公开(公告)号：US07452808B2

公开(公告)日：2008-11-18

申请号：US10988768

申请日：2004-11-15

申请人： Simon Chooi ,  Yakub Aliyu ,  Mei Sheng Zhou ,  John Sudijono ,  Subhash Gupta ,  Sudipto Roy ,  Paul Ho ,  Yi Xu

发明人： Simon Chooi ,  Yakub Aliyu ,  Mei Sheng Zhou ,  John Sudijono ,  Subhash Gupta ,  Sudipto Roy ,  Paul Ho ,  Yi Xu

IPC分类号： H01L21/44

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/1147 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13147 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal bump thereover are provided. A conducting polymer plug is formed over the exposed metal terminating pad. A conforming interface layer is formed over the conducting polymer plug. The conducting polymer plug of the semiconductor chip is aligned with the corresponding metal bump. The conforming interface layer over the conducting polymer plug is mated with the corresponding metal bump. The conforming interface layer is thermally decomposed, adhering and permanently attaching the conducting polymer plug with the corresponding metal bump. Methods of forming and patterning a nickel carbonyl layer are also disclosed.

摘要翻译： 提供了具有暴露的金属端接垫的半导体芯片，以及在其上具有对应的暴露的金属凸块的单独的基板。 在暴露的金属端接垫上形成导电聚合物塞。 在导电聚合物塞上形成一个符合标准的界面层。 半导体芯片的导电聚合物插塞与相应的金属凸块对准。 导电聚合物塞上的一致界面层与相应的金属凸块配合。 一致的界面层被热分解，粘附和永久地附着导电聚合物塞与相应的金属凸块。 还公开了形成和图案化羰基镍层的方法。

公开(公告)号：US07290189B2

公开(公告)日：2007-10-30

申请号：US11091681

申请日：2005-03-28

申请人： Zhengrong Zhou ,  Yi Xu ,  Kai Yick

发明人： Zhengrong Zhou ,  Yi Xu ,  Kai Yick

IPC分类号： G01R31/28

CPC分类号： G01R35/005 ,  G01R31/2834

摘要： In one embodiment, a selection of plural testflows is first obtained. Each testflow specifies how automated test equipment (ATE) should test at least one device. Calibration information is then identified for each of the testflows, and redundancies in the identified calibration information are eliminated to compile a set of non-redundant information for performing a focused calibration over the ATE and selected testflows.

摘要翻译： 在一个实施例中，首先获得多个测试流的选择。 每个测试流程指定自动化测试设备（ATE）如何测试至少一个设备。 然后为每个测试流程识别校准信息，并且消除所识别的校准信息中的冗余以编译一组用于在ATE和所选择的测试流上进行聚焦校准的非冗余信息。

公开(公告)号：US07241592B2

公开(公告)日：2007-07-10

申请号：US09810428

申请日：2001-03-19

申请人： Magnus Hook ,  Yi Xu ,  Pietro Speziale ,  Livia Visal ,  Fabrizia Casolini ,  Joseph M. Patti ,  Pratiksha Patel ,  Paul Domanski

发明人： Magnus Hook ,  Yi Xu ,  Pietro Speziale ,  Livia Visal ,  Fabrizia Casolini ,  Joseph M. Patti ,  Pratiksha Patel ,  Paul Domanski

IPC分类号： C12P21/08 ,  C12N1/00 ,  A61K39/395 ,  A61K39/40 ,  C07K16/12

CPC分类号： C07K16/1271 ,  A61K39/085 ,  A61K2039/505 ,  C07K2317/76 ,  C07K2317/92 ,  C07K2319/00 ,  G01N33/56938 ,  G01N2333/31 ,  G01N2333/78 ,  G01N2500/00

摘要： Antibodies to the CNA protein and to other regions from the collagen binding domain, including domain CNA19, are provided, and antibodies produced in this manner have been shown to be cross reactive to both Staphylococcus aureus and Staphylococcus epidermidis bacteria and which can thus be used in the prevention and treatment of infections caused by both of these types of bacteria. In addition, medical instruments can be treated using the antibodies of the invention in order to reduce or eliminate the possibility of their becoming infected or further spreading the infection. In particular, the proteins are advantageous because they are cross-reactive and may thus be administered to patients so as to reduce or prevent severe infection by staphylococcal bacteria of more than one species. Antibodies generated in this manner have also been shown to exhibit displacement activity and can thus be utilized advantageously in methods wherein these antibodies will be administered to patients having pre-existing staphylococcal infections because of the ability to displace bacterial proteins from binding sites on the extracellular matrix. Finally, a method of identifying, isolating and utilizing displacing antibodies is also provided.

