公开(公告)号：US20070177252A1

公开(公告)日：2007-08-02

申请号：US11700813

申请日：2007-02-01

申请人： Toshiaki Kobayashi ,  Kenji Uchida ,  Akira Toyama ,  Katsuya Ikezawa ,  Akira Miura ,  Yasukazu Akasaka

发明人： Toshiaki Kobayashi ,  Kenji Uchida ,  Akira Toyama ,  Katsuya Ikezawa ,  Akira Miura ,  Yasukazu Akasaka

IPC分类号： G02F1/00

CPC分类号： G02F1/0327 ,  G02F1/0123 ,  H04B10/501

摘要： In a light modulating apparatus of an external modulating type which is used in an optical communication system, there are provided an LN modulator, a light branching circuit, a photoelectric converter, a bias control circuit, a driver for an LN modulator which serves to drive the LN modulator in response to an input electric signal, a capacitor for cutting off DC and low frequency components of the input electric signal, a low frequency component compensating circuit for compensating the DC and low frequency components of the input electric signal, and an adding circuit for adding an output of the bias control circuit and that of the low frequency component compensating circuit and generating a bias control signal of the LN modulator.

摘要翻译： 在光通信系统中使用的外调制光调制装置中，设置有LN调制器，光分支电路，光电转换器，偏置控制电路，用于驱动LN调制器的驱动器 LN调制器响应于输入电信号，用于切断DC的电容器和输入电信号的低频分量;用于补偿输入电信号的DC和低频分量的低频分量补偿电路，以及添加 用于添加偏置控制电路的输出和低频分量补偿电路的输出的电路，并产生LN调制器的偏置控制信号。

公开(公告)号：US20070075880A1

公开(公告)日：2007-04-05

申请号：US11527546

申请日：2006-09-27

申请人： Kenji Uchida

发明人： Kenji Uchida

IPC分类号： H03M7/34

CPC分类号： H04L27/2096 ,  H04L27/2075

摘要： Disclosed is a coding circuit including: a data delay unit to delay a second signal as a third signal, the second signal comprising one of two data produced by splitting a data for cording, a first signal comprising the other data; a first arithmetic unit to calculate a logic product of the first signal and a first clock signal as a fourth signal; a second arithmetic unit to calculate the logic product of the third signal and an inverted signal of the first clock signal as a fifth signal; a first holding signal inversion unit to invert an output signal as a sixth signal according to the fourth signal; a second holding signal inversion unit to invert an output signal as a seventh signal according to the fifth signal; and an exclusive OR operation unit to calculate an exclusive OR of the sixth signal and the seventh signal.

摘要翻译： 公开了一种编码电路，包括：数据延迟单元，用于将第二信号延迟为第三信号，所述第二信号包括通过分割用于线路的数据产生的两个数据之一，包括其他数据的第一信号; 第一算术单元，用于计算第一信号和第一时钟信号的逻辑积作为第四信号; 第二运算单元，计算第三信号的逻辑积和第一时钟信号的反相信号作为第五信号; 第一保持信号反转单元，用于根据第四信号将作为第六信号的输出信号反相; 第二保持信号反转单元，用于根据第五信号将作为第七信号的输出信号反相; 以及用于计算第六信号和第七信号的异或的异或运算单元。

公开(公告)号：US20070070488A1

公开(公告)日：2007-03-29

申请号：US11527561

申请日：2006-09-27

申请人： Akira Miura ,  Kenji Uchida ,  Katsuya Ikezawa ,  Hiroyuki Matsuura ,  Akira Toyama ,  Toshiaki Kobayashi ,  Tsuyoshi Yakihara ,  Kousuke Doi

发明人： Akira Miura ,  Kenji Uchida ,  Katsuya Ikezawa ,  Hiroyuki Matsuura ,  Akira Toyama ,  Toshiaki Kobayashi ,  Tsuyoshi Yakihara ,  Kousuke Doi

IPC分类号： G02F1/03

CPC分类号： G02F1/0123 ,  G02F1/2255 ,  G02F2001/212 ,  G02F2202/20 ,  G02F2203/21

摘要： A light modulation apparatus including a Mach-Zehnder type light modulator, a driver for modulator outputting a control signal according to an input electric signal, a light branching circuit branching the output light signal, and a bias control circuit applying a bias voltage to the light modulator based on the branched light signal, the apparatus further comprises: a burst pause state detection circuit detecting a pause state of a burst signal included in the input electric signal; a photoelectric transducer converting an output light signal branched by the light branching circuit into an electric signal; a sampling circuit extracting the electric signal converted while the pause state is detected by the burst pause state; and a bias voltage adjustment circuit adjusting a bias voltage value of the bias voltage based on a voltage level of the extracted electric signal.

