公开(公告)号：US06236424B1

公开(公告)日：2001-05-22

申请号：US09650818

申请日：2000-08-30

Applicant: Jun Nakamura

Inventor： Jun Nakamura

IPC: B41J2335

Abstract: A thick film thermal head for making a stencil by thermally perforating a stencil material includes an electrical insulating substrate and a glaze layer superposed on a heat radiating plate in this order, a resistance heater formed on the glaze layer to continuously extend in a main scanning direction, a plurality of electrodes of at least two lines which extend in a direction intersecting the main scanning direction in contact with the resistance heater and are alternately arranged in the main scanning direction, and a protective layer which covers exposed part of the resistance heater and the electrodes. The resistance heater is not smaller than 1 &mgr;m and not larger than 10 &mgr;m in thickness, the space between each pair of adjacent electrodes in the main scanning direction is not smaller than 20% and not larger than 60% of the center distance between the adjacent electrodes, and the length in the sub-scanning direction of the resistance heater at the portion between each pair of adjacent electrodes is not smaller than 100% and not larger than 250% of the center distance between the adjacent electrodes.

公开(公告)号：US6099285A

公开(公告)日：2000-08-08

申请号：US225686

申请日：1999-01-06

Applicant: Fumio Kurihara ,  Mitsuyoshi Kumamoto ,  Yasuhito Ito ,  Masanobu Nagano ,  Jun Nakamura

Inventor： Fumio Kurihara ,  Mitsuyoshi Kumamoto ,  Yasuhito Ito ,  Masanobu Nagano ,  Jun Nakamura

IPC: B29C35/04 ,  B29C35/08 ,  B29C35/16 ,  B29C49/04 ,  B29C49/20 ,  B29C49/48 ,  B29C49/78 ,  B29C49/64

CPC classification number: B29C49/4823 ,  B29C49/20 ,  B29C49/78 ,  B29C49/783 ,  B29C2035/1616 ,  B29C2035/1658 ,  B29C2049/2008 ,  B29C2049/2402 ,  B29C2049/4876 ,  B29C35/041 ,  B29C35/045 ,  B29C35/049 ,  B29C35/08 ,  B29C49/04 ,  B29K2105/04 ,  Y10S264/904

Abstract: A process and an apparatus for molding, in which a molten thermoplastic resin is firmly fitted onto a molding surface of a mold under a pressure lower than or equal to 100 kg/cm.sup.2 and is cured to obtain a molded product. The molding apparatus has a mold main body, and a mold body on which the molding surface is defined. The mold body is supported relative to the mold main body with maintaining a space on the back side of the molding surface in a heat insulative manner by a supporting member which includes at least a heat insulative supporting member having a thermal conductivity of 0.001 to 1 Kcal/mh .degree.C. and a longitudinal elastic modulus of 0.01 to 10 kg/cm.sup.2. In the space, a heating fluid for heating the molding surface from the bask side to a temperature higher than or equal to Vicat softening temperate (T) .degree.C. of the thermoplastic resin and a cooling fluid for cooling the molding surface from the back side to a temperature lower than or equal to (Vicat softening temperature (T) of the thermoplastic resin -10) .degree.C. are supplied.

公开(公告)号：US6068209A

公开(公告)日：2000-05-30

申请号：US151694

申请日：1993-11-15

Applicant: Jun Nakamura

Inventor： Jun Nakamura

IPC: B41L13/04 ,  B65B41/00 ,  B65B41/12 ,  B65B41/16 ,  B65H16/00 ,  B65H23/06 ,  B65H18/28 ,  B65H26/00

CPC classification number: B65H23/063 ,  B65H16/00 ,  B65H2511/142 ,  B65H2515/322 ,  Y10S242/912

Abstract: In a sheet pay-out device for paying out a sheet from a sheet roll, the sheet roll is subjected to a rotational resistance which increases with the diminishing outer diameter of the sheet roll as the sheet is paid out therefrom so that the tension acting upon the sheet may be kept at a substantially constant level over the entire length of the sheet, and a favorable feeding action for the sheet is ensured. The information on the current outer diameter of the sheet roll is preferably printed on the sheet as an optical code. This device is suitable for use as a stencil master plate sheet feeding unit of a stencil printer equipped with the function of making stencil master plates, for feeding a stencil master plate sheet from a sheet roll.

