公开(公告)号：US20160118297A1

公开(公告)日：2016-04-28

申请号：US14990310

申请日：2016-01-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shuo-Mao Chen ,  Yu-Ting Huang

IPC: H01L21/768 ,  H01L21/56

CPC classification number: H01L24/05 ,  H01L21/56 ,  H01L21/76805 ,  H01L21/76831 ,  H01L21/76871 ,  H01L21/76883 ,  H01L21/76897 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3185 ,  H01L23/3192 ,  H01L23/49811 ,  H01L23/525 ,  H01L24/03 ,  H01L24/13 ,  H01L2224/02125 ,  H01L2224/02331 ,  H01L2224/0235 ,  H01L2224/02375 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/05011 ,  H01L2224/05012 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/05599 ,  H01L2224/12105 ,  H01L2224/13021 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A device includes a metal pad, and a passivation layer including portions overlapping edge portions of the metal pad. A Post-Passivation-Interconnect (PPI) includes a trace portion overlying the passivation layer, and a pad portion connected to the trace portion. A polymer layer includes an upper portion over the PPI, and a plug portion extending into, and encircled by, the pad portion of the PPI.

Abstract translation: 一种器件包括金属焊盘和包括与金属焊盘的边缘部分重叠的部分的钝化层。 后钝化互连（PPI）包括覆盖钝化层的迹线部分和连接到迹线部分的焊盘部分。 聚合物层包括PPI上的上部，以及延伸到PPI的焊盘部分并被环绕的PPI的插塞部分。

公开(公告)号：US09601372B2

公开(公告)日：2017-03-21

申请号：US14990310

申请日：2016-01-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shuo-Mao Chen ,  Yu-Ting Huang

IPC: H01L21/768 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/525

CPC classification number: H01L24/05 ,  H01L21/56 ,  H01L21/76805 ,  H01L21/76831 ,  H01L21/76871 ,  H01L21/76883 ,  H01L21/76897 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3185 ,  H01L23/3192 ,  H01L23/49811 ,  H01L23/525 ,  H01L24/03 ,  H01L24/13 ,  H01L2224/02125 ,  H01L2224/02331 ,  H01L2224/0235 ,  H01L2224/02375 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/05011 ,  H01L2224/05012 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/05599 ,  H01L2224/12105 ,  H01L2224/13021 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A device includes a metal pad, and a passivation layer including portions overlapping edge portions of the metal pad. A Post-Passivation-Interconnect (PPI) includes a trace portion overlying the passivation layer, and a pad portion connected to the trace portion. A polymer layer includes an upper portion over the PPI, and a plug portion extending into, and encircled by, the pad portion of the PPI.