IN-LINE DEPTH MEASUREMENT OF THRU SILICON VIA
    81.
    发明申请
    IN-LINE DEPTH MEASUREMENT OF THRU SILICON VIA 有权
    通过硅片的在线深度测量

    公开(公告)号:US20100210043A1

    公开(公告)日:2010-08-19

    申请号:US12371724

    申请日:2009-02-16

    IPC分类号: H01L21/66 G06F19/00

    CPC分类号: H01L22/34 H01L2924/3011

    摘要: A system, method and device for measuring a depth of a Through-Silicon-Via (TSV) in a semiconductor device region on a wafer during in-line semiconductor fabrication, includes a resistance measurement trench structure having length and width dimensions in a substrate, ohmic contacts on a surface of the substrate disposed on opposite sides of the resistance measurement trench structure, and an unfilled TSV structure in semiconductor device region having an unknown depth. A testing circuit makes contact with the ohmic contacts and measures a resistance therebetween, and a processor connected to the testing circuit calculates a depth of the trench structure and the unfilled TSV structure based on the resistance measurement. The resistance measurement trench structure and the unfilled TSV are created simultaneously during fabrication.

    摘要翻译: 在线半导体制造期间,用于测量晶片上的半导体器件区域中的硅硅通孔(TSV)的深度的系统,方法和装置包括在衬底中具有长度和宽度尺寸的电阻测量沟槽结构, 设置在电阻测量沟槽结构的相对侧的衬底的表面上的欧姆接触,以及具有未知深度的半导体器件区域中的未填充的TSV结构。 测试电路与欧姆接触件接触并测量它们之间的电阻,连接到测试电路的处理器基于电阻测量来计算沟槽结构的深度和未填充的TSV结构。 在制造期间同时产生电阻测量沟槽结构和未填充TSV。

    BiCMOS devices with a self-aligned emitter and methods of fabricating such BiCMOS devices
    82.
    发明授权
    BiCMOS devices with a self-aligned emitter and methods of fabricating such BiCMOS devices 有权
    具有自对准发射极的BiCMOS器件和制造这种BiCMOS器件的方法

    公开(公告)号:US07709338B2

    公开(公告)日:2010-05-04

    申请号:US11614757

    申请日:2006-12-21

    IPC分类号: H01L21/331

    摘要: A method of fabricating an heterojunction bipolar transistor (HBT) structure in a bipolar complementary metal-oxide-semiconductor (BiCMOS) process selectively thickens an oxide layer overlying a base region in areas that are not covered by a temporary emitter and spacers such that the temporary emitter can be removed and the base-emitter junction can be exposed without also completely removing the oxide overlying the areas of the base region that are not covered by the temporary emitter or spacers. As a result, a photomask is not required to remove the temporary emitter and to expose the base-emitter junction.

    摘要翻译: 在双极互补金属氧化物半导体(BiCMOS)工艺中制造异质结双极晶体管(HBT)结构的方法在未被临时发射极和间隔物覆盖的区域中的基极区域上选择性地增厚氧化物层,使得临时 可以去除发射极,并且可以暴露基极 - 发射极结,而不会完全去除覆盖在未被临时发射极或间隔物覆盖的基极区域的区域上的氧化物。 结果,不需要光掩模去除临时发射体并露出基极 - 发射极结。

    LATERAL CURRENT CARRYING CAPABILITY IMPROVEMENT IN SEMICONDUCTOR DEVICES
    83.
    发明申请
    LATERAL CURRENT CARRYING CAPABILITY IMPROVEMENT IN SEMICONDUCTOR DEVICES 审中-公开
    在半导体器件中的横向电流承载能力改进

    公开(公告)号:US20080308940A1

    公开(公告)日:2008-12-18

    申请号:US12198196

    申请日:2008-08-26

    IPC分类号: H01L23/522

    摘要: A semiconductor structure. The semiconductor structure includes (a) a substrate; (b) a first semiconductor device on the substrate; (c) N ILD (Inter-Level Dielectric) layers on the first semiconductor device, wherein N is an integer greater than one; and (d) an electrically conductive line electrically coupled to the first semiconductor device. The electrically conductive line is adapted to carry a lateral electric current in a lateral direction parallel to an interfacing surface between two consecutive ILD layers of the N ILD layers. The electrically conductive line is present in at least two ILD layers of the N ILD layers. The electrically conductive line does not comprise an electrically conductive via that is adapted to carry a vertical electric current in a vertical direction perpendicular to the interfacing surface.

