Separating Plate for Fuel Cell
    81.
    发明申请
    Separating Plate for Fuel Cell 有权
    燃料电池分离板

    公开(公告)号:US20080131755A1

    公开(公告)日:2008-06-05

    申请号:US11842381

    申请日:2007-08-21

    IPC分类号: H01M2/14

    摘要: A separating plate for a fuel cell includes first and second plates, each provided with a hydrogen channel, an oxygen channel, and a coolant channel. The first and second plates are attached to one another to form a main plate such that the first and second hydrogen, oxygen, and coolant channels compose main hydrogen, oxygen, and coolant channels, respectively. The main hydrogen and oxygen channels are fluidly isolated from each other. Distal ends of the main channels each communicate with a manifold through a communication passageway configured to supply hydrogen, oxygen, or coolant to a corresponding one of the main channels.

    摘要翻译: 一种用于燃料电池的隔板包括第一和第二板,每个板具有氢气通道,氧气通道和冷却剂通道。 第一和第二板彼此附接以形成主板,使得第一和第二氢,氧和冷却剂通道分别构成主要氢,氧和冷却剂通道。 主要的氢气和氧气通道彼此流体隔离。 主通道的远端每个通过构造成将氢气,氧气或冷却剂供应到主通道中的相应一个的连通通道与歧管连通。

    Camera module and manufacturing method thereof
    82.
    发明申请
    Camera module and manufacturing method thereof 有权
    相机模块及其制造方法

    公开(公告)号:US20070269205A1

    公开(公告)日:2007-11-22

    申请号:US11435540

    申请日:2006-05-17

    IPC分类号: G03B17/00

    CPC分类号: G03B17/02

    摘要: The present invention relates to a camera module and a manufacturing method thereof, in which both front and rear directions can be provided by improving the disadvantage of the existing camera module providing only one direction photographing. According to an embodiment of the present invention, the camera module includes first and second image sensor chips whose rear surfaces are adhered by a nonconductive bonding agent so that image region parts face opposite directions, a substrate that is connected to the first image sensor chip using bumps for signal connection and connected to the second image sensor chip using wires for signal connection, a through-hole being formed in the substrate under a region in which the first image sensor chip is mounted, an infrared-shielding filter installed in the through-hole of the substrate, first and second holders disposed on upper and lower sides of the substrate, and first and second lens disposed in the first and second holders, respectively.

    摘要翻译: 相机模块及其制造方法技术领域本发明涉及一种摄像机模块及其制造方法,其中通过改善仅提供一个方向拍摄的现有相机模块的缺点,可以提供前后两个方向。 根据本发明的实施例,相机模块包括第一和第二图像传感器芯片,其后表面通过非导电粘合剂粘附,使得图像区域部分面向相反方向,基板使用第一图像传感器芯片 用于信号连接的凸块,并且使用用于信号连接的导线连接到第二图像传感器芯片,在安装有第一图像传感器芯片的区域下的基板中形成通孔,安装在通孔中的红外线屏蔽滤波器, 设置在基板的上侧和下侧的第一和第二保持器以及分别设置在第一和第二支架中的第一和第二透镜。

    Method for preparation of highly dispersed supported platinum catalyst
    83.
    发明申请
    Method for preparation of highly dispersed supported platinum catalyst 有权
    高分散负载铂催化剂的制备方法

    公开(公告)号:US20070135299A1

    公开(公告)日:2007-06-14

    申请号:US11499083

    申请日:2006-08-04

    IPC分类号: B01J21/18 B01J23/42

    摘要: The present invention relates to a method for synthesizing highly dispersed supported platinum catalyst. More particularly, the present invention relates to a method of synthesizing highly dispersed supported platinum catalyst comprising:dissolving a reducing agent in a solvent to produce a solution, dissolving a platinum chloride to the same solvent; adding a carbon support and platinum in a predetermined ratio to the above mixed solution, agitating the mixture, performing ultrasonic treatment, and performing heat treatment; and adding a HCl solution, agitating the mixture, separating the precipitates via filtration to produce a catalyst, and then washing the catalyst with distilled water, thereby obtaining an active highly dispersed supported platinum catalyst which has excellent electric charge activity, uniformly-sized platinum particles and relatively high specific surface area.

