公开(公告)号：US09601372B2

公开(公告)日：2017-03-21

申请号：US14990310

申请日：2016-01-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shuo-Mao Chen ,  Yu-Ting Huang

IPC: H01L21/768 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/525

CPC classification number: H01L24/05 ,  H01L21/56 ,  H01L21/76805 ,  H01L21/76831 ,  H01L21/76871 ,  H01L21/76883 ,  H01L21/76897 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3185 ,  H01L23/3192 ,  H01L23/49811 ,  H01L23/525 ,  H01L24/03 ,  H01L24/13 ,  H01L2224/02125 ,  H01L2224/02331 ,  H01L2224/0235 ,  H01L2224/02375 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/05011 ,  H01L2224/05012 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/05599 ,  H01L2224/12105 ,  H01L2224/13021 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A device includes a metal pad, and a passivation layer including portions overlapping edge portions of the metal pad. A Post-Passivation-Interconnect (PPI) includes a trace portion overlying the passivation layer, and a pad portion connected to the trace portion. A polymer layer includes an upper portion over the PPI, and a plug portion extending into, and encircled by, the pad portion of the PPI.