STRUCTURE AND METHOD FOR THIN BOX SOI DEVICE
    82.
    发明申请
    STRUCTURE AND METHOD FOR THIN BOX SOI DEVICE 有权
    薄盒SOI器件的结构与方法

    公开(公告)号:US20060172499A1

    公开(公告)日:2006-08-03

    申请号:US10906014

    申请日:2005-01-31

    IPC分类号: H01L21/336

    摘要: A method of forming a semiconductor device, comprising providing a substrate having a first insulative layer on a surface of the substrate, and a device layer on a surface of the first insulative layer, forming a spacer around the first insulative layer and the device layer, removing a portion of the substrate adjacent to the first insulative layer in a first region and a non-adjacent second region of the substrate, such that an opening is formed in the first and second regions of the substrate, leaving the substrate adjacent to the first insulative layer in a third region of the substrate, filling the opening within the first and second regions of the substrate, planarizing a surface of the device, and forming a device within the device layer, such that diffusion regions of the device are formed within the device layer above the first and second regions of the substrate, and a channel region of the device is formed above the third region of the substrate.

    摘要翻译: 一种形成半导体器件的方法,包括在所述衬底的表面上提供具有第一绝缘层的衬底以及在所述第一绝缘层的表面上的器件层,在所述第一绝缘层和所述器件层周围形成间隔物, 在衬底的第一区域和不相邻的第二区域中移除邻近第一绝缘层的衬底的一部分,使得在衬底的第一和第二区域中形成开口,使衬底与第一绝缘层相邻, 在衬底的第三区域中的绝缘层,填充衬底的第一和第二区域内的开口,使器件的表面平坦化,以及在器件层内形成器件,使得器件的扩散区域形成在 器件层在衬底的第一和第二区域之上,并且器件的沟道区形成在衬底的第三区域上方。

    Methods and apparatus for providing an antifuse function
    89.
    发明授权
    Methods and apparatus for providing an antifuse function 有权
    提供反熔丝功能的方法和装置

    公开(公告)号:US06882027B2

    公开(公告)日:2005-04-19

    申请号:US10447018

    申请日:2003-05-28

    IPC分类号: H01L23/525 H01L29/00

    摘要: Methods and apparatus for providing an antifuse are disclosed, where the antifuse includes a semiconductor substrate having an active area circumscribed by a shallow trench isolation (STI) boundary; a gate conductor disposed above the semiconductor substrate and overlying at least a portion of the STI boundary; a dielectric disposed between the semiconductor substrate and the gate conductor; a first terminal coupled to the gate conductor; and a second terminal coupled to the semiconductor substrate, wherein a breakdown of the dielectric causes electrical connections between regions of the gate conductor and regions of the active area including substantially near the STI boundary.

    摘要翻译: 公开了用于提供反熔丝的方法和装置,其中反熔丝包括具有由浅沟槽隔离(STI)边界限定的有源区的半导体衬底; 栅极导体,其设置在所述半导体衬底上方并且覆盖所述STI边界的至少一部分; 设置在所述半导体衬底和所述栅极导体之间​​的电介质; 耦合到所述栅极导体的第一端子; 以及耦合到所述半导体衬底的第二端子,其中所述电介质的击穿导致所述栅极导体的区域和所述有源区域的区域之间的电连接包括基本上靠近所述STI边界。

    VOLTAGE DIVIDER FOR INTEGRATED CIRCUITS
    90.
    发明申请
    VOLTAGE DIVIDER FOR INTEGRATED CIRCUITS 失效
    用于集成电路的电压分压器

    公开(公告)号:US20050073354A1

    公开(公告)日:2005-04-07

    申请号:US10605466

    申请日:2003-10-01

    摘要: A voltage divider for integrated circuits that does not include the use of resistors. In one embodiment, voltage node VDD is connected with two n-type transistors, NFET1 and NFET2, which are connected in series. NFET 1 includes a source (12), a drain (14), a gate electrode (16) having a gate area A1 (not shown), and a p-substrate (18). NFET2 includes a source (20), a drain (22), a gate electrode (24) having a gate area A2 (not shown), and a p-substrate (26). Source (12) and drain (14) of NFET1 are coupled with gate electrode (24) of NFET2. The voltage difference between NFET1 and NFET2 has a linear function with VDD. As a result, voltage VDD may be divided between NFET1 and NFET2 by properly choosing the ratio between each of the respective transistor gate electrode areas, (A1) and (A2).

    摘要翻译: 用于集成电路的分压器,不包括使用电阻器。 在一个实施例中,电压节点VDD与串联连接的两个n型晶体管NFET1和NFET2连接。 NFET 1包括源极(12),漏极(14),具有栅极区域A1(未示出)的栅电极(16)和p衬底(18)。 NFET2包括源极(20),漏极(22),具有栅极区域A2(未示出)的栅电极(24)和p衬底(26)。 NFET1的源极(12)和漏极(14)与NFET2的栅电极(24)耦合。 NFET1和NFET2之间的电压差与VDD具有线性关系。 结果,通过适当地选择各个晶体管栅电极区域(A1)和(A2)之间的比率,可以在NFET1和NFET2之间划分电压VDD。