    摘要翻译: 本发明涉及一种合成高分散载体的铂催化剂的方法。 更具体地说,本发明涉及一种合成高度分散的负载铂催化剂的方法,包括:将还原剂溶解在溶剂中以产生溶液,将氯化铂溶解在同一溶剂中; 向上述混合溶液中加入预定比例的碳载体和铂,搅拌混合物,进行超声波处理,进行热处理; 并加入HCl溶液,搅拌混合物,通过过滤分离沉淀物以产生催化剂,然后用蒸馏水洗涤催化剂,从而获得具有优异电荷活性的活性高分散载体的铂催化剂,均匀尺寸的铂颗粒 和比表面积相对较高。

    Method for successively recording data in hybrid digital recorder
    84.
    发明授权
    Method for successively recording data in hybrid digital recorder 失效
    在混合数字录像机中连续记录数据的方法

    公开(公告)号:US07225310B2

    公开(公告)日:2007-05-29

    申请号:US11001997

    申请日:2004-12-01

    申请人: Jong Hyun Lee

    发明人: Jong Hyun Lee

    IPC分类号: G06F12/00

    摘要: A method for successively recording data in a hybrid digital recorder. If an optical disc has no redundant area when a hybrid digital recorder in which an optical disc recorder and an HDD recorder, etc. are integrated in one body records an input data stream on the optical disc, the input data stream is temporarily stored in an HDD. If the optical disc is replaced with a new optical disc, the input data stream is temporarily stored in the HDD, and at the same time the data stream having been temporarily stored in the HDD is read and recorded on the new optical disc at a high speed. If all the data streams temporarily stored in the HDD are read and recorded on the new optical disc, the following data stream is recorded on the new optical disc. Therefore, an external input data stream such as a long-term broadcast program is distributed to a plurality of optical discs, and is stored on the optical discs without generating any lost data.

    摘要翻译: 一种用于在混合数字记录器中连续记录数据的方法。 如果在其中将光盘记录器和HDD记录器等集成在一个主体中的混合数字记录器中的光盘没有冗余区域,则记录光盘上的输入数据流,则将输入数据流临时存储在 硬盘。 如果用新的光盘替换光盘,则将输入数据流临时存储在HDD中,同时将临时存储在HDD中的数据流以高的速度读取并记录在新的光盘上 速度。 如果暂时存储在HDD中的所有数据流被读取并记录在新的光盘上,则以下数据流被记录在新的光盘上。 因此,诸如长期广播节目的外部输入数据流被分配到多个光盘,并且被存储在光盘上而不产生任何丢失的数据。

    Wavelength stabilization module having light-receiving element array and method of manufacturing the same
    87.
    发明授权
    Wavelength stabilization module having light-receiving element array and method of manufacturing the same 失效
    具有光接收元件阵列的波长稳定模块及其制造方法

    公开(公告)号:US07012939B2

    公开(公告)日:2006-03-14

    申请号:US10648238

    申请日:2003-08-27

    IPC分类号: H01S3/13 G01B9/02

    CPC分类号: H04B10/572

    摘要: A wavelength stabilization module having a light-receiving element array and a method of manufacturing the same are disclosed. The wavelength stabilization module having a laser diode which irradiates a laser beam at the front side and the rear side thereof comprises a collimator for paralleling the laser beam irradiated at the rear side; a beam splitter for splitting the laser beam passed through the collimator into the two directional laser beams; a light-receiving element for receiving one of the split laser beams; a filter for transmitting a specific wavelength of the other of the split laser beams; a light-receiving element array for receiving the laser beam passed through the filter; and a controller for controlling the output wavelength of the laser diode by using the signals output from the light-receiving element and the light-receiving element array, and the filter and the light-receiving element array are tilted at a predetermined angle with respect to the laser beam and lock the wavelength by using an incident angle dependency of the laser beam passed through the filter.

