公开(公告)号：US20230245986A1

公开(公告)日：2023-08-03

申请号：US18103196

申请日：2023-01-30

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Wen-Jung Tsai

IPC: H01L23/66 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552

CPC classification number: H01L23/66 ,  H01L21/56 ,  H01L23/552 ,  H01L23/3121 ,  H01L23/49838 ,  H01L23/49861 ,  H01L23/49833 ,  H01L24/16 ,  H01L2924/3025

Abstract: An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.

公开(公告)号：US20230223322A1

公开(公告)日：2023-07-13

申请号：US17574944

申请日：2022-01-13

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Ko-Wei Chang ,  Wen-Jung Tsai ,  Che-Wei Yu ,  Chia-Yang Chen

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L23/49816 ,  H01L23/3121 ,  H01L24/16 ,  H01L21/4853 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16227 ,  H01L2924/3511 ,  H01L24/73 ,  H01L2224/73204 ,  H01L24/32 ,  H01L2224/32225 ,  H01L25/0652 ,  H01L2225/06517

Abstract: Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.

公开(公告)号：US20230163082A1

公开(公告)日：2023-05-25

申请号：US17571901

申请日：2022-01-10

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Wen-Jung Tsai ,  Chien-Cheng Lin ,  Ko-Wei Chang ,  Yu-Wei Yeh ,  Shun-Yu Chien ,  Chia-Yang Chen

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L23/562 ,  H01L23/49822 ,  H01L23/3121

Abstract: An electronic package is provided in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure is embedded in the packaging layer. Therefore, thermal stress is dispersed through the frame body to avoid warpage of the electronic package, so as to facilitate the arrangement of other electronic components around the electronic component.

公开(公告)号：US20220093538A1

公开(公告)日：2022-03-24

申请号：US17159527

申请日：2021-01-27

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Ko-Wei CHANG

IPC: H01L23/64 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L49/02 ,  H01L21/48 ,  H01L21/56

Abstract: An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer. Moreover, a plurality of conductive bumps that electrically connect the first conductive layer and the second conductive layer are arranged between the electronic component and the carrier to surround the magnetically permeable member for generating magnetic flux.

公开(公告)号：US11233324B2

公开(公告)日：2022-01-25

申请号：US16890128

申请日：2020-06-02

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Wen-Jung Tsai ,  Chih-Hsien Chiu

IPC: H01Q1/52 ,  H01L25/16 ,  H01L21/56 ,  H01L23/482 ,  H01L23/31

Abstract: Provided is a packaging structure, which includes a carrier and an electronic component, an antenna module and a connector disposed on the carrier, and a packaging layer encapsulating the electronic component and the connector. A portion of a surface of the connector is exposed from the packaging layer so as to facilitate the electrical connection with a motherboard of an electronic product. A method for fabricating the packaging structure is also provided.

公开(公告)号：US11222852B2

公开(公告)日：2022-01-11

申请号：US16573276

申请日：2019-09-17

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/31 ,  H01L21/56 ,  H01Q23/00

Abstract: An electronic package and a method for fabricating the same are provided. The method includes disposing an electronic component on a lower side of a first carrier and forming an encapsulant on an upper side of the first carrier. A first conductor is disposed on the encapsulant and configured for generating radiation energy by an alternating voltage, an alternating current or radiation variation. As such, the electronic package has a reduced thickness and improved antenna efficiency.

公开(公告)号：US20210351097A1

公开(公告)日：2021-11-11

申请号：US17241199

申请日：2021-04-27

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Chiang He ,  Yu-Wei Yeh ,  Chia-Yang Chen ,  Chih-Yi Liao ,  Chih-Hsien Chiu ,  Chang-Chao Su

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L23/498 ,  H01L23/538 ,  H01L21/768

Abstract: An electronic structure and a method for fabricating the same are provided. An electronic component and conductive elements are disposed on a carrier. An encapsulation layer encapsulates the electronic component and the conductive elements. The encapsulation layer has concave portions corresponding in position to the conductive elements. Each of the conductive elements is in no contact with corresponding one of the concave portions.

公开(公告)号：US10916838B2

公开(公告)日：2021-02-09

申请号：US14695469

申请日：2015-04-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chi-Liang Shih

IPC: H01Q9/04 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/42 ,  H01Q1/22

Abstract: An electronic module is provided, which includes: a substrate; an antenna body disposed over the substrate; and an encapsulant formed on the substrate and encapsulating the antenna body. A portion of the antenna body is exposed from the encapsulant. As such, the invention increases the arrangement area of the antenna body without increasing the size of the substrate, and also reduces the height of the encapsulant. Therefore, the electronic module of the present invention meets the miniaturization requirement.

公开(公告)号：US20200235462A1

公开(公告)日：2020-07-23

申请号：US16535022

申请日：2019-08-07

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Wen-Jung Tsai ,  Mao-Hua Yeh ,  Chih-Hsien Chiu ,  Ying-Chou Tsai ,  Chun-Chi Ke

IPC: H01Q1/22 ,  H01Q1/36 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01L25/065 ,  H01L25/00 ,  H01L21/48 ,  H01L21/56

Abstract: An electronic package and a method for fabricating the same are provided. An antenna frame, a first electronic component, and a second electronic component electrically connected to the antenna frame are disposed on a lower side of a carrying structure. An antenna structure is disposed on an upper side of the carrying structure and is electrically connected to the first electronic component. Therefore, two different types of antennas are integrated into an identical electronic package. Such the electronic package bonded to a circuit can transmit signals with two different wavelengths, even if the electronic package does not have any area increased.

公开(公告)号：US20200013728A1

公开(公告)日：2020-01-09

申请号：US16573276

申请日：2019-09-17

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/31 ,  H01L21/56

Abstract: An electronic package and a method for fabricating the same are provided. The method includes disposing an electronic component on a lower side of a first carrier and forming an encapsulant on an upper side of the first carrier. A first conductor is disposed on the encapsulant and configured for generating radiation energy by an alternating voltage, an alternating current or radiation variation. As such, the electronic package has a reduced thickness and improved antenna efficiency.