公开(公告)号：US07110591B2

公开(公告)日：2006-09-19

申请号：US09819211

申请日：2001-03-28

Applicant: Claus Neubauer ,  Ming Fang

Inventor： Claus Neubauer ,  Ming Fang

IPC: G06K9/00

CPC classification number: H05K13/08 ,  G06K9/3241 ,  G06K9/46 ,  G06K9/4647 ,  G06K9/6212 ,  H05K1/0269 ,  H05K2201/09936

Abstract: A system and method for recognizing markers on, e.g., a PCB (printed circuit board). In one aspect, a system for recognizing a marker in an image comprises an image capture module (14) for extracting image features associated with an input image of a ROI (region of interest) captured through a lens 15, an image processor (16) comprising a first marker recognition processor (17) for recognizing a marker in the input image based on a normalized correlation and a second marker recognition processor (18) for recognizing a marker in the input image based on gray value histograms; a training module 19 for building template images and histograms that are used by the image processor (16) to detect a marker in the input image and a database (20) for indexing and storing trained template images and trained histograms.

Abstract translation: 用于识别例如PCB（印刷电路板）上的标记的系统和方法。 一方面，一种用于识别图像中的标记的系统包括用于提取与通过透镜15捕获的ROI（感兴趣区域）的输入图像相关联的图像特征的图像捕获模块（14），图像处理器（16） 包括用于基于归一化相关性识别所述输入图像中的标记的第一标记识别处理器（17）和用于基于灰度值直方图识别所述输入图像中的标记的第二标记识别处理器（18） 用于构建图像处理器（16）用于检测输入图像中的标记的模板图像和直方图的训练模块19和用于索引和存储训练的模板图像和训练的直方图的数据库（20）。

公开(公告)号：US07084870B2

公开(公告)日：2006-08-01

申请号：US10739733

申请日：2003-12-18

Applicant: Tong Fang ,  Jason Jenn-Kwei Tyan ,  Ming Fang

Inventor： Tong Fang ,  Jason Jenn-Kwei Tyan ,  Ming Fang

IPC: G06T17/00

CPC classification number: H04R25/658 ,  B29C64/00 ,  B33Y80/00 ,  H04R25/552 ,  H04R25/652 ,  H04R2225/77

Abstract: A system and method for modeling binaural shells for hearing aids, wherein the system is configured to load data associated with a first and a second ear shell. The system is further configured to register the data associated with the first and the second ear shells and process the first ear shell. The system is also configured to store data associated with processing the first ear shell and then map the data associated with processing the first ear shell to the second ear shell. Subsequently, the mapped second ear shell is interactively adjusted by an operator to compensate for an inconsistency in the mapped second ear shell.

Abstract translation: 一种用于对用于助听器的双耳壳进行建模的系统和方法，其中所述系统被配置为加载与第一耳壳和第二耳壳相关联的数据。 该系统还被配置为登记与第一和第二耳壳相关联的数据并处理第一耳壳。 该系统还被配置为存储与处理第一耳壳相关联的数据，然后将与将第一耳壳处理相关联的数据映射到第二耳壳。 随后，映射的第二耳壳由操作者交互地调整以补偿映射的第二耳壳中的不一致。

公开(公告)号：US20060127780A1

公开(公告)日：2006-06-15

申请号：US11014542

申请日：2004-12-15

Applicant: Manish Chandhok ,  Ming Fang

Inventor： Manish Chandhok ,  Ming Fang

IPC: G03C5/00 ,  G21K5/00 ,  G03F1/00

CPC classification number: G21K1/062 ,  B82Y10/00 ,  B82Y40/00 ,  G03F1/24 ,  G21K2201/067

Abstract: Methods of forming a microelectronic structure are described. Embodiments of those methods include providing a substrate comprising a first reflective layer disposed on a second reflective layer, wherein the thickness of the first reflective layer and the thickness of the second reflective layer are less than about 100 angstroms, and forming a ruthenium oxide layer on the substrate, wherein the ruthenium oxide layer is about 50 angstroms or less.

