公开(公告)号：US20120315739A1

公开(公告)日：2012-12-13

申请号：US13581011

申请日：2011-02-16

申请人： Tomohiro Hashii ,  Yuichi Kakizono ,  Yoshiaki Kurosawa

发明人： Tomohiro Hashii ,  Yuichi Kakizono ,  Yoshiaki Kurosawa

IPC分类号： H01L21/78

CPC分类号： B24B37/042 ,  B24B9/065 ,  B24B27/0633 ,  B24B37/08 ,  B24B37/245 ,  B28D5/0076 ,  H01L21/02008 ,  H01L21/02013 ,  H01L21/02021 ,  H01L21/02024

摘要： All treatments performed in machining processes other than a polishing process are performed while pure water free from free abrasive grains is supplied. Thus, an amount of abrasive grains included in a used processing liquid discharged in each process is reduced and semiconductor scraps are collected from the used slurry for recycling.

摘要翻译： 在进行抛光处理以外的加工工序中进行的所有处理都是在不含有游离磨粒的纯水的情况下进行的。 因此，减少了在各工序中排出的使用过的处理液中所含的磨粒的量，并将二氧化硅废料从废浆中回收再循环。

公开(公告)号：US20120298091A1

公开(公告)日：2012-11-29

申请号：US13577051

申请日：2010-02-08

申请人： Toyohiro Hoshiyama ,  Shoji Imakurusu ,  Hiroyuki Yoshimura ,  Tatsumi Hamasaki

发明人： Toyohiro Hoshiyama ,  Shoji Imakurusu ,  Hiroyuki Yoshimura ,  Tatsumi Hamasaki

IPC分类号： B28D5/04

CPC分类号： B26B27/002 ,  B23D57/0023 ,  B23D57/0053 ,  B23D57/0069 ,  B24B27/0633 ,  B28D5/045

摘要： The present invention provides a wire saw which cuts a workpiece using a cutting wire and is capable of adjusting wire tension with high responsiveness. The wire saw includes first and second workpiece cutting units 1A and 1B. Each of the workpiece cutting units 1A and 1B includes a pair of guide rollers 10a and 10b around which a wire W is wound to form a workpiece-cutting wire group. The wire saw further includes a tension detector 18 which detects tension in the wire W between the workpiece cutting units 1A and 1B, and a control device 50. The control device 50 changes a rotational speed of the guide rollers 10a and 10b of at least one of the workpiece cutting units based on the tension detected by the tension detector 18 so as to keep the tension within an acceptable range.

摘要翻译： 本发明提供一种线锯，其使用切割线切割工件，并且能够以高响应性调节线张力。 线锯包括第一和第二工件切割单元1A和1B。 每个工件切割单元1A和1B包括一对引导辊10a和10b，绕线W缠绕在其上以形成工件切割线组。 线锯进一步包括检测工件切割单元1A和1B之间的线W中的张力的张力检测器18和控制装置50.控制装置50将导辊10a和10b的旋转速度改变为至少一个 基于由张力检测器18检测到的张力的工件切割单元，以将张力保持在可接受的范围内。

公开(公告)号：US20120289126A1

公开(公告)日：2012-11-15

申请号：US13472179

申请日：2012-05-15

申请人： Brahmanandam V. Tanikella ,  Palaniappan Chinnakaruppan ,  Robert A. Rizzuto ,  Isaac K. Cherian ,  Ramanujam Veddantham

发明人： Brahmanandam V. Tanikella ,  Palaniappan Chinnakaruppan ,  Robert A. Rizzuto ,  Isaac K. Cherian ,  Ramanujam Veddantham

IPC分类号： B24B1/00

CPC分类号： C30B29/20 ,  B24B7/228 ,  B24B27/0633 ,  B24D3/06 ,  B24D5/06 ,  H01L21/0242 ,  H01L23/15 ,  H01L2924/0002 ,  H04L29/12028 ,  H04L29/12594 ,  H04L61/103 ,  H04L61/3065 ,  H04L67/327 ,  Y10T428/21 ,  Y10T428/24355 ,  H01L2924/00

摘要： A sapphire substrate includes a generally planar surface having a crystallographic orientation selected from the group consisting of a-plane, r-plane, m-plane, and c-plane orientations, and having a nTTV of not greater than about 0.037 μm/cm2, wherein nTTV is total thickness variation normalized for surface area of the generally planar surface, the substrate having a diameter not less than about 9.0 cm.

