摘要:
Mutual interference is reduced between a main cell portion and a sensing cell portion for detecting the current flowing through the main cell portion of a vertical MOS semiconductor device, and accuracy and reliability of overcurrent detection are improved. In the device, well regions of (p) type are formed between the main and sensing cell portions for capturing the minority carriers. Breakdown of the gate oxide film caused by an open emitter electrode of the sensing cell portion is prevented by forming the (p) type well regions with ring shapes, by spacing the (p) type well regions by 5 to 20 .mu.m, and by adjusting the isolation withstand voltage between the main and sensing cell portions below the withstand voltage of the gate oxide film. A voltage spike is minimized by narrowing the overlap of the detecting and gate electrodes for reduced capacitance between these electrodes.
摘要:
A MOSFET semiconductor device has a surge protecting element comprising a transistor element having a gate electrode, a source electrode, and a drain electrode. A Zener diode having a cathode electrode and an anode electrode is connected to the drain electrode of the transistor element. A lateral MOSFET element has a gate electrode and a drain electrode connected to the anode electrode of the Zener diode, a source electrode connected to the gate electrode of the transistor element, and a back gate electrode connected to the source electrode of the transistor element.
摘要:
The present invention relates to an increased operating voltage MOS semiconductor device. The device has a channel forming area between a source and extended drain area, a gate insulating film over the channel forming area and the drain area with a thicker portion over the drain area, and a gate electrode over the gate insulating film, thereby preventing an excess field concentration from existing in the extended drain region. The field concentration may be further reduced by forming a relaxation area underneath the juncture between the thick and thin portions of the gate insulating film below the surface of the drain area.
摘要:
In a power MOS-type semiconductor device with a current detection terminal, a first number of main MOSFET elements are connected to one another in parallel, and a second number of detection MOSFET elements are similarly connected to one another. First and second terminals of the main and detection MOSFET elements are commonly connected. A third terminal of one of the detection MOSFET element is used as the current detection terminal. The current or voltage measured at this detection terminal is substantially proportional to the ratio of the first number to the second number. To this end, the parasitic resistance in the device is increased so as to inhibit a leak current from flowing therethrough. Moreover, the ON resistance of each of the detection MOSFET elements is designed to be lower than that of a main MOSFET element by an amount which is a function of the first number and the detection resistance connected to the current detection terminal.
摘要:
The present invention relates to high voltage semiconductor devices with an integrated Zener diode used as a protective element against overvoltage. The Zener breakdown voltage can be increased while providing high operating voltage to the whole semiconductor device, by forming a region of lower impurity concentration around the cathode of the Zener diode. This lowers the current amplification factor of a parasitic transistor, enabling an increase in the Zener breakdown voltage without decreasing the withstand voltage of the whole semiconductor device.
摘要:
A semiconductor device having an alternating conductivity type layer improves the tradeoff between the on-resistance and the breakdown voltage and facilitates increasing the current capacity by reducing the on resistance while maintaining a high breakdown voltage. The semiconductor device includes a semiconductive substrate region, through which a current flows in the ON-state of the device and that is depleted in the OFF-state. The semiconductive substrate region includes a plurality of vertical alignments of n-type buried regions 32 and a plurality of vertical alignments of p-type buried regions. The vertically aligned n-type buried regions and the vertically aligned p-type buried regions are alternately arranged horizontally. The n-type buried regions and p-type buried regions are formed by diffusing respective impurities into highly resistive n-type layers 32a laminated one by one epitaxially.
摘要:
A diode is provided which includes a first-conductivity-type cathode layer, a first-conductivity-type drift layer placed on the cathode region and having a lower concentration than the cathode layer, a generally ring-like second-conductivity-type ring region formed in the drift layer, second-conductivity-type anode region formed in the drift layer located inside the ring region, a cathode electrode formed in contact with the cathode layer, and an anode electrode formed in contact with the anode region, wherein the lowest resistivity of the second-conductivity-type anode region is at least 1/100 of the resistivity of the drift layer, and the thickness of the anode region is smaller than the diffusion depth of the ring region.
摘要:
A semiconductor device realizes a high electrostatic discharge withstanding capability and a high surge withstanding capability within the narrow chip area of a lateral MOSFET used in integrated intelligent switching devices, double-integration-type signal input and transfer IC's, and combined power IC's. The semiconductor device includes a vertical bipolar transistor in which a base is electrically connected to an emitter and a collector, and a lateral MOSFET including a drain electrode connected to a surface electrode. The vertical bipolar transistor absorbs electrostatic discharge or surge energy when a high electrostatic discharge voltage or a high surge voltage is applied and limits the electrostatic discharge voltage or the surge voltage to be lower than the breakdown voltage of the lateral MOSFET.
摘要:
A diode is provided which includes a first-conductivity-type cathode layer, a first-conductivity-type drift layer placed on the cathode region and having a lower concentration than the cathode layer, a generally ring-like second-conductivity-type ring region formed in the drift layer, second-conductivity-type anode region formed in the drift layer located inside the ring region, a cathode electrode formed in contact with the cathode layer, and an anode electrode formed in contact with the anode region, wherein the lowest resistivity of the second-conductivity-type anode region is at least 1/100 of the resistivity of the drift layer, and the thickness of the anode region is smaller than the diffusion depth of the ring region.
摘要:
A diode is provided which includes a first-conductivity-type cathode layer, a first-conductivity-type drift layer placed on the cathode region and having a lower concentration than the cathode layer, a generally ring-like second-conductivity-type ring region formed in the drift layer, second-conductivity-type anode region formed in the drift layer located inside the ring region, a cathode electrode formed in contact with the cathode layer, and an anode electrode formed in contact with the anode region, wherein the lowest resistivity of the second-conductivity-type anode region is at least {fraction (1/100)} of the resistivity of the drift layer, and the thickness of the anode region is smaller than the diffusion depth of the ring region.