公开(公告)号：US08792208B1

公开(公告)日：2014-07-29

申请号：US13481158

申请日：2012-05-25

申请人： Feng Liu ,  Yugang Wang ,  Zhigang Bai ,  Hongzhou Jiang ,  Tao Pan ,  Shaoping Li

发明人： Feng Liu ,  Yugang Wang ,  Zhigang Bai ,  Hongzhou Jiang ,  Tao Pan ,  Shaoping Li

IPC分类号： G11B5/11

CPC分类号： G11B5/3163 ,  G11B5/1278 ,  G11B5/3116 ,  G11B5/315

摘要： A method and system provide a magnetic recording transducer having air-bearing surface (ABS). The magnetic recording transducer includes a pole, a side shield, a nonmagnetic gap between the side shield and the pole and at least one coil for energizing the pole. The pole has a pole tip proximate to the ABS. The side shield includes at least one nonconformal portion that extends from a throat height in a stripe height direction perpendicular to the ABS and is nonconformal with the pole. The spacing between the nonconformal portion(s) of the side shield and the pole varies based on a distance from the ABS.

摘要翻译： 一种方法和系统提供具有空气轴承表面（ABS）的磁记录换能器。 磁记录传感器包括极，侧屏蔽，侧屏蔽和极之间的非磁性间隙，以及至少一个用于激励磁极的线圈。 极杆具有靠近ABS的极尖。 所述侧护罩包括至少一个非整形部分，其从与所述ABS垂直的条带高度方向上的喉部高度延伸并且与所述杆不一致。 侧护罩的非共形部分和极之间的间距基于距离ABS的距离而变化。

公开(公告)号：US08724259B1

公开(公告)日：2014-05-13

申请号：US13493903

申请日：2012-06-11

申请人： Feng Liu ,  Dehua Han ,  Yugang Wang ,  Zhigang Bai ,  Tao Pan

发明人： Feng Liu ,  Dehua Han ,  Yugang Wang ,  Zhigang Bai ,  Tao Pan

IPC分类号： G11B5/147

CPC分类号： G11B5/11 ,  G11B5/1278 ,  G11B5/23 ,  G11B5/3116 ,  G11B5/315 ,  G11B5/4886

摘要： A perpendicular magnetic recording writer for use in a data storage device, the recording transducer has a magnetic writer pole, a pole tip facing an air bearing surface (ABS). The pole tip has a pole face, leading side wall, a trailing side wall, a first side wall and a second side wall. A trailing side wall nonmagnetic gap layer on the trailing side wall, a first side wall nonmagnetic gap layer deposited on the first side wall, and a second side wall nonmagnetic gap layer deposited on the second side wall. A high magnetic moment seed layer is deposited on the trailing side wall nonmagnetic gap layer, the first side wall nonmagnetic gap layer, and the second side wall nonmagnetic gap layer. In other aspects of the invention shields are provided that have magnetic moments less than the magnetic moment of the seed layers.

摘要翻译： 一种在数据存储装置中使用的垂直磁记录刻录机，记录换能器具有磁写入极，极尖面向空气轴承表面（ABS）。 极尖具有极面，前侧壁，后侧壁，第一侧壁和第二侧壁。 在后侧壁上的后侧壁非磁性间隙层，沉积在第一侧壁上的第一侧壁非磁性间隙层和沉积在第二侧壁上的第二侧壁非磁性间隙层。 在后侧壁非磁性间隙层，第一侧壁非磁性间隙层和第二侧壁非磁性间隙层上沉积高磁矩种子层。 在本发明的其它方面，提供了具有小于种子层的磁矩的磁矩的屏蔽。

公开(公告)号：US08693141B1

公开(公告)日：2014-04-08

申请号：US13291766

申请日：2011-11-08

申请人： Carl F. Elliott ,  Zhigang Bai ,  Tao Pan

发明人： Carl F. Elliott ,  Zhigang Bai ,  Tao Pan

IPC分类号： G11B5/48

CPC分类号： G11B5/4853 ,  G11B5/17

摘要： Systems and methods for providing stacked writer leads for magnetic transducers used in disk drives are provided. One such system for providing stacked writer leads for a magnetic transducer includes a writer coil for the magnetic transducer, a first pad on the magnetic transducer, a second pad on the magnetic transducer, a first circuit trace coupled to the first pad and a first terminal of the writer coil, and a second circuit trace coupled to the second pad and a second terminal of the writer coil, where a preselected length of the first circuit trace and the second circuit trace is configured in a stacked configuration where each of the preselected lengths of the first circuit trace and the second circuit trace is positioned at about the same location in spaced apart planes.

