摘要:
Inspection apparatus and method in which laser source emits a laser beam and a coherence of the laser beam emitted from the laser source is reduced by a coherence reducer. A detector detects light from the sample irradiated with the coherence reduced laser beam and a processor processes a signal outputted from the detector and detects a defect on the sample. The coherence reducer has an optical path which includes a plurality of at least one of optical fibers and glass rods.
摘要:
A method of inspecting a pattern formed on a substrate, comprising the steps of emitting an ultraviolet laser beam from a light source, polarizing the ultraviolet laser beam, scanning the polarized ultraviolet laser beam on a pupil of an objective lens, illuminating a sample with the polarized ultraviolet laser beam after the polarized ultraviolet light beam has passed through the objective lens, analyzing light reflected from the sample as a result of the illuminating step after the reflected light has passed through the objective lens, detecting an image of the sample formed by the analyzed light with a time delay integration sensor, outputting signals corresponding to the detected image of the sample from the time delay integration sensor in parallel, and processing the parallel signals outputted from the time delay integration sensor to detect a defect of a pattern on the sample.
摘要:
As the size of the semiconductor devices decreases, the relative positional difference between a circuit at an exposure area and an alignment mark due to the aberrations and distortions of lenses and the reticle writing error can not be neglected. Images of circuit patterns having a very small size which are laminated are detected using lights having two different wavelengths. Alignment error is calculated from the relationship between the phase difference of images and the alignment error at each wavelength. The alignment error which affects the yield can be detected by directly measuring the alignment error of the circuit in the exposure area including the influence of the aberrations and distortions of lenses and the reticle writing error. Proper correction and improvement of the exposure apparatus can be achieved at early phase prior to electrical test.
摘要:
In a method and apparatus for detecting pattern defects, a UV laser is focused on a pupil of an objective lens and scanned; the focused and scanned UV lens illuminates a specimen on which patterns are formed; the specimen illuminated by the UV laser is imaged: and the resulting image of the specimen is compared with a previously stored reference image. The specimen illuminated by UV light is imaged using an anti-blooming time delay integration image sensor or a back-illumination time delay integration image sensor; and the resulting specimen image is compared with a previously stored reference image.
摘要:
An alignment method and apparatus for reduction projection type aligner in which the rough detection of reticle position in the reticle alignment process at the time of mounting a reticle and the fine detection of reticle position in the wafer alignment for the alignment between a wafer and the reticle are performed automatically by the same reticle alignment pattern and the same optical alignment detection system. A plurality of one- or two-dimensional Fresnel zone plates having different shapes of diffraction patterns formed outside of a reticle circuit pattern and arranged at a position outward of the entrance pupil of the reduction projection lens are used as a reticle alignment pattern to detect the absolute position of the reticle. The detection field of view of the optical alignment detection system is thus effectively widened to make pattern detection possible with high magnification for an improved detection accuracy. The same reticle alignment pattern and the same optical alignment detection system are used for rough detection of reticle position in reticle alignment and fine detection of reticle position in wafer alignment. In the optical alignment detection system, on the other hand, the image position of the diffraction pattern from the reticle alignment pattern and the image position of the wafer alignment pattern are located at the same distance from the reticle surface.
摘要:
An optical filtering device and an optical inspection apparatus for detecting a defect in a high sensitivity using an optical filtering device which includes a shutter array formed in a two-dimensionally on an optically opaque thin film produced on a SOI wafer and the SOI wafer is removed at portions thereof on the lower side of the shutter patterns to form perforation portions while working electrodes are formed at the remaining portion of the SOI wafer, a glass substrate having electrode patterns formed on the surface thereof and having the shutter array mounted thereon, and a power supply section for supplying electric power to the electrode patterns formed on the glass substrate and the working electrodes of the SOI wafer. And the working electrodes is controlled to cause the shutter patterns to carry out opening and closing movements with respect to the perforation portions to carry out optical filtering.
摘要:
To effectively utilize the polarization property of an inspection subject for obtaining higher inspection sensitivity, for the polarization of lighting, it is necessary to observe differences in the reflection, diffraction, and scattered light from the inspection subject because of polarization by applying light having the same elevation angle and wavelength in the same direction but different polarization. According to conventional techniques, a plurality of measurements by changing polarizations is required to cause a prolonged inspection time period that is an important specification of inspection apparatuses. In this invention, a plurality of polarization states are modulated in micro areas in the lighting beam cross section, images under a plurality of polarized lighting conditions are collectively acquired by separately and simultaneously forming the scattered light from the individual micro areas in the individual pixels of a sensor, whereby inspection sensitivity and sorting and sizing accuracy are improved without reducing throughput.
摘要:
A method of inspecting defects and a device inspecting defects of detecting defects at high sensitivity and high capture efficiency even on various patterns existing on a wafer. In the device of inspecting defects, an illumination optical system is formed of two systems of a coherent illumination of a laser 5 and an incoherent illumination of LEDs 6a, 6b, 6c and 6d, and light paths are divided in a detecting system corresponding to respective illumination light, spatial modulation elements 55a and 55b are arranged to detecting light paths, respectively, scattered light inhibiting sensitivity is shielded by the spatial modulating elements 55a and 55b, scattered light transmitted through the spatial modulation elements 55a and 55b is detected by image sensors 90a and 90b arranged to respective light paths, and images detected by these two image sensors 90a and 90b are subjected to a comparison processing, thereby determining a defect candidate.
摘要:
A defect inspection device, which inspects defects such as foreign materials existing on a specimen on which a circuit pattern of wiring or the like is formed, is provided with an illumination optical system which illuminates a plurality of different areas the specimen with a plurality of linear shaped beams and an image forming optical system that forms images of the plurality of the illuminated areas on a plurality of detectors, and the detectors are configured to receive a plurality of polarization components substantially at the same time and individually, wherein the polarization components are different from each other and are contained in each of the plurality of the optical images formed by the image forming optical system, thereby detecting a plurality of signals corresponding to the polarization components and carrying out the inspection at high speed under a plurality of optical conditions.
摘要:
A method and apparatus for inspecting defects includes emitting an ultraviolet light from an ultraviolet light source, illuminating a specimen with the ultraviolet light in which a polarization condition of the ultraviolet light is controlled, controlling a polarization condition of light reflected from the specimen which is illuminated by the polarization condition controlled ultraviolet light, detecting the light reflected from the specimen, processing the detected light so as to detect defects, and outputting information about the defects. The ultraviolet light source is disposed in a clean environment supplied with clean gas and separated from outside.