公开(公告)号：US20160190291A1

公开(公告)日：2016-06-30

申请号：US15063883

申请日：2016-03-08

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Kosei NODA ,  Toshinari SASAKI

IPC: H01L29/66 ,  H01L29/49 ,  H01L21/02 ,  H01L29/40 ,  H01L21/465 ,  H01L21/66 ,  H01L21/477 ,  H01L29/786

CPC classification number: H01L29/66969 ,  H01L21/02164 ,  H01L21/465 ,  H01L21/477 ,  H01L22/10 ,  H01L29/401 ,  H01L29/4908 ,  H01L29/78603 ,  H01L29/7869

Abstract: A transistor with superior electric characteristics is manufactured. An oxide insulating film is formed over a substrate, an oxide semiconductor film is formed over the oxide insulating film, heat treatment is then conducted at a temperature at which hydrogen contained in the oxide semiconductor film is desorbed and part of oxygen contained in the oxide insulating film is desorbed, then the heated oxide semiconductor film is etched into a predetermined shape to form an island-shaped oxide semiconductor film, a pair of electrodes is formed over the island-shaped oxide semiconductor film, a gate insulating film is formed over the pair of electrodes and the island-shaped oxide semiconductor film, and a gate electrode is formed over the gate insulating film.

Abstract translation: 制造出具有优异电特性的晶体管。 在衬底上形成氧化物绝缘膜，在氧化物绝缘膜上形成氧化物半导体膜，然后在氧化物半导体膜中所含的氢被解吸的温度和氧化物绝缘中包含的部分氧进行热处理 膜被解吸，然后将加热的氧化物半导体膜蚀刻成预定形状以形成岛状氧化物半导体膜，在岛状氧化物半导体膜上形成一对电极，在该对上形成栅极绝缘膜 的电极和岛状氧化物半导体膜，并且栅极电极形成在栅极绝缘膜上。

公开(公告)号：US20160064570A1

公开(公告)日：2016-03-03

申请号：US14936305

申请日：2015-11-09

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Jun KOYAMA ,  Masashi TSUBUKU ,  Kosei NODA

IPC: H01L29/786 ,  H01L27/12 ,  H01L27/02

CPC classification number: H01L29/7869 ,  H01L22/34 ,  H01L27/0207 ,  H01L27/1225 ,  H01L29/78696 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A logic circuit includes a thin film transistor having a channel formation region formed using an oxide semiconductor, and a capacitor having terminals one of which is brought into a floating state by turning off the thin film transistor. The oxide semiconductor has a hydrogen concentration of 5×1019 (atoms/cm3) or less and thus substantially serves as an insulator in a state where an electric field is not generated. Therefore, off-state current of a thin film transistor can be reduced, leading to suppressing the leakage of electric charge stored in a capacitor, through the thin film transistor. Accordingly, a malfunction of the logic circuit can be prevented. Further, the excessive amount of current which flows in the logic circuit can be reduced through the reduction of off-state current of the thin film transistor, resulting in low power consumption of the logic circuit.

Abstract translation: 逻辑电路包括具有使用氧化物半导体形成的沟道形成区域的薄膜晶体管，以及通过关闭薄膜晶体管而使端子中的一个成为浮置状态的电容器。 氧化物半导体的氢浓度为5×1019（原子/ cm3）以下，因此在不产生电场的状态下基本上用作绝缘体。 因此，可以减小薄膜晶体管的截止电流，从而通过薄膜晶体管抑制存储在电容器中的电荷的泄漏。 因此，可以防止逻辑电路的故障。 此外，可以通过减小薄膜晶体管的截止电流来降低在逻辑电路中流动的过量的电流，导致逻辑电路的低功耗。

公开(公告)号：US20150270402A1

公开(公告)日：2015-09-24

申请号：US14657195

申请日：2015-03-13

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Yuta ENDO ,  Kosei NODA

IPC: H01L29/786 ,  H01L27/12 ,  H01L29/66

CPC classification number: H01L29/7869 ,  H01L27/1218 ,  H01L27/1225 ,  H01L27/1255 ,  H01L27/1262 ,  H01L29/66969

Abstract: A semiconductor device that is suitable for miniaturization. A method for manufacturing a semiconductor device includes the steps of forming a semiconductor, forming a first conductor over the semiconductor, performing a second process on the first conductor so as to form a conductor according to a first pattern, forming a first insulator over the conductor having the first pattern, forming an opening in the first insulator, performing a third process on the conductor having the first pattern in the opening so as to form a first electrode and a second electrode and to expose the semiconductor, forming a second insulator over the first insulator, an inner wall of the opening, and an exposed portion of the semiconductor, forming a second conductor over the second insulator, and performing a fourth process on the second conductor so as to form a third electrode.

