公开(公告)号：US08034667B2

公开(公告)日：2011-10-11

申请号：US11597299

申请日：2005-05-26

申请人： Tomonori Shinoda ,  Osamu Yamazaki

发明人： Tomonori Shinoda ,  Osamu Yamazaki

IPC分类号： H01L21/00

CPC分类号： H01L21/56 ,  H01L21/568 ,  H01L24/45 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T428/31504 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor sealing resin sheet is composed of a supporting sheet and a sealing resin layer releasably laminated on the supporting sheet, wherein the sealing resin layer has a thermosetting property, the elastic modulus of the sealing resin layer before thermosetting is 1.0×103 to 1.0×104 Pa, the melt viscosity 120° C. of the sealing resin layer before thermosetting is 100 to 200 Pa·s, and the time required for the melt viscosity to reach its minimum value is 60 sec or less when the sealing resin layer before thermosetting is kept at a constant temperature of 120° C. A method for manufacturing semiconductor devices includes the steps of preparing a circuit substrate with a semiconductor chip mounted thereon, the circuit substrate is heated, the surface of the sealing resin layer in the semiconductor sealing resin sheet described above is embedded in concavo-convex parts and gaps on the semiconductor-chip-mounted surface of the circuit substrate, and the surface of the sealing resin layer is brought into contact with the surface of the circuit substrate and then the sealing resin layer is thermally cured.

摘要翻译： 半导体密封树脂片由支撑片和可剥离地层叠在支撑片上的密封树脂层构成，其中密封树脂层具有热固性，热固化前密封树脂层的弹性模量为1.0×10 3〜1.0× 104Pa时，热固化前的密封树脂层的熔融粘度120℃为100〜200Pa·s，热固化前的密封树脂层的熔融粘度达到最小值所需的时间为60秒以下 保持在120℃的恒定温度。半导体器件的制造方法包括以下步骤：准备安装有半导体芯片的电路基板，电路基板被加热，半导体密封树脂中的密封树脂层的表面 将上述片材嵌入在电路基板的半导体芯片安装表面上的凹凸部分和间隙中，并且密封的表面 树脂层与电路基板的表面接触，然后将密封树脂层热固化。

公开(公告)号：US07871540B2

公开(公告)日：2011-01-18

申请号：US12279280

申请日：2007-02-16

申请人： Osamu Yamazaki ,  Hiroshi Hasebe ,  Kiyofumi Takeuchi

发明人： Osamu Yamazaki ,  Hiroshi Hasebe ,  Kiyofumi Takeuchi

IPC分类号： C09K19/38 ,  C09K19/54 ,  C09K19/30 ,  C09K19/32 ,  C09K19/34 ,  C09K19/20

CPC分类号： C09K19/12 ,  C09K19/10 ,  C09K19/2007 ,  C09K19/32 ,  C09K19/542 ,  C09K2019/0448 ,  C09K2019/328 ,  G02B5/3016 ,  Y10T428/10

摘要： A polymerizable liquid crystal composition of the present invention includes a compound including a repeated unit represented by a general formula (I) (wherein R1, R2, R3, and R4 each independently represents a hydrogen atom, a halogen atom, or a hydrocarbon group having 1 to 20 carbon atoms, and one or more of hydrogen atoms in the hydrocarbon group may be substituted by the halogen atoms.), in which a weight average molecular weight is 100 or more.

摘要翻译： 本发明的可聚合液晶组合物包括含有由通式（I）表示的重复单元的化合物（其中R 1，R 2，R 3和R 4各自独立地表示氢原子，卤素原子或具有 1〜20个碳原子，烃基中的一个或多个氢原子可被卤原子取代），其中重均分子量为100以上。

公开(公告)号：US20100190293A1

公开(公告)日：2010-07-29

申请号：US12670127

申请日：2008-07-18

申请人： Jun Maeda ,  Keiko Tanaka ,  Osamu Yamazaki

发明人： Jun Maeda ,  Keiko Tanaka ,  Osamu Yamazaki

IPC分类号： H01L21/50

CPC分类号： H01L21/6836 ,  H01L21/304 ,  H01L21/563 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83191 ,  H01L2224/83208 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/351 ,  H01L2924/00015 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