Abstract translation: 在用于从片材卷支付片材的片材付出装置中，片材辊受到随着片材卷筒外径减小而增加的旋转阻力，因为片材从其中被排出，使得张力作用在 片材可以在片材的整个长度上保持基本上恒定的水平，并且确保了片材的良好的进给动作。 关于片材的当前外径的信息优选作为光学代码印刷在片材上。 该装置适合用作具有制作模版母板功能的模版印刷机的模板母版片材进给单元，用于从纸卷供给模版母板。

公开(公告)号：US5993721A

公开(公告)日：1999-11-30

申请号：US931522

申请日：1997-09-16

Applicant: Fumio Kurihara ,  Mitsuyoshi Kumamoto ,  Yasuhito Ito ,  Masanobu Nagano ,  Jun Nakamura

Inventor： Fumio Kurihara ,  Mitsuyoshi Kumamoto ,  Yasuhito Ito ,  Masanobu Nagano ,  Jun Nakamura

IPC: B29C35/04 ,  B29C35/08 ,  B29C35/16 ,  B29C49/04 ,  B29C49/20 ,  B29C49/48 ,  B29C49/78 ,  B29C49/64

CPC classification number: B29C49/4823 ,  B29C49/20 ,  B29C49/78 ,  B29C49/783 ,  B29C2035/1616 ,  B29C2035/1658 ,  B29C2049/2008 ,  B29C2049/2402 ,  B29C2049/4876 ,  B29C35/041 ,  B29C35/045 ,  B29C35/049 ,  B29C35/08 ,  B29C49/04 ,  B29K2105/04 ,  Y10S264/904

Abstract: A process and an apparatus for molding, in which a molten thermoplastic resin is firmly fitted onto a molding surface of a mold under a pressure lower than or equal to 100 kg/cm.sup.2 and is cured to obtain a molded product. The molding apparatus has a mold main body, and a mold body on which the molding surface is defined. The mold body is supported relative to the mold main body with maintaining a space on the back side of the molding surface in a heat insulative manner by a supporting member which includes at least a heat insulative supporting member having a thermal conductivity of 0.001 to 1 Kcal/mh.degree. C. and a longitudinal elastic modulus of 0.01 to 10 kg/cm.sup.2. In the space, a heating fluid for heating the molding surface from the back side to a temperature higher than or equal to Vicat softening temperature (T).degree. C. of the thermoplastic resin and a cooling fluid for cooling the molding surface from the back side to a temperature lower than or equal to (Vicat softening temperature (T) of the thermoplastic resin-10).degree. C. are supplied.

Abstract translation: 一种成型方法和成型装置，其中熔融热塑性树脂在低于或等于100kg / cm 2的压力下牢固地装配在模具的模制表面上并固化以获得模塑产品。 成型装置具有模具主体和限定成型面的模具主体。 模具主体通过支撑构件以热绝缘的方式在模制表面的后侧保持空间来支撑，该支撑构件至少包括导热率为0.001至1Kcal的绝热支撑构件 / mh℃，纵向弹性模量为0.01〜10kg / cm 2。 在该空间中，用于将模制表面从背面加热到高于或等于热塑性树脂的维卡软化温度（T）℃的温度的加热流体和用于从后侧冷却模制表面的冷却流体 提供低于或等于（热塑性树脂-10）维氏软化温度（T））的温度。

公开(公告)号：US5526032A

公开(公告)日：1996-06-11

申请号：US851641

申请日：1992-03-16

Applicant: Jun Nakamura

Inventor： Jun Nakamura

IPC: B41C1/055 ,  B41J2/375 ,  B41J3/24 ,  B41J2/325 ,  B41J2/355

CPC classification number: B41J2/3555 ,  B41J2/375 ,  B41J3/24 ,  B41J2202/32

Abstract: In processing a stencil master plate by making perforations in the manner of a dot matrix on a heat sensitive film of a thermal stencil master plate by using a thermal head having plural minute heat elements, perforations in a solid dark region of the dot matrix are omitted at a prescribed ratio if the dark region extends over 3.times.3 dots or larger, except for a peripheral part of the region. Through appropriate control of the amount of ink that passes through the perforations at the time of printing, and prevention of the blockage of the perforations achieved by thus optimizing the distribution of the perforations, offsetting, unevenness in density, and other problems detrimental to a favorable print quality may be eliminated without regard to the pattern of the original images.

