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    Semiconductor packages with antennas
    81.
    发明授权
    Semiconductor packages with antennas 有权

    公开(公告)号：US11562971B2

    公开(公告)日：2023-01-24

    申请号：US16843803

    申请日：2020-04-08

    Applicant: Intel Corporation

    Inventor： Telesphor Kamgaing ,  Adel A. Elsherbini ,  Sasha N. Oster

    IPC: H01L23/66 ,  H01L21/48 ,  H01L23/498 ,  H01L23/00 ,  H01Q1/36 ,  H01Q9/04 ,  H01Q9/16 ,  H01Q9/30

    Abstract: In various embodiments, disclosed herein are systems and methods directed to the fabrication of a coreless semiconductor package (e.g., a millimeter (mm)-wave antenna package) having an asymmetric build-up layer count that can be fabricated on both sides of a temporary substrate (e.g., a core). The asymmetric build-up layer count can reduce the overall layer count in the fabrication of the semiconductor package and can therefore contribute to fabrication cost reduction. In further embodiments, the semiconductor package (e.g., a millimeter (mm)-wave antenna packages) can further comprise dummification elements disposed near one or more antenna layers. Further, the dummification elements disposed near one or more antenna layers can reduce image current and thereby increasing the antenna gain and efficiency.

    Switched closed loop read-out methods and systems for resonant sensing platforms
    82.
    发明授权
    Switched closed loop read-out methods and systems for resonant sensing platforms 有权

    公开(公告)号：US11221354B2

    公开(公告)日：2022-01-11

    申请号：US15201144

    申请日：2016-07-01

    Applicant: Intel Corporation

    Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Feras Eid ,  Ian A. Young

    IPC: G01R23/02 ,  G01D5/00 ,  H01L23/00 ,  G01D18/00 ,  G01P15/097

    Abstract: Embodiments of the invention include a resonant sensing system comprising driving circuitry to generate a drive signal during excitation time periods, a first switch coupled to the driving circuitry, and a sensing device coupled to the driving circuitry via the first switch during the excitation time periods. The sensing device includes beams to receive the drive signal during a first excitation time period that causes the beams to mechanically oscillate and generate a first induced electromotive force (emf) in response to the drive signal. The first switch decouples the sensing device and the driving circuitry during measurement time periods for measurement of the induced emf.

    Substrate dielectric waveguides in semiconductor packages
    84.
    发明授权
    Substrate dielectric waveguides in semiconductor packages 有权

    公开(公告)号：US11037892B2

    公开(公告)日：2021-06-15

    申请号：US16465545

    申请日：2016-12-30

    Applicant: Intel Corporation

    Inventor： Vijay K. Nair ,  Sasha N. Oster ,  Johanna M. Swan ,  Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Adel A. Elsherbini

    IPC: H01L23/66 ,  H01L23/538 ,  H01P3/16

    Abstract: Waveguides disposed in either an interposer layer or directly in the semiconductor package substrate may be used to transfer signals between semiconductor dies coupled to the semiconductor package. For example, inter-semiconductor die communications using mm-wave carrier signals launched into waveguides specifically tuned to optimize transmission parameters of such signals. The use of such high frequencies beneficially provides for reliable transmission of modulated high data rate signals with lower losses than conductive traces and less cross-talk. The use of mm-wave waveguides provides higher data transfer rates per bump for bump-limited dies as well as beneficially providing improved signal integrity even at such higher data transfer rates. Such mm-wave waveguides may be built directly into semiconductor package layers or may be incorporated into one or more interposed layers that are physically and communicably coupled between the semiconductor dies and the semiconductor package substrate.

    Process for creating piezo-electric mirrors in package
    85.
    发明授权
    Process for creating piezo-electric mirrors in package 有权

    公开(公告)号：US10969574B2

    公开(公告)日：2021-04-06

    申请号：US16072157

    申请日：2016-04-01

    Applicant: Intel Corporation

    Inventor： Sasha N. Oster ,  Feras Eid ,  Johanna M. Swan ,  Shawna M. Liff ,  Aleksandar Aleksov ,  Thomas L. Sounart ,  Baris Bicen ,  Valluri R. Rao

    IPC: G02B26/00 ,  G02B26/08 ,  H01L41/047 ,  H01L41/27 ,  H01L41/314 ,  H01L41/332

    Abstract: Embodiments of the invention include a piezo-electric mirror in an microelectronic package and methods of forming the package. According to an embodiment the microelectronic package may include an organic substrate with a cavity formed in the organic substrate. In some embodiments, an actuator is anchored to the organic substrate and extends over the cavity. For example, the actuator may include a first electrode and a piezo-electric layer formed on the first electrode. A second electrode may be formed on the piezo-electric layer. Additionally, a mirror may be formed on the actuator. Embodiments allow for the piezo-electric layer to be formed on an organic package substrate by using low temperature crystallization processes. For example, the piezo-electric layer may be deposited in an amorphous state. Thereafter, a laser annealing process that includes a pulsed laser may be used to crystallize the piezo-electric layer.

    Channelization for dispersion limited waveguide communication channels
    90.
    发明授权
    Channelization for dispersion limited waveguide communication channels 有权

    公开(公告)号：US10277322B2

    公开(公告)日：2019-04-30

    申请号：US15965637

    申请日：2018-04-27

    Applicant: Intel Corporation

    Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Emanuel Cohen

    IPC: H04B10/00 ,  H04B10/2575 ,  H04B10/2513 ,  H04J14/00

    Abstract: Embodiments of the present disclosure may relate to a transmitter to transmit a radio frequency (RF) signal to a receiver via a dielectric waveguide where the transmitter includes a plurality of mixers to generate modulated RF signals and a combiner to combine the modulated RF signals. Embodiments may also include a receiver to receive, from a dielectric waveguide, a RF signal where the receiver includes a splitter to split the RF signal into a plurality of signal paths, a plurality of filters, and a plurality of demodulators. Embodiments may also include a dielectric waveguide communication apparatus that may include the transmitter and the receiver. Other embodiments may be described and/or claimed.

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