摘要翻译： 蓝宝石衬底包括具有选自由a面，r面，m面和c面取向组成的组的结晶取向并且具有不大于约0.037μm/ cm 2的nTTV的大致平坦表面， 其中nTTV是对于大致平坦的表面的表面积进行标准化的总厚度变化，所述基底的直径不小于约9.0cm。

公开(公告)号：US08291895B2

公开(公告)日：2012-10-23

申请号：US12205046

申请日：2008-09-05

申请人： Tangali Sudarshan ,  Igor Agafonov ,  Robert Kennedy

发明人： Tangali Sudarshan ,  Igor Agafonov ,  Robert Kennedy

IPC分类号： B28D1/08

CPC分类号： B23D61/185 ,  B05C3/125 ,  B05C9/10 ,  B05C9/12 ,  B05C9/14 ,  B05C19/04 ,  B23D65/00 ,  B24B27/0633 ,  B28D1/124 ,  B28D5/0082 ,  B28D5/045 ,  C23C24/106

摘要： Methods, wires, and apparatus for use in cutting (e.g., slicing) hard, brittle materials is provided. The wire can be a super-abrasive wire that includes a wire core and super-abrasive particles bonded to the wire core via a metal bonding layer. This wire, or another type of wire, can be used to slice workpieces useful for producing wafers. The workpieces can be aligned within a holder to produce wafers using the device and methods presently provided. The holder rotates about its central axis, which translates to workpieces moving in orbit around this axis. A single abrasive wire, or multiple turns of wire stretched tightly between wire guides, is then contacted with the rotating holder to slice the workpieces.

摘要翻译： 提供了用于切割（例如，切片）硬的脆性材料的方法，电线和设备。 线可以是超研磨线，其包括线芯和通过金属结合层结合到线芯的超研磨颗粒。 该线材或另一种类型的线材可用于切割用于生产晶片的工件。 工件可以在保持器内对准以使用目前提供的装置和方法来生产晶片。 保持架绕其中心轴线旋转，这转动成围绕该轴线在轨道上移动的工件。 然后将单个研磨线或在导线器之间紧紧拉紧的多根线材与旋转的保持器接触以切割工件。

公开(公告)号：US08267742B2

公开(公告)日：2012-09-18

申请号：US12451669

申请日：2008-05-02

申请人： Koji Kitagawa

发明人： Koji Kitagawa

IPC分类号： B24B49/00

CPC分类号： B28D5/045 ,  B24B27/0633 ,  B28D5/0064 ,  B28D5/007 ,  Y02P70/179

摘要： The present invention is a slicing method and a wire saw apparatus including winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the wire to travel in a reciprocating direction, in which the ingot is sliced with controlling a temperature of the ingot by supplying a slurry for adjusting an ingot temperature to the ingot independently from the slurry for slicing while the slurry for adjusting an ingot temperature is supplied to the ingot only at the exit side of the wire caused to travel in the reciprocating direction. As a result, there is provided a method and a wire saw apparatus in which rapid cooling of an ingot especially in a time close to end of slicing of the ingot can be alleviated, consequently degradation of a nano-topography can be suppressed, and further high-quality wafers having a uniform thickness can be sliced when slicing the ingot by using a wire saw.