摘要翻译： 提供了用于为磁盘驱动器中使用的磁换能器提供堆叠写入引线的系统和方法。 一种用于提供用于磁换能器的堆叠写入器引线的这种系统包括用于磁换能器的写入器线圈，磁换能器上的第一焊盘，磁换能器上的第二焊盘，耦合到第一焊盘的第一电路迹线和第一端 以及耦合到第二焊盘的第二电路迹线和写入器线圈的第二端子，其中第一电路迹线和第二电路迹线的预选长度被配置为堆叠配置，其中每个预选长度 并且第二电路迹线位于间隔开的平面中的大致相同的位置处。

公开(公告)号：US20140034273A1

公开(公告)日：2014-02-06

申请号：US13882154

申请日：2011-08-29

申请人： Honghui Shi ,  Qingzhong Ma ,  Jin Wang ,  Jiayong Lu ,  Longying Zhang ,  Zhigang Bai

发明人： Honghui Shi ,  Qingzhong Ma ,  Jin Wang ,  Jiayong Lu ,  Longying Zhang ,  Zhigang Bai

IPC分类号： F28B1/06

CPC分类号： F28B1/06 ,  F01K9/00 ,  F28B7/00 ,  F28D7/163 ,  F28F9/26

摘要： An evaporative condenser radiating module for steam exhaust of a steam turbine comprises tube bundles and steam-water separating chambers. A steam-water separating chamber (4) between a section A and a section B, a section A downflow cooling section tube bundle (3), a section B downflow cooling section tube bundle (5), and a section C counter flow cooling section tube bundle (8) are disposes at the left side of a central steam-water separating chamber (7). An upper sealed space (10) of the steam-water separating chamber (4) between the section A and the section B is in communication with the central steam-water separating chamber (7) through the section C counter flow cooling section tube bundle (8). A lower sealed space of the steam-water separating chamber (4) between the section A and the section B is in communication with the central steam-water separating chamber (7) through the section B downflow cooling section tube bundle (5). A sealed section A steam entering chamber (2) is arranged on the left side of the steam-water separating chamber (4) between the section A and the section B. The section A downflow cooling section tube bundle (3) is arranged between the section A steam entering chamber (2) and the lower sealed space of the steam-water separating chamber (4) between the section A and the section B. The right side of the central steam-water separating chamber (7) is provided with tube bundles and steam-water separating chambers totally structurally identical with those arranged on the left side of the central steam-water separating chamber (7).

摘要翻译： 用于汽轮机蒸汽排气的蒸发冷凝器辐射模块包括管束和蒸汽 - 水分离室。 A部分和B部分之间的蒸汽 - 水分离室（4），A部分下降冷却部分管束（3），B部分下降冷却部分管束（5）和C部逆流冷却部分 管束（8）配置在中央蒸汽 - 水分离室（7）的左侧。 部分A和部分B之间的蒸汽 - 水分离室（4）的上部密封空间（10）通过部分C逆流冷却部分管束与中央蒸汽 - 水分离室（7）连通 8）。 部分A和部分B之间的蒸汽 - 水分离室（4）的下部密封空间通过部分B下降冷却部分管束（5）与中央蒸汽 - 水分离室（7）连通。 密封部分A蒸汽进入室（2）布置在部分A和部分B之间的蒸汽 - 水分离室（4）的左侧。部分A下降冷却部分管束（3）布置在 部分A蒸汽进入室（2）和蒸汽 - 水分离室（4）的下部密封空间在部分A和部分B之间。中央蒸汽 - 水分离室（7）的右侧设有管 束和蒸汽 - 水分离室在结构上与布置在中央蒸汽 - 水分离室（7）左侧的那些分离室完全相同。

公开(公告)号：US08547659B1

公开(公告)日：2013-10-01

申请号：US13103872

申请日：2011-05-09

申请人： Zhigang Bai ,  Zhanjie Li ,  Sharat Batra

发明人： Zhigang Bai ,  Zhanjie Li ,  Sharat Batra

IPC分类号： G11B5/127 ,  G11B5/17

CPC分类号： G11B5/3116 ,  G11B5/17 ,  G11B5/3123

摘要： A method and system for providing a magnetic recording head is described. The magnetic recording head has an air-bearing surface (ABS) configured to reside in proximity to a media during use. The head includes a first coil, a second coil, a main pole, and a third coil. The first coil has a first plurality of turns and is configured to carry a first write current in a first direction. The second coil has a second plurality of turns and is configured to carry a second write current in a second direction. The main pole is between the first coil and the second coil. The third coil has a third plurality of turns configured to carry a third write current in a third direction.