公开(公告)号：US20060225918A1

公开(公告)日：2006-10-12

申请号：US11376556

申请日：2006-03-16

申请人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida ,  Mamoru Mita

发明人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida ,  Mamoru Mita

IPC分类号： H05K7/00 ,  H05K3/30

CPC分类号： H01L21/486 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68345 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.

摘要翻译： 电子器件基板设置有薄板芯基板; 金属电极，其设置在所述芯基板上并电连接到要封装在其上的电子部件的电极; 以及电绝缘层，电绝缘层上安装有电子部件，并且设置成围绕金属电极。

公开(公告)号：US20050073317A1

公开(公告)日：2005-04-07

申请号：US10959503

申请日：2004-10-07

申请人： Kouichi Yamamoto ,  Satoshi Ishikawa ,  Kenji Uchida ,  Toshihiro Katsuta

发明人： Kouichi Yamamoto ,  Satoshi Ishikawa ,  Kenji Uchida ,  Toshihiro Katsuta

IPC分类号： G01R31/02 ,  B60L3/00 ,  G01R27/02 ,  G01R27/18 ,  G01R35/00 ,  G01R31/00

CPC分类号： G01R35/00 ,  G01R27/18 ,  G01R31/025

摘要： An insulation resistance drop detector 50 and a method of detecting a state of malfunction of the detector 50 are provided. When open of a coupling capacitor Co or malfunction of a low pass filter 53 is occurred, a time constant of the low pass filter 53 is decreased and a rising time of an output of the low pass filter 53 against an output of a pulse signal P1 becomes shorter than that in a state of normal. Thereby, malfunction of the detector 50 can be detected based on the output of the filter 53 corresponding to change of frequency of the pulse signal P1.

摘要翻译： 提供绝缘电阻降检测器50和检测器50故障状态的方法。 当耦合电容器Co断开或发生低通滤波器53的故障时，低通滤波器53的时间常数减小，低通滤波器53的输出的上升时间相对于脉冲信号P1 变得比正常情况下要短。 因此，可以基于与脉冲信号P1的频率变化对应的滤波器53的输出来检测检测器50的故障。

公开(公告)号：US5970322A

公开(公告)日：1999-10-19

申请号：US4447

申请日：1998-01-08

申请人： Seiji Ichikawa ,  Tomoaki Hirokawa ,  Tomoaki Kimura ,  Taku Sato ,  Junichi Tanaka ,  Kenji Uchida ,  Masatoshi Ohara ,  Takeo Ogihara ,  Satoshi Murata ,  Tsutomu Kubota

发明人： Seiji Ichikawa ,  Tomoaki Hirokawa ,  Tomoaki Kimura ,  Taku Sato ,  Junichi Tanaka ,  Kenji Uchida ,  Masatoshi Ohara ,  Takeo Ogihara ,  Satoshi Murata ,  Tsutomu Kubota

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/565 ,  H01L23/295 ,  H01L23/3135 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181

摘要： An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed.

摘要翻译： 超高频电子元件具有封装在模制树脂封装中的超高频芯片。 超高频电子部件包括在其中包围超高频芯片的第一密封层和在其中包封第一密封层的第二密封层。 第一密封层包含多个空隙或微小的气泡，其有效降低第一密封层的介电常数。 还公开了一种制造超高频电子部件的方法。

公开(公告)号：US5904501A

公开(公告)日：1999-05-18

申请号：US824459

申请日：1997-03-26

申请人： Masatoshi Ohara ,  Takeo Ogihara ,  Satoshi Murata ,  Kenji Uchida ,  Tsutomu Kubota ,  Seiji Ichikawa ,  Tomoaki Hirokawa ,  Tomoaki Kimura ,  Taku Sato ,  Junichi Tanaka

发明人： Masatoshi Ohara ,  Takeo Ogihara ,  Satoshi Murata ,  Kenji Uchida ,  Tsutomu Kubota ,  Seiji Ichikawa ,  Tomoaki Hirokawa ,  Tomoaki Kimura ,  Taku Sato ,  Junichi Tanaka

IPC分类号： H01L23/02 ,  H01L21/00 ,  H01L23/04 ,  H01L23/10 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/67126 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S257/924

摘要： A hollow package manufacturing method includes the adhesive spreading step, the adhesive applying step, and the cap adhering step. In the adhesive spreading step, an adhesive is spread on a circular table to a uniform thickness. In the adhesive applying step, an open end face of a cylindrical cap having a bottom is urged against the circular table to apply the adhesive to the cap. In the cap adhering step, the cap applied with the adhesive is adhered to a case. A hollow package manufacturing apparatus is also disclosed.

