Abstract:
A glass composition substantially free from lead and bismuth and containing vanadium oxide and phosphor oxide as main ingredients, wherein the sintered glass of the glass composition exhibits 109 Ωcm or more at 25° C.
Abstract:
This invention provides a magnetic recording medium excellent in terms of corrosion resistance. The magnetic recording medium comprises a magnetic recording layer, a protective layer and a lubricant layer provided on a nonmagnetic substrate, and the lubricant layer comprises a compound having a heterocyclic ring.
Abstract:
A polishing liquid for CMP has a composition loaded with, for example, an inorganic salt, a protective film forming agent and a surfactant capable of imparting a dissolution accelerating activity to enlarge a difference between polishing speed under non-load and polishing speed under load. By virtue of this polishing liquid for CMP, there can be simultaneously accomplished a speed increase for increasing CMP productivity, and wiring planarization for miniaturization and multilayer formation of wiring.
Abstract:
Embodiments in accordance with the invention realize a perpendicular magnetic record medium with a high media S/N and excellent corrosion resistance. In a perpendicular magnetic record medium in accordance with an embodiment of the present invention prepared by forming an adhesion layer, an underlayer, a seed layer, an intermediate layer, and a recording layer sequentially on a substrate, the seed layer is specified to have a laminated structure consisting of a first seed layer and a second seed layer. The first seed layer consists of an amorphous alloy containing Cr and the second seed layer consists of an amorphous alloy predominantly composed of Ni with an fcc structure.
Abstract:
A CMP slurry is mixed with an oxidant in polishing and contains a copper rust inhibitor, a water-soluble polymer, a pH controller capable of forming a complex with copper, and water, and is substantially free from abrasive. The CMP slurry effectively reduces dishing in chemical polishing of copper and forms reliable wiring. Preferably, the contents of the rust inhibitor, the water-soluble polymer, and the oxidant are 0.1 to 5 wt %, 0.05 to 5 wt %, and 0.01 to 5M relative to 1 liter of the CMP slurry, respectively, and the amount of the pH controller is a necessary amount for adjusting pH of the CMP slurry to 1.5 to 2.5.
Abstract:
In an electrode in electrochemical device, particularly an anode lithium ion secondary battery, a cathode for use in alkali storage battery, an electrode for use in fuel cell, or a capacitor electrode, a metal structure has nano size micro-pillars is constructed with an electrode active material being formed on the surface of the metal structure. The metal structure having nano size micro-pillars can be formed, for example, by forming a metal layer as an electrode material by plating to the surface of a substrate having pores and then removing the substrate by dissolution, the metal filled in the pores of the substrate to form a group of micro-pillars. And the active material can be formed by depositing metal by plating. Since the active material is in direct contact with the conductive skeleton, the conducting agent for connecting the active materials to each other may not be added at all.
Abstract:
This invention provides a method and an apparatus for removing scales from hot-rolled steel strips to produce steel strips with excellent surface conditions. In a pickling facility to pickle the hot-rolled steel strip, the pickling method of this invention passes an electric current through the continuously fed, hot-rolled steel strip in one or more of a plurality of pickling tanks. A means to supply an electric current is also provided.
Abstract:
An object of the present invention is to provide a probe microscope that permits qualitative and quantitative evaluation on ions existing near the surface of a sample and permits to detect further simply and easily such as impurities, flaws and corrosion origins existing on the sample in high sensitivity. A probe microscope according to the present invention is provided with a test cell that holds a sample and permits to receive liquid, a probe, a counter electrode, a reference electrode, a drive mechanism that causes the probe to follow the surface of the sample as well as to scan the same, a potential control portion that controls a potential between the probe and the reference electrode and a current measuring portion that measures a current flowing between the probe and the counter electrode, and is characterized in that the material of the probe is constituted by a conductive body containing any of gold or gold alloy, carbon or carbon compound, boron, zinc, lead, tin and mercury.
Abstract:
A pickling plant for a steel strip and a method for controlling the pickling plant, including monitoring at least one quantity of state represented by thickness, width and quantity of scale of the steel strip, and at least one quantity of state of operation of a plant represented by concentration, quantity and temperature of acid supplied into a pickling tank of the pickling plant, line speed of the steel strip, and temperature of the steel strip immediately before entering the pickling tank calculating on the basis of values of said quantity of state and quantity of state of operation, at least one of concentration distribution of acid, concentration distribution of iron and descaling rate at optional plural positions, and on the basis of the calculating the optimum quantity of state for operation of the plant is determined.
Abstract:
The present invention provides a metal polishing liquid capable of CMP at a high Cu polishing rate and solving the problems: (a) generation of scratches attributable to solid particles, (b) generation of deteriorations in flatness such as dishing and erosion, (c) complexity in a washing process for removing abrasive particles remaining on the surface of a substrate after polishing, and (d) higher costs attributable to the cost of a solid abrasive itself and to waste liquid treatment, as well as a method of polishing a film to be polished by using the same. Disclosed are a metal polishing liquid which comprises a metal oxidizer, a metal oxide solubilizer, a metal anticorrosive, and a water-soluble polymer having an anionic functional group with a weight-average molecular weight of 8,000 or more and has pH 1 or more to 3 or less, and a method of polishing a film to be polished, which comprises supplying the above metal polishing liquid onto a polishing cloth of a polishing platen and simultaneously relatively moving the polishing platen and a substrate having a metallic film to be polished while the substrate is pressed against the polishing cloth.