摘要翻译： 描述了一种用于提供磁记录头的方法和系统。 磁记录头具有在使用期间被配置为驻留在介质附近的空气轴承表面（ABS）。 头包括第一线圈，第二线圈，主极和第三线圈。 第一线圈具有第一多个匝并且被配置为沿第一方向承载第一写入电流。 第二线圈具有第二多个匝，并被配置为在第二方向上承载第二写入电流。 主极在第一线圈和第二线圈之间。 第三线圈具有构造为在第三方向上承载第三写入电流的第三多个匝。

公开(公告)号：US20130249071A1

公开(公告)日：2013-09-26

申请号：US13854140

申请日：2013-04-01

申请人： Jinzhong Yao ,  Zhigang Bai ,  Yuan Zang

发明人： Jinzhong Yao ,  Zhigang Bai ,  Yuan Zang

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/495 ,  B29C33/005 ,  B29C45/14221 ,  B29C45/14655 ,  H01L21/4842 ,  H01L21/561 ,  H01L21/565 ,  H01L23/49555 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A method of assembling a semiconductor device includes providing a lead frame having a die pad and a fame member with lead fingers that surround the die pad. The lead fingers have distal ends connected to the frame member and proximal ends near the die pad. A die is attached to the die pad and die connection pads are electrically connected to the proximal ends of the lead fingers with bond wires. The die, bond wires, and part of the lead fingers are encapsulated with an encapsulant. The encapsulating process includes separating the lead fingers into first and second sets of lead fingers. The proximal ends of the first set lie in a first plane and the proximal ends of the second set lie in a second plane that is spaced and maintained from the first plane solely by the encapsulation material.

摘要翻译： 一种组装半导体器件的方法包括提供引线框架，该引线框架具有管芯焊盘和引导指围绕管芯焊盘的成形构件。 引线指具有连接到框架构件的远端和靠近管芯焊盘的近端。 模具附接到管芯焊盘，管芯连接焊盘通过接合线电连接到引线指的近端。 管芯，接合线和引线的一部分用密封剂封装。 封装过程包括将引线分离成第一和第二组引线指。 第一组的近端位于第一平面中，并且第二组的近端位于第二平面中，第二平面仅与第一平面间隔开并由包封材料保持。

公开(公告)号：US08536684B2

公开(公告)日：2013-09-17

申请号：US13092162

申请日：2011-04-22

申请人： Wei Min Chen ,  Zhigang Bai ,  Zhijie Wang

发明人： Wei Min Chen ,  Zhigang Bai ,  Zhijie Wang

IPC分类号： H01L23/29

CPC分类号： H01L23/552 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/29 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/85 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of assembling an integrated circuit (IC) device includes the steps of providing a lead frame or substrate panel, attaching a semiconductor die to the lead frame or substrate panel and electrically coupling the die to the lead frame or substrate panel. The method further includes encapsulating the die with a first encapsulant, and the encapsulating the first encapsulant with a second encapsulant where the second encapsulant includes a material that provides electromagnetic shielding.

摘要翻译： 一种组装集成电路（IC）器件的方法包括以下步骤：提供引线框架或衬底面板，将半导体管芯附接到引线框架或衬底面板，并将管芯电耦合到引线框架或衬底面板。 该方法还包括用第一密封剂封装管芯，并用第二密封剂封装第一密封剂，其中第二密封剂包括提供电磁屏蔽的材料。

公开(公告)号：US20130234306A1

公开(公告)日：2013-09-12

申请号：US13605990

申请日：2012-09-06

申请人： Shunan Qiu ,  Zhigang Bai ,  Haiyan Liu

发明人： Shunan Qiu ,  Zhigang Bai ,  Haiyan Liu

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49558 ,  H01L23/3107 ,  H01L23/49541 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/00

摘要： A lead frame has a flag, a peripheral frame, and main tie bars coupling the flag to the peripheral frame. At least one cross tie bar extends between two of the main tie bars and an inner row of external connector pads extending from an inner side of the cross tie bar and an outer row of external connector pads extending from an outer side of the cross tie bar. Both an inner non-electrically conductive support bar and an outer non-electrically conductive support bar are attached across the two of the main tie bars. The inner non-electrically conductive support bar is attached to upper surfaces of the two of the main tie bars and to upper surfaces of the inner row of the external connector pads.