摘要翻译： 本发明是一种切片方法和线锯装置，其特征在于，绕着多个带槽的辊子缠绕线材，并将线材压在锭子上以切片成晶片，同时向槽形辊供给用于切片的浆料并使线材行进 在往复方向上，通过向用于切片的浆料供给独立于切片用浆料的锭供给用于锭的温度的浆料，通过供给用于锭的温度的浆料来切割锭料，同时将用于调节锭温度的浆料仅供给到锭料 在导线的出口侧沿往复方向行进。 结果，提供了一种方法和线锯装置，其中特别是在接近锭锭切割结束的时间内的锭的快速冷却可以减轻，从而可以抑制纳米形貌的劣化，并且进一步 通过使用线锯对锭进行切片时，可以切割具有均匀厚度的高质量晶片。

公开(公告)号：US08256407B2

公开(公告)日：2012-09-04

申请号：US12666721

申请日：2007-06-27

申请人： Takafumi Kawasaki ,  Seiichi Mimura ,  Hirokazu Nishida

发明人： Takafumi Kawasaki ,  Seiichi Mimura ,  Hirokazu Nishida

IPC分类号： B28D1/06

CPC分类号： B24B27/0633 ,  B23D57/0023 ,  B23D57/0061 ,  B28D5/045

摘要： To provide a multi-wire saw that, at the start of cutting of an ingot, prevents a wire from being displaced in grooves of guide rollers due to the wire being lifted. A wire is wound around a plurality of wire guide rollers to be positioned in a feeding direction of an ingot, and in this state, a wire-lifting restraining member that is a body of rotation and restrains the wire from being lifted by being brought into contact with the wire is disposed near the wire guide rollers.

摘要翻译： 为了提供一种多线锯，其在开始切割锭时，由于导线被提升而防止导线在导向辊的槽中移位。 电线缠绕在多个电线导向辊上以沿铸锭的进给方向定位，并且在该状态下，作为转动体的线材举升限制部件被限制，并且通过进入 与导丝线接触设置在导丝辊附近。

公开(公告)号：US20120214385A1

公开(公告)日：2012-08-23

申请号：US13500572

申请日：2009-10-16

申请人： Linda Yi-Ping Zhu ,  Wanglin Yu ,  Fang Li ,  Daniel A. Aguilar ,  David B. Wurm

发明人： Linda Yi-Ping Zhu ,  Wanglin Yu ,  Fang Li ,  Daniel A. Aguilar ,  David B. Wurm

IPC分类号： B26D1/547 ,  C08K5/06

CPC分类号： C10M111/04 ,  B24B27/0633 ,  B28D5/045 ,  C10M169/044 ,  C10M173/02 ,  C10M2201/02 ,  C10M2201/061 ,  C10M2201/10 ,  C10M2209/084 ,  C10M2209/086 ,  C10M2209/1045 ,  C10N2230/02 ,  C10N2230/04 ,  C10N2240/401 ,  C10M2209/104 ,  C10M2209/109

摘要： Cutting fluids for brittle materials, e.g., silicon ingot, comprise, in weight percent: A. 70-99% polyalkylene glycol (PAG), e.g., polyethylene glycol; B. 0.01-10% PAG-grafted polycarboxylate; and C. 0-30% water. These cutting fluids are used with abrasive materials, e.g., silicon carbide (SiC), to form cutting slurries. The slurry is sprayed on the cutting tool, e.g., a wire saw, to cut a brittle work piece, e.g., a silicon ingot.

摘要翻译： 用于脆性材料例如硅锭的切削液包含重量百分比：A.70-99％的聚亚烷基二醇（PAG），例如聚乙二醇; B. 0.01-10％PAG接枝的聚羧酸酯; 和0-30％的水。 这些切削液与研磨材料（例如碳化硅（SiC））一起使用以形成切割浆料。 将浆料喷涂在切割工具，例如线锯上，以切割脆性工件，例如硅锭。