Abstract translation: 在通过使用具有多个分钟的热元件的热​​敏头在热模版母版的热敏膜上以点阵​​的方式进行穿孔来处理模版母板时，点阵的实心暗区中的穿孔被省略 如果暗区域延伸超过3×3点或更大，则除了该区域的外围部分之外，以规定的比例。 通过适当地控制在印刷时通过穿孔的油墨的量，并且防止由于优化孔的分布，偏移，密度不均匀等优化实现的穿孔的堵塞以及其它有利的冲击的问题 可以消除打印质量，而不考虑原始图像的图案。

公开(公告)号：US5297287A

公开(公告)日：1994-03-22

申请号：US844494

申请日：1992-03-02

Applicant: Yoshiyuki Miyayama ,  Akira Nakada ,  Jun Nakamura ,  Shoichiro Kasahara

Inventor： Yoshiyuki Miyayama ,  Akira Nakada ,  Jun Nakamura ,  Shoichiro Kasahara

IPC: G06F1/24

CPC classification number: G06F1/24

Abstract: The present invention provides a reset circuit with two different threshold input voltages. The reset circuit of the present invention is located within a processor, and is designed to control the reset functions of both the processor and the chips located peripheral to the processor. The reset circuit includes a first buffer with a first threshold voltage level. The input of the first buffer is connected to a reset signal and the output of the first buffer is connected to control the reset function of at least one chip that is peripheral to the processor. A second buffer is provided with a second threshold voltage level that is higher than the first threshold voltage level. The input of the second buffer is connected to the reset signal and the output of the second buffer is connected to control the reset function of the processor. The reset circuit guarantees that the processor is reset after the peripheral chips subsequent to power up.

Abstract translation: 本发明提供具有两个不同阈值输入电压的复位电路。 本发明的复位电路位于处理器内，并被设计成控制处理器和位于处理器周边的芯片的复位功能。 复位电路包括具有第一阈值电压电平的第一缓冲器。 第一缓冲器的输入连接到复位信号，并且第一缓冲器的输出被连接以控制处理器外围的至少一个芯片的复位功能。 第二缓冲器被提供有高于第一阈值电压电平的第二阈值电压电平。 第二缓冲器的输入连接到复位信号，第二缓冲器的输出被连接以控制处理器的复位功能。 复位电路保证处理器在上电后的外围芯片之后复位。

公开(公告)号：US09514895B2

公开(公告)日：2016-12-06

申请号：US13989042

申请日：2011-12-08

Applicant: Nobuyuki Naganawa ,  Masamitsu Tononishi ,  Shinsuke Yoshitake ,  Yasunori Okuno ,  Masakazu Tsutsumi ,  Hajime Kawamoto ,  Tomonori Kishimoto ,  Jun Nakamura ,  Toshiyuki Nukuda

Inventor： Nobuyuki Naganawa ,  Masamitsu Tononishi ,  Shinsuke Yoshitake ,  Yasunori Okuno ,  Masakazu Tsutsumi ,  Hajime Kawamoto ,  Tomonori Kishimoto ,  Jun Nakamura ,  Toshiyuki Nukuda

IPC: H01M2/22 ,  H01G11/70 ,  H01M2/26 ,  H01M10/04 ,  H01M4/70 ,  H01G11/82

CPC classification number: H01G11/70 ,  H01G11/82 ,  H01M2/22 ,  H01M2/263 ,  H01M4/70 ,  H01M10/0413 ,  H01M10/0431 ,  H01M2220/20 ,  Y02E60/13 ,  Y02T10/7022

Abstract: Provided are an electric storage device in which a current collector is not easily broken even when vibration is applied, and a vehicle having this electric storage device. This electric storage device includes a case having a first inner surface and a second inner surface adjacent to the first inner surface, an electrode assembly housed in the case and including a positive electrode plate and a negative electrode plate insulated from each other, an electrode terminal disposed outside the case, and a current collector housed in the case and electrically connecting the electrode assembly and the electrode terminal to each other. A distal end edge of a distal end portion of the current collector is supported on the first inner surface of the case.

Abstract translation: 提供一种其中集电体即使施加振动也不容易断裂的蓄电装置，以及具有该蓄电装置的车辆。 这种蓄电装置包括具有与第一内表面相邻的第一内表面和第二内表面的壳体，容纳在壳体中并且包括彼此绝缘的正极板和负极板的电极组件，电极端子 设置在壳体外部，集电体容纳在壳体中并将电极组件和电极端子彼此电连接。 集电体的前端部的前端缘被支撑在壳体的第一内表面上。

公开(公告)号：US08828590B2

公开(公告)日：2014-09-09

申请号：US13515849

申请日：2011-07-27

Applicant: Masakazu Tstsumi ,  Motoki Hoshino ,  Jun Nakamura ,  Shinsuke Yoshitake ,  Takeshi Sasaki ,  Akihiko Miyazaki