摘要翻译： 中空包装制造方法包括粘合剂铺展步骤，粘合剂施加步骤和盖子粘合步骤。 在粘合剂铺展步骤中，将粘合剂铺展在圆桌上以均匀的厚度。 在粘合剂涂布步骤中，具有底部的圆筒形盖的开口端面被推靠在圆台上以将粘合剂施加到盖上。 在盖接合步骤中，将涂有粘合剂的盖子粘附到壳体上。 还公开了一种中空包装制造装置。

公开(公告)号：US5889232A

公开(公告)日：1999-03-30

申请号：US855537

申请日：1997-05-13

申请人： Seiji Ichikawa ,  Tomoaki Hirokawa ,  Tomoaki Kimura ,  Taku Sato ,  Junichi Tanaka ,  Kenji Uchida ,  Masatoshi Ohara ,  Takeo Ogihara ,  Satoshi Murata ,  Tsutomu Kubota

发明人： Seiji Ichikawa ,  Tomoaki Hirokawa ,  Tomoaki Kimura ,  Taku Sato ,  Junichi Tanaka ,  Kenji Uchida ,  Masatoshi Ohara ,  Takeo Ogihara ,  Satoshi Murata ,  Tsutomu Kubota

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/28

CPC分类号： H01L21/565 ,  H01L23/295 ,  H01L23/3135 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181

摘要： An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed.

摘要翻译： 超高频电子元件具有封装在模制树脂封装中的超高频芯片。 超高频电子部件包括在其中包围超高频芯片的第一密封层和在其中包封第一密封层的第二密封层。 第一密封层包含多个空隙或微小的气泡，其有效降低第一密封层的介电常数。 还公开了一种制造超高频电子部件的方法。

公开(公告)号：US5261794A

公开(公告)日：1993-11-16

申请号：US670283

申请日：1991-03-15

申请人： Yukishige Kamino ,  Kenji Uchida ,  Makoto Saito

发明人： Yukishige Kamino ,  Kenji Uchida ,  Makoto Saito

IPC分类号： B65G53/30 ,  E21F3/00 ,  E21F16/00 ,  F04B23/04 ,  F04F1/06 ,  E03B1/00

CPC分类号： E21F3/00 ,  E21F16/00 ,  Y10T137/86461

摘要： A fluid pressure feeding apparatus for feeding cold water for cooling a mining pit into the pit and pumping water and muddy water heated within the mining pit onto the ground. A controller for switching a number of the operative chambers is provided to thereby perform a continuous operation.

摘要翻译： 一种流体压力供给装置，用于将用于冷却采矿坑的冷水送入坑内，将在采矿坑内加热的水和泥浆水泵送到地面上。 提供用于切换多个操作室的控制器，从而执行连续操作。

公开(公告)号：US4725331A

公开(公告)日：1988-02-16

申请号：US885441

申请日：1986-07-14

申请人： Kenji Uchida ,  Eisuke Bannai

发明人： Kenji Uchida ,  Eisuke Bannai

IPC分类号： C30B9/00 ,  C30B23/00

CPC分类号： C30B9/00 ,  C30B29/16 ,  C30B29/62

摘要： A process for producing tin oxide fibers, which comprises forming a melt comprising a solute composed essentially of tin oxide and a solvent selected from the group consisting of copper, a copper alloy, tin or a tin alloy, evaporating the solute from the melt, and introducing the evaporated solute to a low temperature zone, whereby tin oxide fibers are permitted to precipitate and grow in the low temperature zone.

摘要翻译： 一种生产氧化锡纤维的方法，其包括形成熔体，其包含基本上由氧化锡组成的溶质和选自铜，铜合金，锡或锡合金的溶剂，从熔体中蒸发溶质，以及 将蒸发的溶质引入低温区，由此允许氧化锡纤维在低温区沉淀和生长。