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公开(公告)号：USD475712S1
公开(公告)日：2003-06-10
申请号：US29165699
申请日：2002-08-16
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公开(公告)号：USD474774S1
公开(公告)日：2003-05-20
申请号：US29165836
申请日：2002-08-19
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公开(公告)号：US6166431A
公开(公告)日：2000-12-26
申请号：US701425
申请日：1996-08-22
IPC分类号： H01L23/28 , H01L21/56 , H01L23/31 , H01L23/495 , H01L23/498 , H01C23/02 , H01C23/053
CPC分类号： H01L23/3121 , H01L23/49531 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L2224/45099 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01079 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/1579 , H01L2924/181 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device with a thickness of 1 mm or less is disclosed, that comprises a frame plate main body with a thickness in the range from 0.1 mm to 0.25 mm, a semiconductor pellet disposed on a first surface of the frame plate main body and with a thickness in the range from 0.2 mm to 0.3 mm, an external connection lead, one end thereof being connected to a peripheral portion of the first surface of the frame plate main body, the other end thereof extending to the outside of the frame plate main body, a bonding wire for electrically connecting an electrode of the semiconductor pellet and a connection portion of the end of the external connection lead, and a sealing resin layer for covering and sealing at least a region including the semiconductor pellet, the bonding wire, and a connection portion.
摘要翻译： 公开了一种厚度为1mm以下的半导体器件，其包括厚度为0.1mm至0.25mm的框架板主体，设置在框架板主体的第一表面上并具有 厚度在0.2mm至0.3mm的范围内，外部连接引线，其一端连接到框架板主体的第一表面的周边部分，其另一端延伸到框架主体的外部 电连接半导体芯片的电极和外部连接引线的端部的连接部分的接合线，以及用于覆盖和密封至少包括半导体芯片，接合线和 连接部分。
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84.发明授权Monitoring system for plant operation condition and its in-situ electrochemical electrode 失效植物营养条件监测系统及其现场电化学电极
公开(公告)号：US5203984A
公开(公告)日：1993-04-20
申请号：US573780
申请日：1990-08-28
申请人： Masanori Sakai , Katsumi Mabuchi , Toshiaki Arato , Takuya Takahashi , Masakiyo Izumiya , Isao Masaoka , Yoshitaka Kojima , Masahisa Inagaki , Katsumi Ohsumi , Makoto Hayashi , Fumio Sato , Masateru Suwa , Kimihiko Akahori
发明人： Masanori Sakai , Katsumi Mabuchi , Toshiaki Arato , Takuya Takahashi , Masakiyo Izumiya , Isao Masaoka , Yoshitaka Kojima , Masahisa Inagaki , Katsumi Ohsumi , Makoto Hayashi , Fumio Sato , Masateru Suwa , Kimihiko Akahori
IPC分类号： G01N17/02 , G01N27/26 , G01N27/27 , G01N27/30 , G01N27/333 , G01N27/401 , G01N27/403 , G01N27/416 , G01N27/48 , G01N33/18 , G21C17/02 , G21C17/022
CPC分类号： G01N27/30 , G01N33/18 , G21C17/022 , Y10S706/906
摘要： A plant operational status monitoring supervisory system comprising; means for extracting information directly relating to water quality of an objective portion consecutively for a period of time by means of an electrochemical water quality sensor installed in an objective portion to monitor in-situ in a plant; means for evaluating water quality based on thus extracted information; means for comparing an obtained water quality evaluation result with a reference value for a predetermined plant operation procedure; and means for displaying or storing necessary portion out of said comparison results; is disclosed.An electrochemical reference electrode used in this system being provided with an electrolyte layer containing ion of the electrode member; a porous ceramic layer surrounding the same without permeating liquid; and electrode member electrochemically contacting with said elec-trolyte layer; and a terminal electrically contacting with said electrode member; and further having a long life in high temperature water, various status of high temperature water in objective portions and that of nearby constituent members in a plant are possible to be monitored online by means of this reference electrode.Further, because monitored data are processed by means of a neural network, the higher precision level of monitoring has been achieved.
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