公开(公告)号：US08206472B2

公开(公告)日：2012-06-26

申请号：US11571121

申请日：2005-12-27

申请人： Yasuhiro Tani ,  Yukinobu Tokunaga ,  Kazumasa Tsuchihashi

发明人： Yasuhiro Tani ,  Yukinobu Tokunaga ,  Kazumasa Tsuchihashi

IPC分类号： B24D3/00 ,  B24D99/00

CPC分类号： B24B27/0633 ,  B23D61/185 ,  B24D3/06

摘要： There is provided a fixed abrasive wire having abrasives fixed thereon with a superior fixing strength. The abrasives are fixed on the wire by electroplating in which the wire is subjected to a degreasing step, an acid cleaning step, a rinsing step and an electroplating step sequentially. A plating liquid used in the electroplating step contains a nickel-containing organic acid or a nickel-containing inorganic acid, a leveling agent, and the abrasives. It is a feature that a plated coat being over the top of each of the abrasives has a smaller thickness than a theoretical value.

摘要翻译： 提供了一种具有固定在其上的具有优良固定强度的磨料的固定磨料线。 通过电镀将研磨剂固定在电线上，其中电线经历脱脂步骤，酸洗步骤，漂洗步骤和电镀步骤。 电镀工序中使用的电镀液含有含镍有机酸或含镍无机酸，流平剂，研磨剂等。 每个研磨剂顶部的电镀涂层的厚度比理论值的厚度小。

公开(公告)号：US07959491B2

公开(公告)日：2011-06-14

申请号：US12734452

申请日：2008-12-01

申请人： Koji Kitagawa

发明人： Koji Kitagawa

IPC分类号： B24B49/00

CPC分类号： B28D5/045 ,  B24B27/0633 ,  B28D5/0064 ,  B28D5/007 ,  Y02P70/179

摘要： The present invention is a wire saw in which a wire is wound around a plurality of grooved rollers, the workpiece is sliced into wafers by causing the wire to travel and pressing the workpiece against the wire while a slurry is supplied to the grooved rollers, the wire saw controlling in such a manner that the workpiece is sliced while a supply temperature of the slurry is increased from the start to the end of slicing the workpiece. As a result, there is provided a wire saw in which Warp of the workpiece to be sliced can be improved by suppressing a decrease in a temperature of the workpiece in the vicinity of the slicing end portion of the workpiece and by making an increase in displacement of the grooved roller during slicing straight, that is, by making the slicing trajectory depicted in the workpiece close to a straight line.

摘要翻译： 本发明是一种线锯，其中绕线缠绕在多个带槽的辊子上，通过使线材在将浆料供应到带槽的辊子上行进并将工件压在线材上的同时将工件切成晶片， 线锯控制方式使得工件被切片，同时浆料的供应温度从切割工件的开始到结束增加。 结果，提供了一种线锯，其中可以通过抑制工件的切割端部附近的工件的温度降低并且通过增加位移来提高要切割的工件的翘曲 在切割直线时，即通过使工件中描绘的切片轨迹靠近直线而形成带槽辊。

公开(公告)号：US07699050B2

公开(公告)日：2010-04-20

申请号：US11992473

申请日：2006-09-04

申请人： Hiroshi Oishi

发明人： Hiroshi Oishi

IPC分类号： B28D1/02

CPC分类号： B28D5/045 ,  B24B27/0633

摘要： The present invention provides a method for slicing a silicon single crystal ingot having a plane direction (110) by a wire saw to manufacture a (110) silicon wafer, wherein slicing is performed in such a manner that each angle formed between a traveling direction of a wire in the wire saw and a [−112 ] direction and a [1-12] direction in the (110) silicon single crystal ingot or a direction crystallographically equivalent to the directions exceeds 30°. As a result, the method for manufacturing the (110) silicon wafer that can suppress occurrence of breaking at the time of slicing and improve a production yield ratio can be provided.

摘要翻译： 本发明提供了一种通过线锯对具有平面方向（110）的硅单晶锭进行切割以制造（110）硅晶片的方法，其中以如下方式进行切割：使得在 （110）硅单晶锭中的线锯中的线和[110]方向和[1-12]方向或与该方向结晶等效的方向超过30°。 结果，可以提供可以抑制在切片时发生断裂的（110）硅晶片的制造方法，并提高制造成品率。