Abstract translation: 描述形成微电子结构的方法。 这些方法的实施例包括提供包括设置在第二反射层上的第一反射层的衬底，其中第一反射层的厚度和第二反射层的厚度小于约100埃，并且在 所述基板，其中所述氧化钌层为约50埃或更小。

公开(公告)号：US07001782B1

公开(公告)日：2006-02-21

申请号：US10747824

申请日：2003-12-29

Applicant: Daniel C. Diana ,  Ebrahim Andideh ,  Richard M. Steger ,  Valery Dubin ,  Ming Fang

Inventor： Daniel C. Diana ,  Ebrahim Andideh ,  Richard M. Steger ,  Valery Dubin ,  Ming Fang

IPC: H01L21/00

CPC classification number: H01L21/76802 ,  H01L21/288 ,  H01L21/76877

Abstract: Some embodiments for a method to fill interlayer vias with a suitable metal in a ferroelectric polymer memory die to reduce the step height and improve the thermal and electrical properties of the via. The method uses an electroless plating method to fill the vias, which is compatible with the ferroelectric polymer memory die processing temperature limits. The resulting process produces via fill metal plugs in the ferroelectric memory die, which allows for the deposition of a thin metal layer over the vias, while at the same time improving the electrical and thermal properties of the vias. Other embodiments are described and claimed herein.

Abstract translation: 用于在铁电聚合物存储器管芯中用合适的金属填充层间通孔的方法的一些实施例，以降低台阶高度并改善通孔的热和电特性。 该方法采用化学镀方法填充通孔，这与铁电聚合物记忆芯片加工温度的极限相兼容。 所得到的工艺通过铁电存储器管芯中的填充金属塞产生，其允许在通孔上沉积薄金属层，同时改善通孔的电气和热性能。 在此描述和要求保护的其它实施例。

公开(公告)号：US20050254697A1

公开(公告)日：2005-11-17

申请号：US11010813

申请日：2004-12-13

Applicant: Li Zhang ,  Ming Fang

Inventor： Li Zhang ,  Ming Fang

IPC: G06T5/00 ,  G06K9/00

CPC classification number: G06T7/143 ,  G06T7/11 ,  G06T2207/10081 ,  G06T2207/20132 ,  G06T2207/30064

Abstract: A system and method for ground glass nodule (GGN) segmentation is provided. The method comprises: selecting a point in a medical image, wherein the point is located in a GGN; defining a volume of interest (VOI) around the point, wherein the VOI comprises the GGN; removing a chest wall from the VOI; obtaining an initial state for a Markov random field; segmenting the VOI, wherein the VOI is segmented using the Markov random field; identifying vessels in the volume of interest; segmenting the vessels; and removing segmented vessels from the segmented ground glass nodule.

Abstract translation: 提供了研磨玻璃结节（GGN）分割的系统和方法。 该方法包括：选择医学图像中的点，其中该点位于GGN中; 定义围绕点的感兴趣体积（VOI），其中VOI包括GGN; 从VOI中取出胸壁; 获得马尔科夫随机场的初始状态; 分割VOI，其中使用马尔可夫随机场分割VOI; 识别感兴趣的船只; 分割血管; 并从分段磨玻璃结节去除分段血管。

公开(公告)号：US20050082551A1

公开(公告)日：2005-04-21

申请号：US10691136

申请日：2003-10-21

Applicant: Ming Fang ,  Valery Dubin ,  Daoqiang Lu

Inventor： Ming Fang ,  Valery Dubin ,  Daoqiang Lu

IPC: G02B6/42 ,  H01L21/00 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/60 ,  H01L23/48 ,  H01L23/485 ,  H01L23/52 ,  H01L27/15 ,  H01L29/267 ,  H01L31/12 ,  H01L33/00

CPC classification number: H01L24/16 ,  G02B6/4204 ,  G02B6/4232 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2224/29099

Abstract: The invention provides bumps between a die and a substrate with a height greater than or equal to a height of a waveguide between the die and the substrate. The bumps may be formed on a die prior to that die being singulated from a wafer.

Abstract translation: 本发明提供了一种具有高于或等于管芯和衬底之间的波导高度的管芯和衬底之间的凸起。 在从芯片被切割成晶片之前，可以在模具上形成凸块。

公开(公告)号：US20050063578A1

公开(公告)日：2005-03-24

申请号：US10898511

申请日：2004-07-23

Applicant: Li Zhang ,  Ming Fang

Inventor： Li Zhang ,  Ming Fang

IPC: G06T5/00 ,  G06K9/00

CPC classification number: G06T7/143 ,  G06T7/11 ,  G06T2207/10081 ,  G06T2207/20132 ,  G06T2207/30064

Abstract: A system and method for ground glass nodule (GGN) segmentation is provided. The method comprises: selecting a point in a medical image, wherein the point is located in a GGN; defining a volume of interest (VOI) around the point, wherein the VOI comprises the GGN; removing a chest wall from the VOI; obtaining an initial state for a Markov random field; and segmenting the VOI, wherein the VOI is segmented using the Markov random field.

