摘要:
A cooling system for an electronic device including a heat generating component within a case, wherein the heat generating component is installed on a bottom plate of the case, the bottom plate has a ventilating hole for air passage formed therein, and a foot portion installed outer surface of the case for maintaining a prescribed vertically opened space below the lower surface of the case.
摘要:
Disclosed are a phosphor pattern which comprises a substrate having unevenness and a phosphor layer formed on the inner surface of a concave portion of the substrate, wherein the phosphor pattern thickness ratio (x)/(y) satisfies a range of 0.1 to 1.5, where when the length from the bottom of the concave portion to the top of a convex portion is L (&mgr;m), (x) is a thickness of the phosphor pattern formed on an uneven wall surface at a position of 0.9×L from the bottom of the concave portion toward the top of the convex portion, and (y) is a thickness of the phosphor pattern formed on the uneven wall surface at a position of 0.4×L from the bottom of the concave portion toward the top of the convex portion, and processes for preparing the same.
摘要:
A phosphor pattern for a field emission display panel (FED) is provided. The phosphor pattern is formed by a process whichh comprises the steps of: (I) forming (A) a photosensitive resin composition layer containing a phosphor on a substrate to which a conductive layer is formed; (II) selectively irradiating active light to (A) the photosensitive resin composition layer containing a phosphor, for forming a pattern; (III) selectively removing (A) the photosensitive resin composition layer to which active light has been selectively irradiated by development, to form the pattern; and (IV) calcining the pattern to remove an unnecessary portion, to form the phosphor pattern. Also provided ar this process for forming the phosphor pattern, a photosensitive element for a FED and a field emission display panel. In forming the layer on the substrate, the photosensitive resin composition layer can be provided as a layer of a photosensitive element, and the element provided on the substrate such that the layer contacts the substrate.
摘要:
A temperature controlled optical coupling device of the present invention includes an optical coupling substrate (2) carrying metal electrodes (1) on its rear. An electrode substrate (6) carries metal electrodes (3) on its front. A plurality of thermoelectric elements (4) are also carried on the front of the electrode substrate (6) and connected to leads (5). A light emitting element or similar optical element (8) and an optical fiber (7) are mounted on the substrate (2) with their optical axes aligned with each other. Also mounted on the substrate (2) is a thermistor (9) for temperature measurement. The thermoelectric elements (4) are directly connected to the metal electrodes (1) and are connected in series by the metal electrodes (1) and metal electrodes (3). When a voltage is applied between leads (5), a current flows through the thermoelectric elements (4). As a result, the substrate (2) is selectively heated or cooled due to the Peltier effect, controlling the temperature of the thermoelectric elements (4). The structure is small size and low cost and needs a minimum of power for temperature control.
摘要:
An input/output switching circuit comprising a first terminal provided on a first audio/video unit, a first switch coupled to the first terminal for switching an audio/video signal at the first terminal, a second terminal provided on a second audio/video unit, a connection cable coupled between the first and second terminals for bidirectional communication of the audio/video signal between the first and second audio/video units, a second switch, coupled to the second terminal for switching the audio/video signal at the second terminal, a first microcomputer coupled to the first switch for controlling the first switch, a second microcomputer coupled to the second switch for controlling the second switch, a communication line for communicating control data between the first and second microcomputers wherein the control data includes data indicating the state of the first and second switch, such that the first and second microcomputers control the first and second switches in response to the control data to accordingly provide bidirectional communication of the audio/video signal.
摘要:
According to an embodiment, a semiconductor device includes a substrate, a connector, a volatile semiconductor memory element, multiple nonvolatile semiconductor memory elements, and a controller. A wiring pattern includes a signal line that is formed between the connector and the controller and that connects the connector to the controller. On the opposite side of the controller to the signal line, the multiple nonvolatile semiconductor memory elements are aligned along the longitudinal direction of the substrate.
摘要:
According to an embodiment, a semiconductor device includes a substrate, a connector, a volatile semiconductor memory element, multiple nonvolatile semiconductor memory elements, and a controller. A wiring pattern includes a signal line that is formed between the connector and the controller and that connects the connector to the controller. On the opposite side of the controller to the signal line, the multiple nonvolatile semiconductor memory elements are aligned along the longitudinal direction of the substrate.
摘要:
According to an embodiment, a semiconductor device includes a substrate, a connector, a volatile semiconductor memory element, multiple nonvolatile semiconductor memory elements, and a controller. A wiring pattern includes a signal line that is formed between the connector and the controller and that connects the connector to the controller. On the opposite side of the controller to the signal line, the multiple nonvolatile semiconductor memory elements are aligned along the longitudinal direction of the substrate.
摘要:
Provided is an optical coupling structure including an optical semiconductor element including a light receiving/emitting portion, an optical transmission path having an optical axis that intersects the optical axis of the optical semiconductor element at a predetermined angle, and an optical coupling portion configured to convert the optical path between the optical semiconductor element and the optical transmission path and optically couple them. The optical coupling portion is made of a resin that is transparent with respect to a transmitted light, the resin adhering to both at least a portion of the light receiving/emitting portion and at least a portion of the end portion of the optical transmission path, and the optical semiconductor element and the optical transmission path are bonded to each other with the resin itself that constitutes the optical coupling portion.
摘要:
An object of the present invention is to provide novel pharmaceutical compositions using anti-GRP78 antibodies. More particularly, the present invention provides a novel method of cancer treatment using anti-GRP78 antibodies, novel cell growth inhibitors and anticancer agents that contain anti-GRP78 antibodies, as well as novel anti-GRP78 antibodies. The present inventor prepared antitumor antibodies to target GRP78, the localization of which in cancer cells changed to the cell membrane. The inventor successfully obtained an anti-GRP78 antibody that would bind specifically to the cell surface of cancer cells, leading to the accomplishment of the above-mentioned objects.