摘要： The present invention has been achieved reflecting such situation, and its object is to provide a manufacturing method of a semiconductor device capable of continuously performing the mounting process which applies a so-called DBG process and a flip chip bonding method, and can contribute to simplify the manufacturing process and to improve the reliability with no void in the product. The manufacturing method of a semiconductor device according to the present invention comprises: laminating a surface protective sheet to a circuit surface side of a wafer formed with grooves which divide each circuit wherein an adhesive film is adhered on the circuit surface of the wafer; reducing the thickness of the wafer and finally dividing the wafer into individual chips by grinding a back face of the wafer; picking up individual chips together with the adhesive film; die-bonding said individual chip to predetermined position of a chip mounting substrate via said adhesive film; fixing the chip to the chip mounting substrate by heating the die-bonded chip having the adhesive film; and applying a static pressure larger than an ambient pressure by 0.05 MPa or more to a stacked body including the adhesive film one or more times, at any point between adhering the wafer to the adhesive film and fixing the chip to the chip mounting substrate.

摘要翻译： 已经实现了本发明，反映了这种情况，其目的在于提供能够连续进行所谓的DBG处理和倒装芯片接合方法的安装工序的半导体装置的制造方法，能够有助于简化 制造过程中提高产品的可靠性，无空白。 根据本发明的半导体器件的制造方法包括：将表面保护片层压到形成有凹槽的晶片的电路表面侧，所述晶片将每个电路分开，其中粘合剂膜粘附在晶片的电路表面上; 减小晶片的厚度，最后通过研磨晶片的背面将晶片分成单独的芯片; 用粘合膜拾取单个芯片; 将所述单个芯片经由所述粘合膜将所述芯片贴合到芯片安装基板的预定位置; 通过加热具有粘合膜的芯片接合芯片将芯片固定到芯片安装基板; 并且在将晶片粘附到粘合剂膜上并将芯片固定到芯片安装基板之间的任何点处，将包括粘合剂膜的层叠体施加大于0.05MPa或更大的环境压力的静态压力一次或多次。

公开(公告)号：US20080260982A1

公开(公告)日：2008-10-23

申请号：US12144702

申请日：2008-06-24

申请人： Hideo Senoo ,  Takashi Sugino ,  Osamu Yamazaki

发明人： Hideo Senoo ,  Takashi Sugino ,  Osamu Yamazaki

IPC分类号： B32B33/00

CPC分类号： H01L23/3164 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/293 ,  H01L23/562 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/14 ,  H01L2924/0635 ,  H01L2924/00 ,  H01L2924/3512

摘要： A sheet to form a protective film for chips includes a release sheet and a protective film forming layer formed on a detachable surface of the release sheet. The protective film forming layer includes a thermosetting and/or energy ray-curable component and a binder polymer component.

摘要翻译： 形成芯片保护膜的片材包括形成在剥离片的可拆卸表面上的剥离片和保护膜形成层。 保护膜形成层包括热固性和/或能量射线可固化组分和粘合剂聚合物组分。

公开(公告)号：US20080241995A1

公开(公告)日：2008-10-02

申请号：US11596427

申请日：2005-05-12

申请人： Yasuki Fukui ,  Osamu Yamazaki ,  Naoya Saiki

发明人： Yasuki Fukui ,  Osamu Yamazaki ,  Naoya Saiki

IPC分类号： H01L21/58 ,  B32B33/00

CPC分类号： C08G59/08 ,  C08G59/3209 ,  C08G59/44 ,  C08G59/686 ,  C09J7/22 ,  C09J7/38 ,  C09J2203/326 ,  H01L21/67132 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/92247 ,  H01L2225/06575 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/181 ,  Y02P20/582 ,  Y10T428/14 ,  Y10T428/28 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512

摘要： An adhesive sheet for dicing and die bonding includes a base material and an adhesive layer releasably laminated on said base material, wherein said adhesive layer has a pressure sensitive adhering property at room temperature and a thermosetting property, the elastic modulus of the adhesive layer before thermosetting is 1.0×103 to 1.0×104 Pa, the melt viscosity at 120° C. of the adhesive layer before thermosetting is 100 to 200 Pa·s, and the time required for the melt viscosity to reach its minimum value is 60 sec or less when the adhesive layer before thermosetting is maintained at a constant temperature of 120° C.