Abstract translation: 提供了研磨玻璃结节（GGN）分割的系统和方法。 该方法包括：选择医学图像中的点，其中该点位于GGN中; 定义围绕点的感兴趣体积（VOI），其中VOI包括GGN; 从VOI中取出胸壁; 获得马尔科夫随机场的初始状态; 并且对VOI进行分割，其中使用马尔可夫随机场对VOI进行分段。

公开(公告)号：US06586320B2

公开(公告)日：2003-07-01

申请号：US10053109

申请日：2001-11-02

Applicant: Fuchao Wang ,  Ming Fang

Inventor： Fuchao Wang ,  Ming Fang

IPC: H01L213205

CPC classification number: H01L21/28518 ,  H01L21/28061 ,  H01L29/4933 ,  H01L29/7833

Abstract: A silicide having variable internal metal concentration tuned to surface conditions at the interface between the silicide and adjoining layers is employed within an integrated circuit. Higher silicon/metal (silicon-rich) ratios are employed near the interfaces to adjoining layers to reduce lattice mismatch with underlying polysilicon or overlying oxide, thereby reducing stress and the likelihood of delamination. A lower silicon/metal ratio is employed within an internal region of the silicide, reducing resistivity. The variable silicon/metal ratio is achieved by controlling reactant gas concentrations or flow rates during deposition of the silicide. Thinner silicides with less likelihood of delamination or metal oxidation may thus be formed.

公开(公告)号：US06378572B1

公开(公告)日：2002-04-30

申请号：US09819212

申请日：2001-03-28

Applicant: Claus Neubauer ,  Ming Fang

Inventor： Claus Neubauer ,  Ming Fang

IPC: B65B104

CPC classification number: B65B5/103 ,  B65B57/10

Abstract: A method for monitoring a slab filler, including grabbing a dispensing frame from a dispensing side of the slab filler, and grabbing a discharge frame from a discharge side of the slab filler. The method further includes classifying a plurality of cavities in the slab filler according to a correlation between the dispensing frame and at least one template, and classifying the plurality of cavities in the slab filler according to a correlation between the discharge frame and the template.

Abstract translation: 一种用于监测板坯填料的方法，包括从板坯填料的分配侧抓取分配框架，并从板坯填料的排出侧抓取排出框架。 该方法还包括根据分配框架和至少一个模板之间的相关性对板坯填料中的多个空腔进行分类，以及根据排放框架和模板之间的相关性对板坯填料中的多个空腔进行分类。

公开(公告)号：US06350684B1

公开(公告)日：2002-02-26

申请号：US09594868

申请日：2000-06-15

Applicant: Fuchao Wang ,  Ming Fang

Inventor： Fuchao Wang ,  Ming Fang

IPC: H01L2144

CPC classification number: H01L21/28061 ,  H01L29/4933

Abstract: A silicide having variable internal metal concentration tuned to surface conditions at the interface between the silicide and adjoining layers is employed within an integrated circuit. Higher silicon/metal (silicon-rich) ratios are employed near the interfaces to adjoining layers to reduce lattice mismatch with underlying polysilicon or overlying oxide, thereby reducing stress and the likelihood of delamination. A lower silicon/metal ratio is employed within an internal region of the silicide, reducing resistivity. The variable silicon/metal ratio is achieved by controlling reactant gas concentrations or flow rates during deposition of the silicide. Thinner suicides with less likelihood of delamination or metal oxidation may thus be formed.

Abstract translation: 在集成电路内采用具有调整到硅化物和相邻层之间的界面处的表面状态的可变内部金属浓度的硅化物。 在靠近相邻层的界面附近使用更高的硅/金属（富硅）比例，以减少与下面的多晶硅或上覆氧化物的晶格失配，从而减少应力和分层的可能性。 在硅化物的内部区域内采用较低的硅/金属比，降低了电阻率。 可变硅/金属比例通过在硅化物沉积期间控制反应气体浓度或流速来实现。 因此可能形成较少的分层或金属氧化的可能性的较小的自杀。