    摘要翻译: 半导体结构。 半导体结构包括(a)基板; (b)基板上的第一半导体器件; (c)第一半导体器件上的N ILD(层间电介质)层,其中N是大于1的整数; 和(d)电耦合到第一半导体器件的导电线。 导电线适于在平行于N个ILD层的两个连续ILD层之间的界面表面的横向方向上承载横向电流。 导电线路存在于N ILD层的至少两个ILD层中。 导电线不包括适于在垂直于接口表面的垂直方向承载垂直电流的导电通孔。

    Method to build self-aligned NPN in advanced BiCMOS technology
    84.
    发明授权
    Method to build self-aligned NPN in advanced BiCMOS technology 有权
    在先进的BiCMOS技术中构建自对准NPN的方法

    公开(公告)号:US07265018B2

    公开(公告)日:2007-09-04

    申请号:US10711486

    申请日:2004-09-21

    IPC分类号: H01L21/8222

    CPC分类号: H01L29/66242 H01L29/7378

    摘要: The present invention provides a method of forming a self-aligned heterobipolar transistor (HBT) device in a BiCMOS technology. The method includes forming a raised extrinsic base structure by using an epitaxial growth process in which the growth rate between single crystal silicon and polycrystalline silicon is different and by using a low temperature oxidation process such as a high-pressure oxidation (HIPOX) process to form a self-aligned emitter/extrinsic base HBT structure.

    摘要翻译: 本发明提供了一种在BiCMOS技术中形成自对准异双极晶体管(HBT)器件的方法。 该方法包括通过使用其中单晶硅和多晶硅的生长速率不同的外延生长工艺和通过使用诸如高压氧化(HIPOX)工艺的低温氧化工艺形成凸起的外在基体结构来形成 自对准发射极/非本征基极HBT结构。

    Self-aligned raised extrinsic base bipolar transistor structure and method
    89.
    发明授权
    Self-aligned raised extrinsic base bipolar transistor structure and method 失效
    自对准凸极本征双极晶体管结构及方法

    公开(公告)号:US06869852B1

    公开(公告)日:2005-03-22

    申请号:US10707756

    申请日:2004-01-09

    摘要: A method of fabricating a bipolar transistor structure that provides unit current gain frequency (fT) and maximum oscillation frequency (fMAX) improvements of a raised extrinsic base using non-self-aligned techniques to establish a self-aligned structure. Accordingly, the invention eliminates the complexity and cost of current self-aligned raised extrinsic base processes. The invention forms a raised extrinsic base and an emitter opening over a landing pad, i.e., etch stop layer, then replaces the landing pad with a conductor that is converted, in part, to an insulator. An emitter is then formed in the emitter opening once the insulator is removed from the emitter opening. An unconverted portion of the conductor provides a conductive base link and a remaining portion of the insulator under a spacer isolates the extrinsic base from the emitter while maintaining self-alignment of the emitter to the extrinsic base. The invention also includes the resulting bipolar transistor structure.

    摘要翻译: 一种制造双极晶体管结构的方法,其使用非自对准技术建立自对准结构来提供升高的外部基极的单位电流增益频率(fT)和最大振荡频率(fMAX)改善。 因此,本发明消除了当前自对准引起的外在基本过程的复杂性和成本。 本发明形成凸起的非本征基极和在着陆焊盘(即,蚀刻停止层)上开口的发射体,然后用部分转换为绝缘体的导体代替着陆焊盘。 一旦绝缘体从发射极开口移除,就在发射极开口中形成发射极。 导体的未转换部分提供导电基极连接,并且在间隔物下方的绝缘体的剩余部分将外部基极与发射极隔离,同时保持发射极到外部基极的自对准。 本发明还包括所得到的双极晶体管结构。

    Heterojunction bipolar transistor with reduced sub-collector length, method of manufacture and design structure
    90.
    发明授权
    Heterojunction bipolar transistor with reduced sub-collector length, method of manufacture and design structure 有权
    具有减小的集电极长度的异质结双极晶体管,制造方法和设计结构

    公开(公告)号:US09059138B2

    公开(公告)日:2015-06-16

    申请号:US13358180

    申请日:2012-01-25

    摘要: A heterojunction bipolar transistor (HBT) structure, method of manufacturing the same and design structure thereof are provided. The HBT structure includes a semiconductor substrate having a sub-collector region therein. The HBT structure further includes a collector region overlying a portion of the sub-collector region. The HBT structure further includes an intrinsic base layer overlying at least a portion of the collector region. The HBT structure further includes an extrinsic base layer adjacent to and electrically connected to the intrinsic base layer. The HBT structure further includes an isolation region extending vertically between the extrinsic base layer and the sub-collector region. The HBT structure further includes an emitter overlying a portion of the intrinsic base layer. The HBT structure further includes a collector contact electrically connected to the sub-collector region. The collector contact advantageously extends through at least a portion of the extrinsic base layer.

    摘要翻译: 提供异质结双极晶体管(HBT)结构,其制造方法及其设计结构。 HBT结构包括其中具有亚集电极区域的半导体衬底。 HBT结构还包括覆盖子集电极区域的一部分的集电极区域。 HBT结构还包括覆盖集电极区域的至少一部分的本征基极层。 HBT结构还包括与本征基极层相邻并电连接的外部基极层。 HBT结构还包括在外部基极层和副集电极区之间垂直延伸的隔离区。 HBT结构还包括覆盖本征基极层的一部分的发射极。 HBT结构还包括电连接到子集电极区的集电极触点。 收集器触点有利地延伸穿过外部基极层的至少一部分。