摘要翻译： 引线框架具有标志，外围框架和将标志耦合到外围框架的主连接条。 至少一个交叉连接杆在两个主连接杆之间延伸，以及从交叉连接杆的内侧延伸的内排的外部连接器焊盘以及从交叉连接杆的外侧延伸的外部排的外部连接器焊盘 。 内部非导电支撑杆和外部非导电支撑杆都穿过两个主连接杆。 内部非导电支撑杆附接到两个主连杆的上表面和外部连接器垫的内排的上表面。

公开(公告)号：US08405930B1

公开(公告)日：2013-03-26

申请号：US13070279

申请日：2011-03-23

申请人： Zhanjie Li ,  Zhigang Bai ,  Feng Liu ,  Yugang Wang

发明人： Zhanjie Li ,  Zhigang Bai ,  Feng Liu ,  Yugang Wang

IPC分类号： G11B5/147

CPC分类号： G11B5/3116 ,  G11B5/1278 ,  Y10T29/49044

摘要： A method and system for providing a magnetic recording head is described. The magnetic recording head has an ABS configured to reside in proximity to a media during use. The magnetic recording head includes a main pole, first and second auxiliary poles, a backgap, a nonmagnetic spacer, and at least one coil. The main pole includes a pole tip occupying a portion of the ABS and a back edge distal from the ABS. Each auxiliary pole has a front recessed from the ABS and a back portion. A portion of the main pole distal from the ABS resides between the auxiliary poles. The auxiliary poles are magnetically coupled with the main pole. The backgap magnetically couples the back portions of the auxiliary poles. The nonmagnetic spacer adjoins the back edge of the main pole and is between the auxiliary poles. The coil(s) energize the main pole.

摘要翻译： 描述了一种用于提供磁记录头的方法和系统。 磁记录头具有被配置为在使用期间驻留在介质附近的ABS。 磁记录头包括主极，第一和第二辅助极，后隙，非磁性间隔物和至少一个线圈。 主杆包括占据ABS的一部分的极尖和远离ABS的后边缘。 每个辅助杆具有从ABS的前凹部和后部。 远离ABS的主极的一部分位于辅助极之间。 辅助极与主极磁耦合。 后隙磁耦合辅助杆的后部。 非磁性隔离物邻接主极的后边缘并在辅助极之间。 线圈给主极通电。

公开(公告)号：US20130049183A1

公开(公告)日：2013-02-28

申请号：US13549518

申请日：2012-07-16

申请人： Jinzhong YAO ,  Zhigang Bai ,  Xuesong Xu

发明人： Jinzhong YAO ,  Zhigang Bai ,  Xuesong Xu

IPC分类号： H01L23/495 ,  H01L21/50

CPC分类号： H01L23/49537 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49551 ,  H01L23/49568 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/13101 ,  H01L2224/1329 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92242 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/00012

摘要： A method of packaging a power semiconductor die includes providing a first lead frame of a dual gauge lead frame. The first lead frame includes a thick die pad. A tape is attached to a first side of the thick die pad and the power die is attached to a second side of the thick die pad. A second lead frame of the dual gauge lead frame is provided. The second lead frame has thin lead fingers. One end of the lead fingers is attached to an active surface of the power die such that the lead fingers are electrically connected to bonding pads of the power die. A molding compound is then dispensed onto a top surface of the dual gauge lead frame such that the molding compound covers the power die and the lead fingers.

摘要翻译： 封装功率半导体管芯的方法包括提供双量规引线框架的第一引线框架。 第一引线框架包括厚的芯片焊盘。 磁带附着到厚芯片焊盘的第一侧，并且功率管芯附接到厚芯片焊盘的第二侧。 提供了双量规引线框架的第二引线框架。 第二引线框架具有薄的引线指。 引线指的一端连接到功率管芯的有源表面，使得引线指电连接到功率管芯的焊盘。 然后将模塑料分配到双量规引线框架的顶表面上，使得模制化合物覆盖电源模具和引线指。