摘要翻译： 提供了对CNA蛋白和来自胶原结合结构域的其他区域（包括结构域CNA19）的抗体，并且以这种方式产生的抗体已显示与金黄色葡萄球菌和表皮葡萄球菌交叉反应，因此可以用于 预防和治疗由这两种细菌引起的感染。 此外，可以使用本发明的抗体治疗医疗器械，以便减少或消除它们被感染或进一步扩散感染的可能性。 特别地，蛋白质是有利的，因为它们是交叉反应性的，并且因此可以施用于患者，以便减少或预防多于一种物种的葡萄球菌细菌的严重感染。 以这种方式产生的抗体也已显示出显示置换活性，因此可有利地用于其中将这些抗体施用于具有预先存在的葡萄球菌感染的患者的方法，因为能够从细胞外基质上的结合位点置换细菌蛋白质 。 最后，还提供了鉴定，分离和利用置换抗体的方法。

公开(公告)号：US07195763B2

公开(公告)日：2007-03-27

申请号：US10911507

申请日：2004-08-05

申请人： Yi Xu ,  Magnus A. O. Hook

发明人： Yi Xu ,  Magnus A. O. Hook

IPC分类号： A61K39/395 ,  A61K39/00 ,  A61K39/40 ,  A61K45/00 ,  A61K47/00

CPC分类号： C07K14/3156 ,  A61K39/00 ,  A61K2039/505 ,  C07K14/31 ,  C07K14/315 ,  C07K16/1267 ,  Y10S930/29

摘要： Isolated peptide sequences and proteins containing these sequences are provided which are useful in the prevention and treatment of infection caused by Gram-positive bacteria. The peptide sequences have been shown to be highly conserved motifs in the surface proteins of Gram-positive bacteria, and these consensus sequences include amino acid sequences such as LPXTG (SEQ ID NO:13), ALKTGKIDIIISGMTSTPERKK (SEQ ID NO:14), VEGAVVEKPVAEAYLKQN (SEQ ID NO:15), and EYAGVDIDLAKKIAK (SEQ ID NO:16). By virtue of the highly conserved regions, the sequences and the proteins including these sequences can be utilized to generate antibodies which can recognize these highly conserved motifs and the proteins containing them and thus be useful in the treatment or prevention of a wide range of infections caused by Gram-positive bacteria.

摘要翻译： 提供了含有这些序列的分离的肽序列和蛋白质，其可用于预防和治疗由革兰氏阳性菌引起的感染。 已经显示肽序列在革兰氏阳性细菌的表面蛋白中是高度保守的基序，并且这些共有序列包括氨基酸序列，例如LPXTG（SEQ ID NO：13），ALKTGKIDIIISGMTSTPERKK（SEQ ID NO：14），VEGAVVEKPVAEAYLKQN （SEQ ID NO：15）和EYAGVDIDLAKKIAK（SEQ ID NO：16）。 由于高度保守的区域，包括这些序列的序列和蛋白质可用于产生能识别这些高度保守的基序和含有它们的蛋白质的抗体，因此可用于治疗或预防引起的广泛感染 通过革兰氏阳性菌。

公开(公告)号：US20060198852A1

公开(公告)日：2006-09-07

申请号：US11158163

申请日：2005-06-21

申请人： Magnus Hook ,  Yi Xu

发明人： Magnus Hook ,  Yi Xu

IPC分类号： C07K14/32 ,  C12N1/21 ,  C07H21/04 ,  C12N15/74 ,  A61K39/02

CPC分类号： C07K14/32 ,  A61K39/00 ,  A61K2039/53

摘要： The present invention provides cell wall anchored proteins of Bacillus anthracis representative of the MSCRAMM family of proteins and DNAs encoding the same. Also provided are collagen-binding peptides comprising the collagen-binding region A of the cell wall anchored proteins and DNAs encoding these peptides. Further provided are pharmaceutical compositions and immunogenic compositions thereof the cell wall anchored proteins, collagen-binding peptides and encoding DNAs. The immunogenic compositions are useful in methods of inducing an immune response against Bacillus anthracis.