摘要翻译： 用于切割和芯片接合的粘合片包括基材和可剥离地层压在所述基材上的粘合剂层，其中所述粘合层在室温下具有压敏粘合性和热固性，热固性之前的粘合剂层的弹性模量 为1.0×10 3〜1.0×10 4 Pa，热固化前粘合剂层的120℃下的熔融粘度为100〜200Pa·s，需要时间 当热固化前的粘合剂层保持在120℃的恒定温度时，熔体粘度达到其最小值为60秒或更短

公开(公告)号：US20070276079A1

公开(公告)日：2007-11-29

申请号：US11805457

申请日：2007-05-23

申请人： Naoya Saiki ,  Isao Ichikawa ,  Hironori Shizuhata ,  Osamu Yamazaki

发明人： Naoya Saiki ,  Isao Ichikawa ,  Hironori Shizuhata ,  Osamu Yamazaki

IPC分类号： C08K3/34

CPC分类号： C09D133/04 ,  C08L63/00 ,  C08L2312/08 ,  C08L2666/22

摘要： The adhesive composition according to the present invention is characterized by including an acrylic copolymer (A), an epoxy thermosetting resin (B) and a compound (C) having a functional group which can react with an epoxy group and having an unsaturated hydrocarbon group.According to the present invention, the high package reliability can be achieved even when exposed to severe reflow conditions in a package in which a thin semiconductor chip is mounted.

摘要翻译： 根据本发明的粘合剂组合物的特征在于包括丙烯酸共聚物（A），环氧热固性树脂（B）和具有可与环氧基反应并具有不饱和烃基的官能团的化合物（C）。 根据本发明，即使在安装有薄的半导体芯片的封装中暴露于严重的回流条件下，也可以实现高封装可靠性。

公开(公告)号：US07235465B2

公开(公告)日：2007-06-26

申请号：US11113481

申请日：2005-04-25

申请人： Hideo Senoo ,  Takashi Sugino ,  Osamu Yamazaki

发明人： Hideo Senoo ,  Takashi Sugino ,  Osamu Yamazaki

IPC分类号： H01L21/46 ,  H01L21/76 ,  H01L21/301

CPC分类号： H01L23/3164 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/293 ,  H01L23/562 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/14 ,  H01L2924/0635 ,  H01L2924/00 ,  H01L2924/3512

摘要： A process for producing semiconductor chips having a protective film on the back surface includes the steps of: providing a sheet to form the protective film having a release sheet and a protective film-forming layer formed on a detachable surface of the release sheet, wherein the protective film-forming layer includes a thermosetting component, an energy ray-curable component and a binder polymer component; adhering a protective film-forming layer of the sheet to form the protective film onto a back surface of a semiconductor wafer having circuits on its surface; curing the protective film-forming layer by irradiation with an energy ray, and thereafter, further conducting the additional steps of (in any order): detaching the release sheet from the protective film-forming layer; further curing the protective film-forming layer by heating; and dicing the semiconductor wafer together with the protective film-forming layer with respect to each circuit.

摘要翻译： 一种制造在背面具有保护膜的半导体芯片的方法，包括以下步骤：提供一片材以形成具有剥离片的保护膜和形成在剥离片的可拆卸表面上的保护膜形成层，其中， 保护膜形成层包括热固性组分，能量射线固化组分和粘合剂聚合物组分; 粘附片材的保护膜形成层，以在其表面上具有电路的半导体晶片的背表面上形成保护膜; 通过用能量射线照射来固化保护膜形成层，然后进一步进行（以任意顺序）的附加步骤：将剥离片从保护膜形成层分离; 通过加热进一步固化保护膜形成层; 并且相对于每个电路将半导体晶片与保护膜形成层一起切割。

公开(公告)号：US07136749B2

公开(公告)日：2006-11-14

申请号：US10817951

申请日：2004-04-06

申请人： Naohiko Ichihara ,  Shinichi Sugie ,  Osamu Yamazaki ,  Hiroto Inoue ,  Takehiko Shioda

发明人： Naohiko Ichihara ,  Shinichi Sugie ,  Osamu Yamazaki ,  Hiroto Inoue ,  Takehiko Shioda

IPC分类号： G01C21/26 ,  G01C21/34

CPC分类号： G01C21/343

摘要： A system controller 115 includes a table data storage 131 storing table data for calculating the order of priority of each destination, and a priority destination list creator 132 for creating a priority destination list based on the table data in such a manner that priorities of destinations that suit the preferences of the user will set high based on destination conditions set by the user and the stored table data.

