释放到卸载装置上。 衬底载体可以以所述轴线可转动地旋转，使得衬底保持器中的一个选择性地定位在加载装置处，而另一衬底保持器定位在卸载装置处，并且至少一个衬底保持器位于 抛光面。

公开(公告)号：US06354922B1

公开(公告)日：2002-03-12

申请号：US09476905

申请日：2000-01-03

申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Satoshi Wakabayashi ,  Kenichiro Saito ,  Masahiko Sekimoto ,  Takuji Hayama ,  Daisuke Koga

发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Satoshi Wakabayashi ,  Kenichiro Saito ,  Masahiko Sekimoto ,  Takuji Hayama ,  Daisuke Koga

IPC分类号： B24B722

CPC分类号： B24B37/345 ,  B24B37/042 ,  H01L21/30625

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The transfer structure comprises a plurality of robots and is capable of changing transfer routes between the three cleaning apparatuses.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括具有抛光表面的转台，用于保持工件的顶环，并将工件压靠抛光表面抛光工件，用于清洁抛光工件的至少三个清洁装置和用于传送抛光工件的转印结构 在至少三个清洁装置之间。 传送结构包括多个机器人，并且能够改变三个清洁设备之间的传送路线。

公开(公告)号：US06328629B1

公开(公告)日：2001-12-11

申请号：US09026122

申请日：1998-02-19

申请人： Tetsuji Togawa ,  Norio Kimura ,  Koji Ono

发明人： Tetsuji Togawa ,  Norio Kimura ,  Koji Ono

IPC分类号： B24B4908

CPC分类号： B24B37/30 ,  B24B37/0053 ,  B24B37/013 ,  B24B49/08 ,  B24B49/16

摘要： A workpiece such as a semiconductor wafer is held by a top ring, and a lower surface of the workpiece is polished to a flat mirror finish by being pressed against a polishing surface of the turntable while the top ring and the turntable are rotated. While the workpiece is being polished, at least one of the pressure and the flow rate of a fluid which is supplied to an upper surface of the workpiece is detected. When at least one of the detected pressure and the detected flow rate changes, the polishing of the workpiece is stopped.

摘要翻译： 诸如半导体晶片的工件由顶环保持，并且当顶环和转盘旋转时，通过被压靠在转盘的抛光表面上而将工件的下表面抛光成平坦的镜面。 当工件被抛光时，检测供给到工件的上表面的流体的压力和流速中的至少一个。 当检测到的压力和检测到的流量中的至少一个改变时，停止对工件的抛光。

公开(公告)号：US5934984A

公开(公告)日：1999-08-10

申请号：US806622

申请日：1997-02-26

申请人： Tetsuji Togawa ,  Shunichiro Kojima

发明人： Tetsuji Togawa ,  Shunichiro Kojima

IPC分类号： B24B37/04 ,  B24B37/10 ,  B24B37/34 ,  B24B41/06 ,  B24B47/26 ,  B24B13/05

CPC分类号： B24B37/105 ,  B24B37/345 ,  B24B47/26 ,  Y10S414/136

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus has a pusher for transferring the workpiece between a top ring of a polishing apparatus and the pusher. The polishing apparatus includes a turntable having a polishing surface, a top ring for supporting the workpiece to be polished and pressing the workpiece against the polishing surface, and a pusher for transferring the workpiece between the top ring and the pusher. The pusher comprises a workpiece support for supporting the workpiece, an actuating unit for moving the workpiece support in a vertical direction, a sliding mechanism movable within a horizontal plane, and a positioning mechanism for positioning the workpiece support and the top ring with respect to each other in association with the sliding mechanism when the workpiece is transferred between the workpiece support and the top ring.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置具有用于在抛光装置的顶环和推动器之间传送工件的推动器。 抛光装置包括具有抛光表面的转盘，用于支撑待抛光工件的顶环，并将工件压靠在抛光表面上，以及用于在顶环和推动器之间传送工件的推动器。 推动器包括用于支撑工件的工件支撑件，用于沿垂直方向移动工件支撑件的致动单元，可在水平平面内移动的滑动机构，以及用于相对于每个位置定位工件支撑件和顶环的定位机构 当工件在工件支撑件和顶环之间转移时，与滑动机构相关联。

公开(公告)号：US5893794A

公开(公告)日：1999-04-13

申请号：US808690

申请日：1997-02-28

申请人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Kunihiko Sakurai

发明人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Kunihiko Sakurai

IPC分类号： B65G49/07 ,  H01L21/677 ,  H01L21/687 ,  B24B7/06

CPC分类号： H01L21/67766 ,  H01L21/68707 ,  Y10S451/914

摘要： A robotic transport apparatus is capable of providing an effective waterproofing function of working components without using mechanical seals. The robotic transport apparatus includes a robot body, an arm assembly extendably attached to the robot body, and a workpiece holding section attached to the arm assembly. A pan member for waterproofing of the robot body is provided above the robot body and has an area not smaller than the workpiece holding section.