摘要翻译： 本发明提供代表MSCRAMM家族蛋白质的炭疽芽孢杆菌的细胞壁锚定蛋白和编码它们的DNA。 还提供了包含细胞壁锚定蛋白的胶原结合区域A和编码这些肽的DNA的胶原结合肽。 还提供了细胞壁锚定蛋白，胶原结合肽和编码DNA的药物组合物及其免疫原性组合物。 免疫原性组合物可用于诱导针对炭疽杆菌的免疫应答的方法。

公开(公告)号：US06967162B2

公开(公告)日：2005-11-22

申请号：US10988769

申请日：2004-11-15

申请人： Simon Chooi ,  Yakub Aliyu ,  Mei Sheng Zhou ,  John Sudijono ,  Subhash Gupta ,  Sudipto Roy ,  Paul Ho ,  Yi Xu

发明人： Simon Chooi ,  Yakub Aliyu ,  Mei Sheng Zhou ,  John Sudijono ,  Subhash Gupta ,  Sudipto Roy ,  Paul Ho ,  Yi Xu

IPC分类号： H01L21/44 ,  H01L21/50 ,  H01L21/60 ,  H01L23/48 ,  H01L23/485 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/1147 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13147 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal bump thereover are provided. A conducting polymer plug is formed over the exposed metal terminating pad. A conforming interface layer is formed over the conducting polymer plug. The conducting polymer plug of the semiconductor chip is aligned with the corresponding metal bump. The conforming interface layer over the conducting polymer plug is mated with the corresponding metal bump. The conforming interface layer is thermally decomposed, adhering and permanently attaching the conducting polymer plug with the corresponding metal bump. Methods of forming and patterning a nickel carbonyl layer are also disclosed.

公开(公告)号：US06953839B2

公开(公告)日：2005-10-11

申请号：US10830792

申请日：2004-04-23

申请人： Magnus Höök ,  Slawomir Lukomski ,  Yi Xu

发明人： Magnus Höök ,  Slawomir Lukomski ,  Yi Xu

IPC分类号： C07H21/04 ,  C07K14/315 ,  C12N1/21 ,  C07K14/00

CPC分类号： C07H21/04 ,  C07K14/315

摘要： The present invention provides recombinant triple helical proteins or collagen-like proteins comprising a prokaryotic protein or one or more domains of a prokaryotic protein comprising a collagen-like peptide sequence of repeated Gly-Xaa-Yaa triplets and, optionally, one or more domains from a mammalian collagen. Also provided are expression vectors and host cells containing the expression vectors to produce these recombinant proteins and methods of production for the same. Additionally, antibodies are provided that are directed against a recombinant collagen-like protein that, preferably, binds an integrin. Furthermore, a method of screening for potential therapeutic compounds that inhibit the integrin-binding or -interacting activities of recombinant collagen-like proteins.

摘要翻译： 本发明提供重组三螺旋蛋白或胶原样蛋白，其包含原核蛋白或原核蛋白的一个或多个结构域，其包含重复Gly-Xaa-Yaa三联体的胶原样肽序列和任选的一个或多个结构域 哺乳动物胶原蛋白。 还提供了含有表达载体以产生这些重组蛋白的表达载体和宿主细胞及其生产方法。 此外，提供针对重组胶原样蛋白的抗体，其优选结合整联蛋白。 此外，筛选抑制重组胶原样蛋白的整联蛋白结合或相互作用活性的潜在治疗化合物的方法。

公开(公告)号：US20050090102A1

公开(公告)日：2005-04-28

申请号：US10988769

申请日：2004-11-15

申请人： Simon Chooi ,  Yakub Aliyu ,  Mei Zhou ,  John Sudijono ,  Subhash Gupta ,  Sudipto Roy ,  Paul Ho ,  Yi Xu

发明人： Simon Chooi ,  Yakub Aliyu ,  Mei Zhou ,  John Sudijono ,  Subhash Gupta ,  Sudipto Roy ,  Paul Ho ,  Yi Xu

IPC分类号： H01L21/44 ,  H01L21/50 ,  H01L21/60 ,  H01L23/48 ,  H01L23/485 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/1147 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13147 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal bump thereover are provided. A conducting polymer plug is formed over the exposed metal terminating pad. A conforming interface layer is formed over the conducting polymer plug. The conducting polymer plug of the semiconductor chip is aligned with the corresponding metal bump. The conforming interface layer over the conducting polymer plug is mated with the corresponding metal bump. The conforming interface layer is thermally decomposed, adhering and permanently attaching the conducting polymer plug with the corresponding metal bump. Methods of forming and patterning a nickel carbonyl layer are also disclosed.

