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    Thermal Mitigation for An Electronic Speaker Device and Associated Apparatuses and Methods
    82.
    发明公开
    Thermal Mitigation for An Electronic Speaker Device and Associated Apparatuses and Methods 审中-公开

    公开(公告)号：US20240155818A1

    公开(公告)日：2024-05-09

    申请号：US18504485

    申请日：2023-11-08

    申请人： Google LLC

    发明人： Emil Rahim ,  Chintan Trehan ,  Ihab A. Ali ,  Wilson Tang

    IPC分类号： H05K7/20 ,  G01R31/28 ,  G06F3/16 ,  H04R9/02 ,  H05K1/02

    CPC分类号： H05K7/20945 ,  G01R31/2877 ,  G06F3/165 ,  H04R9/022 ,  H05K1/0203 ,  H04R1/02

    摘要： The present disclosure describes thermal mitigation for an electronic speaker device and associated systems and methods. The thermal mitigation includes monitoring several thermal zones to determine or estimate thermal conditions in corresponding parts of the electronic speaker device. The thermal zones may include a System-on-Chip (SoC) integrated circuit (IC) component, audio components including power-dissipating IC components, and a temperature of an exterior surface of a housing component of the electronic speaker device. To mitigate thermal runaway, different throttling schemes may be triggered based on the thermal zones exceeding certain thermal limits. The throttling schemes may include reducing the amount of power supplied to the SoC, reducing audio power of the audio components to a lower wattage, or manipulating SoC cores such as by disabling one or more of the cores or adjusting utilization of the SoC cores.

    THERMAL MODEL BASED ESTIMATOR
    89.
    发明申请
    THERMAL MODEL BASED ESTIMATOR 审中-公开

    公开(公告)号：US20190110145A1

    公开(公告)日：2019-04-11

    申请号：US16154984

    申请日：2018-10-09

    申请人： Cirrus Logic International Semiconductor Ltd.

    发明人： Jason William LAWRENCE ,  Antonio Jesus DIEZ ELORZA

    IPC分类号： H04R29/00 ,  H04R3/00 ,  H03F1/30 ,  H03F1/52

    CPC分类号： H04R29/003 ,  H03F1/30 ,  H03F1/52 ,  H03F3/181 ,  H03F2200/03 ,  H03F2200/447 ,  H03F2200/468 ,  H04R3/007 ,  H04R9/022

    摘要： Embodiments described herein provide a method in a thermal model based estimator and a thermal model based estimator for estimating a temperature of a transducer. The method comprises receiving a first signal wherein the first signal is representative of an impedance across the transducer; receiving an indication of a current across the transducer; determining an estimated thermal power based on the indication of the current and an estimated temperature signal, determining, based on the estimated thermal power, the estimated temperature signal using a thermal model of the transducer comprising states defined by a thermal state vector; comparing the first signal with a second signal derived from the estimated temperature signal; updating the thermal state vector of the thermal model based on the comparison; and; outputting the estimated temperature signal.