摘要翻译： 机器人运输装置能够在不使用机械密封的情况下提供工作部件的有效防水功能。 机器人运输装置包括机器人主体，可伸缩地附接到机器人主体的臂组件和附接到臂组件的工件保持部。 机器人主体的防水盘构件设置在机器人主体的上方，具有不小于工件保持部的面积。

公开(公告)号：US08485866B2

公开(公告)日：2013-07-16

申请号：US13587371

申请日：2012-08-16

申请人： Hozumi Yasuda ,  Tetsuji Togawa ,  Osamu Nabeya ,  Kenichiro Saito ,  Makoto Fukushima ,  Tomoshi Inoue

发明人： Hozumi Yasuda ,  Tetsuji Togawa ,  Osamu Nabeya ,  Kenichiro Saito ,  Makoto Fukushima ,  Tomoshi Inoue

IPC分类号： B24B29/00 ,  B24B47/02

CPC分类号： B24B37/32

摘要： A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

摘要翻译： 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体，以及用于按压研磨面的保持环，保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件，该磁体保持抵靠第一构件。

公开(公告)号：US20120252320A1

公开(公告)日：2012-10-04

申请号：US13073218

申请日：2011-03-28

申请人： Masaya Seki ,  Tetsuji Togawa ,  Masayuki Nakanishi

发明人： Masaya Seki ,  Tetsuji Togawa ,  Masayuki Nakanishi

IPC分类号： B24B1/00

CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/20 ,  H01L21/30625 ,  H01L21/67092 ,  H01L21/67259 ,  H01L21/68 ,  H01L21/84 ,  H01L22/20

摘要： The polishing apparatus has a polishing unit capable of forming a right-angled cross section by polishing a peripheral portion of the substrate. The polishing unit includes a polishing head having a pressing member configured to press a polishing tape against the peripheral portion of the substrate from above, a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and to recover the polishing tape from the polishing head, a first moving mechanism configured to move the polishing head in a radial direction of the substrate, and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate.

摘要翻译： 抛光装置具有能够通过抛光基板的周边部分而形成直角横截面的抛光单元。 抛光单元包括：抛光头，其具有被配置成从上方将研磨带压靠在基板的周边部分上的按压构件，配置成将抛光带供给到抛光头并将抛光带从 抛光头，构造成沿着基板的径向方向移动抛光头的第一移动机构和被配置为沿着基板的径向移动带供给和恢复机构的第二移动机构。 引导辊布置成使得抛光带平行于基板的切线方向延伸，并且抛光带的抛光表面平行于基板的表面。

公开(公告)号：US08267746B2

公开(公告)日：2012-09-18

申请号：US12222909

申请日：2008-08-19

申请人： Hozumi Yasuda ,  Tetsuji Togawa ,  Osamu Nabeya ,  Kenichiro Saito ,  Makoto Fukushima ,  Tomoshi Inoue

发明人： Hozumi Yasuda ,  Tetsuji Togawa ,  Osamu Nabeya ,  Kenichiro Saito ,  Makoto Fukushima ,  Tomoshi Inoue

IPC分类号： B24B47/02

CPC分类号： B24B37/32

摘要： A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

摘要翻译： 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体，以及用于按压研磨面的保持环，保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件，该磁体保持抵靠第一构件。

公开(公告)号：US20120071065A1

公开(公告)日：2012-03-22

申请号：US13304931

申请日：2011-11-28

申请人： Osamu NABEYA ,  Tetsuji Togawa ,  Makoto Fukushima ,  Hozumi Yasuda

发明人： Osamu NABEYA ,  Tetsuji Togawa ,  Makoto Fukushima ,  Hozumi Yasuda

IPC分类号： B24B7/10

CPC分类号： B24B37/20 ,  B24B37/005 ,  B24B37/10 ,  B24B37/105 ,  B24B37/30 ,  B24B37/32 ,  B24B47/22 ,  B24B49/00 ,  B24B49/16

摘要： A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

摘要翻译： 抛光装置具有抛光垫，用于保持半导体晶片的顶环，以及可操作以在垂直方向上移动顶环的垂直移动机构。 抛光装置还具有距离测量传感器，该距离测量传感器可操作以当顶环的下表面与抛光垫接触时检测顶环的位置，以及控制器，其可操作以计算顶环的最佳位置进行抛光 基于由距离测量传感器检测到的位置的半导体晶片。 垂直移动机构包括可操作以将顶环移动到最佳位置的滚珠丝杠机构。