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81.发明申请公开(公告)号：US20180054800A1
公开(公告)日：2018-02-22
申请号：US15683687
申请日：2017-08-22
发明人： Jeongho Yeo , Youngbum Kim , Donghan Kim , Yongjun Kwak , Taehyoung Kim , Juho Lee , Younsun Kim , Seunghoon Choi , Sungjin Park , Jinyoung Oh , Youngwoo Kwak
CPC分类号： H04L27/2666 , H04L1/0009 , H04L1/0026 , H04L1/004 , H04L1/0041 , H04L1/0061 , H04L1/0078 , H04L1/1887 , H04L1/20 , H04L5/0035 , H04L5/0042 , H04L5/0044 , H04L5/0053 , H04L5/0057 , H04L5/0092 , H04L5/0094 , H04L5/026 , H04L27/2656 , H04L27/2657 , H04L27/2662 , H04W4/70 , H04W68/02 , H04W72/042 , H04W72/0466 , H04W72/08 , H04W74/006 , H04W74/008 , H04W74/0833 , H04W76/15 , H04W84/10 , H04W84/18
摘要： The present disclosure relates to a communication technique of fusing a 5G communication system for supporting higher data transmission rate beyond a 4G system with an IoT technology and a system thereof. The system may be used for an intelligent service (for example, smart home, smart building, smart city, smart car or connected car, health care, digital education, retail business, security and safety related service, or the like) based on the 5G communication technology and the IoT related technology. The present disclosure discloses a method and apparatus for inserting an index into a code block as a unit in which a channel code is executed and transmitting the same.
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82.发明申请POSITIVE ACTIVE MATERIAL, MANUFACTURING METHOD THEREOF, AND POSITIVE ELECTRODE AND LITHIUM BATTERY INCLUDING THE MATERIAL 审中-公开正极活性材料及其制造方法，以及包括材料的正极和锂电池公开(公告)号：US20160190555A1
公开(公告)日：2016-06-30
申请号：US14806969
申请日：2015-07-23
发明人： Andrei KAPYLOU , Donghan Kim , Jinhwan Park , Jayhyok Song , Sungjin Ahn , Byongyong Yu
摘要： A positive active material including: a core including an overlithiated lithium transition metal oxide, and a coating layer which is disposed on at least a portion of a surface of the core, the coating layer including a polymer having an oxidation potential of about 4.4 volts to about 4.7 volts versus lithium metal. Also a manufacturing method thereof, and a positive electrode and a lithium battery including the positive active material.
摘要翻译： 一种正极活性物质，包括：包含重叠的锂过渡金属氧化物的核心和设置在芯部的至少一部分表面上的涂层，所述涂层包括具有约4.4伏至 约4.7伏对锂金属。 还有其制造方法，以及包括正极活性物质的正极和锂电池。
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83.发明申请COMPOSITE CATHODE ACTIVE MATERIAL, CATHODE AND LITHIUM BATTERY CONTAINING THE COMPOSITE CATHODE ACTIVE MATERIAL 有权复合阴极活性材料，阴极和锂电池，包含复合阴极活性材料公开(公告)号：US20160190550A1
公开(公告)日：2016-06-30
申请号：US14806903
申请日：2015-07-23
发明人： Byungjin Choi , Donghan Kim , Ryounghee Kim , Jinhwan Park
CPC分类号： H01M4/364 , C01G45/1228 , C01G45/125 , C01G45/1264 , C01G53/50 , C01P2002/34 , C01P2002/72 , C01P2004/82 , C01P2006/40 , H01M4/485 , H01M4/505 , H01M4/525 , H01M10/052 , H01M2004/028
摘要： A composite cathode active material including: a first metal oxide having a layered crystal structure; and a second metal oxide having a perovskite crystal structure, wherein the second metal oxide includes a first metal and a second metal that are each 12-fold cubooctahedrally coordinated to oxygen. Also a cathode including the composite cathode material and a lithium battery containing the cathode.
摘要翻译： 一种复合阴极活性材料，包括：具有层状晶体结构的第一金属氧化物; 和具有钙钛矿晶体结构的第二金属氧化物，其中所述第二金属氧化物包括第一金属和第二金属，所述第一金属和第二金属各自与氧一起形成12倍立方体配位。 还有一种包括复合阴极材料的阴极和含有阴极的锂电池。
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公开(公告)号：US20140061890A1
公开(公告)日：2014-03-06
申请号：US14013714
申请日：2013-08-29
发明人： Jung-Do Lee , Taewoo Kang , Donghan Kim , JongBo Shim , Yang-hoon Ahn , SeokWon Lee , Dae-young Choi
IPC分类号： H01L23/34
CPC分类号： H01L23/34 , H01L23/3128 , H01L23/3142 , H01L23/367 , H01L23/42 , H01L23/4334 , H01L23/49827 , H01L25/0652 , H01L2224/13025 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/73253 , H01L2225/06513 , H01L2225/06541 , H01L2225/06589 , H01L2924/15311 , H01L2924/18161
摘要： A semiconductor package may include a semiconductor chip mounted on a substrate, a molding part protecting the semiconductor chip and having a top surface at a substantially equal height to a top surface of the semiconductor chip, a heat exhausting part on the molding part and the semiconductor chip, and an adhesive part between the heat exhausting part and the molding part and between the heat exhausting part and the semiconductor chip. An interface between the heat exhausting part and the adhesive part has a concave-convex structure.
摘要翻译： 半导体封装可以包括安装在基板上的半导体芯片，保护半导体芯片并具有与半导体芯片的顶表面大致相同高度的顶表面的模制部件，模制部件上的热排出部分和半导体 散热部和模制部之间以及排热部和半导体芯片之间的粘接部。 散热部与粘接部之间的界面具有凹凸结构。
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