Inventor： Masakazu Tstsumi ,  Motoki Hoshino ,  Jun Nakamura ,  Shinsuke Yoshitake ,  Takeshi Sasaki ,  Akihiko Miyazaki

IPC: H01M2/26 ,  H01M4/02 ,  H01G11/66 ,  H01G11/74

CPC classification number: H01G11/66 ,  H01G11/06 ,  H01G11/24 ,  H01G11/70 ,  H01G11/74 ,  H01G11/84 ,  H01M2/263 ,  H01M10/0431 ,  H01M10/0525 ,  H01M10/058 ,  Y02E60/12 ,  Y02E60/13 ,  Y10T29/417 ,  Y10T29/49108 ,  Y10T29/49117

Abstract: A current collecting member includes first portion second portions. The second portion includes a base portion the first end portion of which is connected to the second end portion of the first portion, a twisted portion the first end portion of which is connected to the second end portion of the base portion, and an insertion portion the first end portion of which is connected to the second end portion of the twisted portion and which is inserted into a winding center of the electrode assembly, so as to be electrically connected to the electrode assembly.

Abstract translation: 电流收集构件包括第一部分第二部分。 第二部分包括其第一端部连接到第一部分的第二端部的基部，其第一端部连接到基部的第二端部的扭曲部分，以及插入部分 其第一端部连接到扭转部分的第二端部并且插入到电极组件的卷绕中心中，以便电连接到电极组件。

公开(公告)号：US08765293B2

公开(公告)日：2014-07-01

申请号：US13336954

申请日：2011-12-23

Applicant: Hajime Kawamoto ,  Masakazu Tsutsumi ,  Jun Nakamura

Inventor： Hajime Kawamoto ,  Masakazu Tsutsumi ,  Jun Nakamura

IPC: H01M2/30

CPC classification number: H01M2/30 ,  H01M2/0426

Abstract: Provided is an electric storage device that can ensure seal in a peripheral area of a portion in a defining wall of a case through which a rivet passes even when a rivet is inserted through the defining wall of the case and the rivet is caulked. The electric storage device includes: an electrode assembly; a case that houses the electrode assembly, the case including a defining wall; and a rivet, wherein a peripheral area of a portion in the defining wall through which the rivet passes has a higher hardness than the remaining area.

Abstract translation: 提供了一种蓄电装置，其能够确保在铆钉穿过壳体的限定壁插入铆钉并且铆钉被铆接时铆钉穿过的壳体的限定壁中的部分的周边区域中的密封。 蓄电装置包括：电极组件; 容纳电极组件的壳体，壳体包括限定壁; 铆钉，其中铆钉通过的限定壁中的部分的周边区域具有比剩余区域更高的硬度。

公开(公告)号：US08356631B2

公开(公告)日：2013-01-22

申请号：US12677199

申请日：2008-09-09

Applicant: Hiroaki Suzuki ,  Wataru Satoh ,  Jun Nakamura

Inventor： Hiroaki Suzuki ,  Wataru Satoh ,  Jun Nakamura

IPC: F15C1/04

CPC classification number: B41J2/005 ,  B01L3/502715 ,  B01L3/502723 ,  B01L3/50273 ,  B01L3/502738 ,  B01L3/502784 ,  B01L2200/027 ,  B01L2300/161 ,  B01L2400/0424 ,  B01L2400/0427 ,  B41J2002/14395 ,  Y10T137/0391 ,  Y10T137/2191

Abstract: A fluid transport device transports fluid containing electrolytes within a flow channel. At least a portion of the inner walls of the flow channels are hydrophilic from the inlet to the outlet thereof except at at least one valve portion. The device also includes: the valve portions, which are hydrophobic and function to block transport of at least one fluid; electrodes, which are provided at the at least one valve portion and function to reduce the surface tension of the fluid; and air vents, which are provided at the at least one valve portion and function to introduce air in order to block the fluid.

Abstract translation: 流体输送装置在流动通道内输送含有电解质的流体。 除了在至少一个阀部分之外，流动通道的内壁的至少一部分从入口至出口是亲水的。 该装置还包括：阀部分，其是疏水性的并且用于阻止至少一种流体的输送; 电极，其设置在所述至少一个阀部分处，并且具有降低流体的表面张力的功能; 和通气口，其设置在所述至少一个阀部分处，并且用于引入空气以阻塞流体的功能。