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公开(公告)号：US20190154340A1
公开(公告)日：2019-05-23
申请号：US16257584
申请日：2019-01-25
发明人： Paul W. Coteus , Shawn A. Hall , Mark D. Schultz , Todd E. Takken , Shurong Tian
IPC分类号： F28D1/03 , H01L21/48 , H01L23/473 , F28F3/02
摘要： An method for forming a cooling apparatus for cooling an electronic component. The apparatus has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.
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公开(公告)号：US09922900B2
公开(公告)日：2018-03-20
申请号：US15412379
申请日：2017-01-23
发明人： Mark D. Schultz , Todd E. Takken , Shurong Tian , Yuan Yao
IPC分类号： H01L23/367 , H01L25/065 , H01L23/10 , H01L25/10
CPC分类号： H01L23/3675 , H01L21/4882 , H01L23/10 , H01L23/345 , H01L23/36 , H01L25/0655 , H01L25/105 , H01L25/50
摘要： A heat source (single semiconductor chip or group of closely spaced semiconductor chips of similar height) is provided on a first side of a substrate, which substrate has on said first side a support member comprising a compressible material. A heat removal component, oriented at an angle to said heat source, is brought into proximity of said heat source such that said heat removal component contacts said support member prior to contacting said heat source. Said heat removal component is assembled to said heat source such that said support member at least partially absorbs global inequality of force that would otherwise be applied to said heat source, absent said support member comprising said compressible material.
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公开(公告)号：US20170155598A1
公开(公告)日：2017-06-01
申请号：US15430574
申请日：2017-02-13
发明人： Paul W. Coteus , Fuad E. Doany , Shawn A. Hall , Mark D. Schultz , Todd E. Takken , Shurong Tian
IPC分类号： H04L12/933 , H05K7/20
CPC分类号： H04L49/109 , H05K7/20254 , H05K7/20309 , H05K7/20318 , H05K7/20509 , H05K7/20572 , H05K7/20763
摘要： A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.
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公开(公告)号：US20170102273A1
公开(公告)日：2017-04-13
申请号：US15393710
申请日：2016-12-29
CPC分类号： G01K7/427 , G01K7/02 , G01K15/005 , G01K2007/422
摘要： A method includes determining a relationship between indirect thermal data for a processor and a measured temperature associated with the processor, during a calibration process, obtaining the indirect thermal data for the processor during actual operation of the processor, and determining an actual significant temperature associated with the processor during the actual operation using the indirect thermal data for the processor during actual operation of the processor and the relationship.
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公开(公告)号：US09534967B2
公开(公告)日：2017-01-03
申请号：US15154448
申请日：2016-05-13
CPC分类号： G01K7/427 , G01K7/02 , G01K15/005 , G01K2007/422
摘要： A method includes determining a relationship between indirect thermal data for a processor and a measured temperature associated with the processor, during a calibration process, obtaining the indirect thermal data for the processor during actual operation of the processor, and determining an actual significant temperature associated with the processor during the actual operation using the indirect thermal data for the processor during actual operation of the processor and the relationship.
摘要翻译： 一种方法包括在校准过程期间确定处理器的间接热数据与与处理器相关联的测量温度之间的关系，在处理器的实际操作期间获得处理器的间接热数据，以及确定与处理器相关联的实际显着温度 处理器在实际操作期间使用间接热量数据为处理器在处理器的实际操作过程中与之关系。
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公开(公告)号：US20160290727A1
公开(公告)日：2016-10-06
申请号：US14818064
申请日：2015-08-04
发明人： Paul W. Coteus , Shawn A. Hall , Mark D. Schultz , Todd E. Takken , Shurong Tian
CPC分类号： F28D1/0308 , B23K1/0016 , B23P15/26 , B23P2700/10 , F28F3/02 , H01L21/4878 , H01L21/4882 , H01L23/473
摘要： An apparatus for cooling an electronic component has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.
摘要翻译： 用于冷却电子部件的设备具有热能传导材料的平面顶部构件和该材料的平行平面底部构件，平面底部构件包括具有被配置为与电子部件进行热交换接触的区域的表面。 平面顶部构件在多个位置处具有多个冲压的凹陷结构，每个凹陷形成提供接触表面，使得平面顶部构件通过在每个接触表面处的钎焊或焊料固定到底部构件。 或者，平面底部构件还具有与顶部构件的凹陷形成对准的多个冲压凹陷结构。 平面顶部构件通过将平面顶部构件的凹陷结构的每个相应接触表面钎焊或焊接到平行平面底部构件的相应凹陷形式的相对接触表面而固定到底部构件。
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公开(公告)号：US20160091260A1
公开(公告)日：2016-03-31
申请号：US14500541
申请日：2014-09-29
发明人： Mark D. Schultz
摘要： Heat sinks and methods of using the same include a top and bottom plate, at least one of which has a plurality of pin contacts flexibly connected to one another, where the plurality of pin contacts have vertical and lateral flexibility with respect to one another; and pin slice layers, each having multiple pin slices, arranged vertically between the top and bottom plates such that the plurality of pin slices form substantially vertical pins connecting the top and bottom plates.
摘要翻译： 散热器及其使用方法包括顶板和底板，其中至少一个具有彼此柔性连接的多个销触头，其中多个销触点相对于彼此具有垂直和侧向的柔性; 以及每个具有多个引脚切片的引脚切片层，其垂直地布置在顶板和底板之间，使得多个销片形成连接顶板和底板的大致垂直的销。
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