    摘要翻译: 公开了具有光接收元件阵列的波长稳定模块及其制造方法。 具有在其前侧和后侧照射激光束的激光二极管的波长稳定模块包括用于与在后侧照射的激光束并联的准直器; 用于将穿过准直器的激光束分成两个定向激光束的分束器; 用于接收所述分离激光束中的一个的光接收元件; 用于传输另一个分离激光束的特定波长的滤波器; 用于接收通过过滤器的激光束的光接收元件阵列; 以及控制器,用于通过使用从光接收元件和光接收元件阵列输出的信号来控制激光二极管的输出波长,并且滤光器和光接收元件阵列相对于 激光束并通过使用通过过滤器的激光束的入射角依赖性来锁定波长。

    Fine inductor having 3-dimensional coil structure and method for producing the same
    88.
    发明授权
    Fine inductor having 3-dimensional coil structure and method for producing the same 有权
    具有3维线圈结构的精细电感器及其制造方法

    公开(公告)号:US06292084B1

    公开(公告)日:2001-09-18

    申请号:US09136613

    申请日:1998-08-20

    IPC分类号: H01F500

    CPC分类号: H01F5/003 H01F17/0033

    摘要: A fine inductor having a 3-dimensional coil structure is disclosed. The inductor includes an insulating layer having a groove, a plurality of first conductive patterns wherein the respective first conductive patterns cover bottom and both walls of the groove formed in the insulating layer, both ends of the respective first conductive patterns are extended over upper surface of both sides of the groove, and each of the first conductive patterns is disposed at a predetermined space between adjacent first conductive patterns, and a plurality of second conductive patterns wherein one ends of the respective second conductive patterns are connected to the one ends of the first conductive patterns extended over upper surface and the other ends of the respective second conductive patterns are connected to the other ends of the adjacent first conductive patterns extended over upper surface, thereby forming a coil structure together with the first conductive patterns.

    摘要翻译: 公开了具有3维线圈结构的精细电感器。 电感器包括具有凹槽的绝缘层,多个第一导电图案,其中相应的第一导电图案覆盖形成在绝缘层中的凹槽的底部和两个壁,各个第一导电图案的两个端部延伸到 沟槽的两侧,并且每个第一导电图案设置在相邻的第一导电图案之间的预定空间处,以及多个第二导电图案,其中各个第二导电图案的一端连接到第一导电图案的一端 在上表面延伸的导电图案和相应的第二导电图案的另一端连接到在上表面上延伸的相邻的第一导电图案的另一端,从而与第一导电图案一起形成线圈结构。

    Layer-type ball grid array semiconductor package and fabrication method thereof
    89.
    发明授权
    Layer-type ball grid array semiconductor package and fabrication method thereof 有权
    层状球栅阵列半导体封装及其制造方法

    公开(公告)号:US06172423B2

    公开(公告)日:2001-01-09

    申请号:US09182195

    申请日:1998-10-30

    申请人: Jong Hyun Lee

    发明人: Jong Hyun Lee

    IPC分类号: H01L2348

    摘要: A layer-type ball grid array (BGA) semiconductor package, module and methods of manufacturing same is provided that expands the capability of the package in a limited area. The BGA semiconductor package and method of manufacturing same includes a substrate having a cavity formed therein and an interconnection pattern layer that has a plurality of conductive interconnections forming electric channels between or electrically coupling upper and lower surfaces of the substrate is attached to an external surface of the substrate. The interconnection pattern layer extends from the upper surface to the lower surface of the substrate. A semiconductor chip is provided in bottom of the cavity and a plurality of conductive wires electrically couple the semiconductor chip to one of the conductive interconnections. A molding part fills in the cavity for sealing the semiconductor chip and wires. A plurality of solder balls are correspondingly attached to the conductive interconnections of the interconnection pattern layer formed on the lower surface of the substrate.

    摘要翻译: 提供了层状球栅阵列(BGA)半导体封装,模块及其制造方法,其在有限的区域内扩展了封装的能力。 BGA半导体封装及其制造方法包括其中形成有腔的衬底和在衬底的上表面和下表面之间形成电通道或电耦合衬底的上表面和下表面的多个导电互连的互连图案层附接到 底物。 互连图案层从基板的上表面延伸到下表面。 半导体芯片设置在空腔的底部,并且多个导线将半导体芯片电耦合到导电互连之一。 模制部件填充用于密封半导体芯片和电线的空腔。 多个焊球对应地连接到形成在基板的下表面上的互连图案层的导电互连。