Abstract translation: 适合小型化的半导体器件。 一种制造半导体器件的方法包括以下步骤：形成半导体，在半导体上形成第一导体，在第一导体上执行第二工艺以形成根据第一图案的导体，在导体上形成第一绝缘体 具有第一图案，在第一绝缘体中形成开口，在开口中具有第一图案的导体上进行第三处理，以形成第一电极和第二电极，并暴露半导体，在第 第一绝缘体，开口的内壁和半导体的暴露部分，在第二绝缘体上形成第二导体，并在第二导体上执行第四工艺以形成第三电极。

公开(公告)号：US20150236163A1

公开(公告)日：2015-08-20

申请号：US14628439

申请日：2015-02-23

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Shunpei YAMAZAKI ,  Hiroyuki MIYAKE ,  Masashi TSUBUKU ,  Kosei NODA

IPC: H01L29/786 ,  H01L27/12

CPC classification number: H01L29/78696 ,  H01L21/84 ,  H01L27/105 ,  H01L27/1225 ,  H01L27/124 ,  H01L27/1255 ,  H01L29/24 ,  H01L29/66969 ,  H01L29/7869 ,  H02M3/073 ,  H02M3/158

Abstract: A transistor includes a gate, a source, and a drain, the gate is electrically connected to the source or the drain, a first signal is input to one of the source and the drain, and an oxide semiconductor layer whose carrier concentration is 5×1014/cm3 or less is used for a channel formation layer. A capacitor includes a first electrode and a second electrode, the first electrode is electrically connected to the other of the source and the drain of the transistor, and a second signal which is a clock signal is input to the second electrode. A voltage of the first signal is stepped up or down to obtain a third signal which is output as an output signal through the other of the source and the drain of the transistor.

Abstract translation: 晶体管包括栅极，源极和漏极，栅极电连接到源极或漏极，第一信号被输入到源极和漏极中的一个，以及载流子浓度为5× 1014 / cm3以下用于沟道形成层。 电容器包括第一电极和第二电极，第一电极电连接到晶体管的源极和漏极中的另一个，并且作为时钟信号的第二信号被输入到第二电极。 第一信号的电压被升高或降低以获得通过晶体管的源极和漏极中的另一个输出作为输出信号的第三信号。

公开(公告)号：US20150137121A1

公开(公告)日：2015-05-21

申请号：US14578920

申请日：2014-12-22

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Kosei NODA ,  Shunpei YAMAZAKI ,  Tatsuya HONDA ,  Yusuke SEKINE ,  Hiroyuki TOMATSU

IPC: H01L29/786 ,  H01L27/12

CPC classification number: H01L29/7869 ,  H01L21/0242 ,  H01L21/02554 ,  H01L21/02565 ,  H01L21/02595 ,  H01L21/02656 ,  H01L21/84 ,  H01L27/10873 ,  H01L27/1156 ,  H01L27/1203 ,  H01L27/1222 ,  H01L27/1225 ,  H01L27/1255 ,  H01L29/66742 ,  H01L29/66969 ,  H01L29/78603 ,  H01L29/78609

Abstract: A highly reliable transistor which includes an oxide semiconductor and has high field-effect mobility and in which a variation in threshold voltage is small is provided. By using the transistor, a high-performance semiconductor device, which has been difficult to realize, is provided. The transistor includes an oxide semiconductor film which contains two or more kinds, preferably three or more kinds of elements selected from indium, tin, zinc, and aluminum. The oxide semiconductor film is formed in a state where a substrate is heated. Further, oxygen is supplied to the oxide semiconductor film with an adjacent insulating film and/or by ion implantation in a manufacturing process of the transistor, so that oxygen deficiency which generates a carrier is reduced as much as possible. In addition, the oxide semiconductor film is highly purified in the manufacturing process of the transistor, so that the concentration of hydrogen is made extremely low.

Abstract translation: 提供了包括氧化物半导体并且具有高场效应迁移率并且其中阈值电压的变化小的高度可靠的晶体管。 通过使用晶体管，提供了难以实现的高性能半导体器件。 晶体管包括含有选自铟，锡，锌和铝中的两种或更多种，优选三种或更多种元素的氧化物半导体膜。 在加热基板的状态下形成氧化物半导体膜。 此外，在晶体管的制造过程中，通过相邻的绝缘膜和/或通过离子注入向氧化物半导体膜提供氧，从而尽可能地减少产生载流子的氧气缺乏。 此外，在晶体管的制造过程中，氧化物半导体膜被高度纯化，使得氢的浓度极低。

公开(公告)号：US20140368417A1

公开(公告)日：2014-12-18

申请号：US14477172

申请日：2014-09-04

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Ryo ARASAWA ,  Jun KOYAMA ,  Masashi TSUBUKU ,  Kosei NODA

IPC: G09G3/36 ,  H01L27/12 ,  H01L29/786

CPC classification number: G09G3/3614 ,  G02F1/133553 ,  G02F1/13439 ,  G02F1/1368 ,  G02F2201/123 ,  G02F2202/10 ,  G09G3/3648 ,  G09G3/3677 ,  G09G2300/08 ,  G09G2310/0286 ,  G09G2310/08 ,  G09G2330/021 ,  H01L21/02164 ,  H01L21/02266 ,  H01L21/02565 ,  H01L21/02631 ,  H01L21/467 ,  H01L21/477 ,  H01L27/1225 ,  H01L27/1255 ,  H01L29/24 ,  H01L29/42356 ,  H01L29/45 ,  H01L29/66969 ,  H01L29/78648 ,  H01L29/7869

Abstract: In a liquid crystal display device including a plurality of pixels in a display portion and configured to performed display in a plurality of frame periods, each of the frame periods includes a writing period and a holding period, and after an image signal is input to each of the plurality of pixels in the writing period, a transistor included in each of the plurality of pixels is turned off and the image signal is held for at least 30 seconds in the holding period. The pixel includes a semiconductor layer including an oxide semiconductor layer, and the oxide semiconductor layer has a carrier concentration of less than 1×1014/cm3.