摘要翻译： 提供了具有暴露的金属端接垫的半导体芯片，以及在其上具有对应的暴露的金属凸块的单独的基板。 在暴露的金属端接垫上形成导电聚合物塞。 在导电聚合物塞上形成一个符合标准的界面层。 半导体芯片的导电聚合物插塞与相应的金属凸块对准。 导电聚合物塞上的一致界面层与相应的金属凸块配合。 一致的界面层被热分解，粘附和永久地附着导电聚合物塞与相应的金属凸块。 还公开了形成和图案化羰基镍层的方法。

公开(公告)号：US06627778B2

公开(公告)日：2003-09-30

申请号：US09837986

申请日：2001-04-19

申请人： Yi Xu ,  Peicheng Wu ,  Yu Wang ,  Dong Liu ,  Zhengguo Ling ,  Xiaolei Huang

发明人： Yi Xu ,  Peicheng Wu ,  Yu Wang ,  Dong Liu ,  Zhengguo Ling ,  Xiaolei Huang

IPC分类号： C07C503

CPC分类号： C07C11/02 ,  C07C7/163 ,  C07C2521/04 ,  C07C2523/04 ,  C07C2523/14 ,  C07C2523/44 ,  C07C2523/50 ,  C07C2523/52

摘要： The present invention provides an improved selective hydrogenation process for removing C10-C16 diolefins in the product from dehydrogenation of C10-C16 paraffins to mono-olefins, which process includes bringing the mixture stream of paraffins and olefins containing C10-C16 mono-olefins and C10-C16 diolefins into contact with a specific hydrogenation catalyst in a plurality of hydrogenation reactors connected in series under the reaction conditions for hydrogenation. Hydrogen is injected into each reactor respectively. To convert the diolefins in the mixture stream of paraffins and olefins into mono-olefins, &ggr;-alumina having a specific surface area of 50-300 m2/g and a pore volume of 0.2-2.0 cm3/g is used as the supporter of the hydrogenation catalyst, palladium is supported on the supporter as the main catalyst element and an element selected from silver, gold, tin, lead or potassium is supported on the supporter as the promoter.

摘要翻译： 本发明提供了一种改进的选择性氢化方法，用于从C10-C16链烷烃脱氢成单烯烃中除去产物中的C 10 -C 16二烯烃，该方法包括使含有C 10 -C 16单烯烃和C 10 -C 16单烯烃的链烷烃和烯烃的混合物流 -C16二烯烃与在氢化反应条件下串联连接的多个氢化反应器中的特定氢化催化剂接触。 将氢气分别注入每个反应器。 为了将链烷烃和烯烃的混合物流中的二烯烃转化为单烯烃，比表面积为50-300m 2 / g，孔体积为0.2-2.0cm 3 / g的γ-氧化铝为 作为氢化催化剂的载体，钯作为主要催化剂元素负载在载体上，并且选自银，金，锡，铅或钾的元素作为助催化剂负载在载体上。

公开(公告)号：US06436824B1

公开(公告)日：2002-08-20

申请号：US09346526

申请日：1999-07-02

申请人： Simon Chooi ,  Mei Sheng Zhou ,  Yi Xu

发明人： Simon Chooi ,  Mei Sheng Zhou ,  Yi Xu

IPC分类号： H01L2144

CPC分类号： H01L21/02211 ,  H01L21/02167 ,  H01L21/02274 ,  H01L21/3125 ,  H01L21/314 ,  H01L21/76807

摘要： Novel low dielectric constant materials for use as dielectric in the dual damascene process are provided. A low dielectric constant material dielectric layer is formed by reacting a nitrogen-containing precursor and a substituted organosilane in a plasma-enhanced chemical deposition chamber. Also, novel low dielectric constant materials for use as a passivation or etch stop layer in the dual damascene process are provided. A carbon-doped silicon nitride passivation or etch stop layer having a low dielectric constraint is formed by reacting a substituted ammonia precursor and a substituted organosilane in a plasma-enhanced chemical deposition chamber. Alternatively, a silicon-carbide passivation or etch stop layer having a low dielectric constant is formed by reacting a substituted organosilane in a plasma-enhanced chemical deposition chamber. Also, an integrated process of forming passivation, dielectric, and etch stop layers for use in the dual damascene process is described.

摘要翻译： 提供了用于双镶嵌工艺中的电介质的新型低介电常数材料。 通过在等离子体增强化学沉积室中使含氮前体和取代的有机硅烷反应形成低介电常数材料介电层。 此外，提供了用于双镶嵌工艺中的钝化或蚀刻停止层的新型低介电常数材料。 通过在等离子体增强化学沉积室中使取代的氨前体和取代的有机硅烷反应形成具有低介电约束的碳掺杂的氮化硅钝化或蚀刻停止层。 或者，通过在等离子体增强化学沉积室中使取代的有机硅烷反应形成具有低介电常数的碳化硅钝化或蚀刻停止层。 此外，描述了形成用于双镶嵌工艺中的钝化，电介质和蚀刻停止层的集成工艺。