摘要翻译： 系统控制器115包括存储用于计算每个目的地的优先级顺序的表数据的表数据存储器131和用于基于表数据创建优先目的地列表的优先目的地列表创建器132， 根据用户设置的目的地条件和存储的表数据，适合用户的偏好设置为高。

公开(公告)号：US07135224B2

公开(公告)日：2006-11-14

申请号：US10487531

申请日：2002-08-08

申请人： Takaji Sumi ,  Osamu Yamazaki ,  Takashi Sugino ,  Hideo Senoo

发明人： Takaji Sumi ,  Osamu Yamazaki ,  Takashi Sugino ,  Hideo Senoo

IPC分类号： B32B27/38

CPC分类号： H01L21/6836 ,  C08G59/24 ,  C08G59/3218 ,  C08G59/4021 ,  C08K5/0025 ,  C08K5/103 ,  C08L2666/02 ,  C08L2666/04 ,  C09J7/22 ,  C09J7/35 ,  C09J7/38 ,  C09J163/00 ,  C09J2203/326 ,  C09J2463/00 ,  G03F7/038 ,  H01L2221/68327 ,  H01L2924/0002 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/31511 ,  H01L2924/00

摘要： An adhesive tape comprising a base and, superimposed thereon, an adhesive layer, this adhesive layer comprising an adherent component (A), an epoxy resin (B), a thermally active latent epoxy resin curing agent (C), an energy radiation polymerizable compound (D) and a photopolymerization initiator (E), wherein either or both of the epoxy resin (B) and energy radiation polymerizable compound (D) have a dicyclopentadiene skeleton in its molecule or molecules thereof. The resultant adhesive tape has an adhesive layer which provides reduced water absorption of an adhesive curing product and which enables a lowering of the elastic modulus thereof during thermocompression bonding.

摘要翻译： 一种粘合带，其包括基底并且叠加在其上的粘合剂层，该粘合剂层包含粘合组分（A），环氧树脂（B），热活性潜在环氧树脂固化剂（C），能量辐射聚合化合物 （D）和光聚合引发剂（E），其中环氧树脂（B）和能量辐射聚合性化合物（D）中的任一种或两者在其分子中具有二环戊二烯骨架。 所得粘合带具有粘合剂层，其提供粘合剂固化产物的减少的吸水性，并且其能够在热压接期间降低其弹性模量。

公开(公告)号：US06980814B2

公开(公告)日：2005-12-27

申请号：US09907503

申请日：2001-07-18

申请人： Manabu Nohara ,  Takehiko Shioda ,  Yasuteru Kodama ,  Masami Suzuki ,  Hiroto Inoue ,  Katsunori Arakawa ,  Satoshi Odagawa ,  Osamu Yamazaki ,  Masahiro Okamura ,  Takayuki Akimoto

发明人： Manabu Nohara ,  Takehiko Shioda ,  Yasuteru Kodama ,  Masami Suzuki ,  Hiroto Inoue ,  Katsunori Arakawa ,  Satoshi Odagawa ,  Osamu Yamazaki ,  Masahiro Okamura ,  Takayuki Akimoto

IPC分类号： H04W64/00 ,  H04Q7/20

CPC分类号： H04W64/00

摘要： A mobile communication system including a plurality of base stations arranged in a communication area, each emitting a radio wave inherent thereto and a mobile station moving in the communication area and communicating with respective base stations via the transmitted radio waves. There is previously stored a location correlation data group including correlation data representing correlation situations of a plurality of arriving radio waves produced by the transmitted radio waves at respective ones of a plurality of sampling locations within the communication area, the location correlation data corresponding to respective locations. Upon reception of radio waves at a current location of the mobile station, current correlation data is calculated representing correlation situations among received arriving radio waves for the respective mobile station. The location correlation data in the location correlation data group is compared with the current correlation data, and the current position of the mobile stations is determined in accordance with a result of the comparison, generating the determined current position data.

摘要翻译： 一种移动通信系统，包括布置在通信区域中的多个基站，每个基站发射固有的无线电波，以及在通信区域中移动的移动站，并且经由所发送的无线电波与各个基站进行通信。 预先存储位置相关数据组，其包括表示在通信区域内的多个采样位置中的各个位置处由发射的无线电波产生的多个到达的无线电波的相关性的相关数据，对应于各个位置的位置相关数据 。 在移动站的当前位置接收到无线电波时，计算表示各个移动台的接收到的无线电波之间的相关情况的当前相关数据。 将位置相关数据组中的位置相关数据与当前相关数据进行比较，并根据比较结果确定移动站的当前位置，生成确定的当前位置数据。