Abstract translation: 在包括显示部分中的多个像素并且被配置为在多个帧周期中进行显示的液晶显示装置中，每个帧周期包括写入周期和保持周期，并且在将图像信号输入到每个 在所述写入周期中的所述多个像素中，包括在所述多个像素中的每一个中的晶体管被​​截止，并且所述图像信号在所述保持周期中保持至少30秒。 像素包括具有氧化物半导体层的半导体层，氧化物半导体层的载流子浓度小于1×10 14 / cm 3。

公开(公告)号：US20130240872A1

公开(公告)日：2013-09-19

申请号：US13790248

申请日：2013-03-08

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Kosei NODA

IPC: H01L29/786

CPC classification number: H01L29/78696 ,  H01L29/41733 ,  H01L29/7869

Abstract: In the transistor including a gate electrode and an oxide semiconductor film which are provided to overlap with each other with a gate insulating film provided therebetween and a first electrode and a second electrode which are in contact with the oxide semiconductor film, the second electrode partly surrounds an end portion and side surface portions of the first electrode. In the oxide semiconductor film, a channel region is formed in a region which overlaps with the gate electrode and which is between the first electrode and the second electrode. An end portion of the oxide semiconductor film which continuously extends from end portions of the channel region does not overlap with the gate electrode.

Abstract translation: 在包括栅极电极和氧化物半导体膜的晶体管中，其间设置有彼此重叠的栅极绝缘膜和与氧化物半导体膜接触的第一电极和第二电极，第二电极部分地围绕 第一电极的端部和侧表面部分。 在氧化物半导体膜中，沟道区形成在与栅电极重叠并且位于第一电极和第二电极之间的区域中。 从沟道区的端部连续延伸的氧化物半导体膜的端部与栅电极不重叠。

公开(公告)号：US20130200370A1

公开(公告)日：2013-08-08

申请号：US13845424

申请日：2013-03-18

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Jun KOYAMA ,  Masashi TSUBUKU ,  Kosei NODA

IPC: H01L29/786

CPC classification number: H01L29/7869 ,  H01L22/34 ,  H01L27/0207 ,  H01L27/1225 ,  H01L29/78696 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A logic circuit includes a thin film transistor having a channel formation region formed using an oxide semiconductor, and a capacitor having terminals one of which is brought into a floating state by turning off the thin film transistor. The oxide semiconductor has a hydrogen concentration of 5×1019 (atoms/cm3) or less and thus substantially serves as an insulator in a state where an electric field is not generated. Therefore, off-state current of a thin film transistor can be reduced, leadind to suppressing the leakage of electric charge stored in a capacitor, through the thin film transistor. Accordingly, a malfunction of the logic circuit can be prevented. Further, the excessive amount of current which flows in the logic circuit can be reduced through the reduction of off-state current of the thin film transistor, resulting in low power consumption of the logic circuit.

Abstract translation: 逻辑电路包括具有使用氧化物半导体形成的沟道形成区域的薄膜晶体管，以及通过关闭薄膜晶体管而使端子中的一个成为浮置状态的电容器。 氧化物半导体的氢浓度为5×1019（原子/ cm3）以下，因此在不产生电场的状态下基本上用作绝缘体。 因此，可以减小薄膜晶体管的截止电流，从而通过薄膜晶体管抑制存储在电容器中的电荷的泄漏。 因此，可以防止逻辑电路的故障。 此外，可以通过减小薄膜晶体管的截止电流来降低在逻辑电路中流动的过量的电流，导致逻辑电路的低功耗。

公开(公告)号：US20130137232A1

公开(公告)日：2013-05-30

申请号：US13686204

申请日：2012-11-27

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Daigo ITO ,  Yuichi SATO ,  Kosei NODA

IPC: H01L29/66 ,  H01L21/265

CPC classification number: H01L29/66477 ,  H01L21/02565 ,  H01L21/265 ,  H01L29/66969 ,  H01L29/7869

Abstract: An oxide semiconductor film is formed over a substrate. A sacrifice film is formed to such a thickness that the local maximum of the concentration distribution of an injected substance injected into the oxide semiconductor film in the depth direction of the oxide semiconductor film is located in a region from an interface between the substrate and the oxide semiconductor film to a surface of the oxide semiconductor film. Oxygen ions are injected as the injected substance into the oxide semiconductor film through the sacrifice film at such an acceleration voltage that the local maximum of the concentration distribution of the injected substance in the depth direction of the oxide semiconductor film is located in the region, and then the sacrifice film is removed. Further, a semiconductor device is manufactured using the oxide semiconductor film.