Mask Changing Unit for Laser Bonding Apparatus

    公开(公告)号:US20200215645A1

    公开(公告)日:2020-07-09

    申请号:US16436943

    申请日:2019-06-11

    Inventor: GEUNSIK AHN

    Abstract: Provided is a mask changing unit for a laser bonding apparatus, and more particularly, a mask changing unit for a laser bonding apparatus, wherein the mask changing unit supplies or changes a mask to or in the laser bonding apparatus for bonding a semiconductor chip to a substrate by using a laser beam.According to the mask changing unit for a laser bonding apparatus, a plurality of masks that are used in performing laser bonding of a semiconductor chip to a substrate while the semiconductor chip is being pressed may be easily supplied to the laser bonding apparatus or changed in the laser bonding apparatus.

    Apparatus for producing a three-dimensional work piece with improved gas flow

    公开(公告)号:US10682701B2

    公开(公告)日:2020-06-16

    申请号:US15248487

    申请日:2016-08-26

    Abstract: An apparatus for producing a three-dimensional work piece, the apparatus comprises a process chamber accommodating a carrier for receiving a raw material powder, an irradiation device for selectively irradiating electromagnetic or particle radiation onto the raw material powder on the carrier in order to produce a work piece made of said raw material powder by an additive layer construction method, a first gas inlet for supplying gas to the process chamber and a gas outlet for discharging gas from the process chamber, wherein the first gas inlet and the gas outlet are configured and arranged in such a manner that a first gas flow across the carrier is generated, a transmission element which allows the transmission of the electromagnetic or particle radiation emitted by the irradiation device into the process chamber, and a second gas inlet for supplying gas to the process chamber, wherein the second gas inlet is configured and arranged in such a manner that a second gas flow in a direction facing away from the transmission element is generated.

    Delivery device usable in laser peening operation, and associated method

    公开(公告)号:US10655191B2

    公开(公告)日:2020-05-19

    申请号:US15150672

    申请日:2016-05-10

    Abstract: A delivery device that is usable in a laser peening operation emits a columnar flow of a fluid that contains therein a beam of electromagnetic energy. The beam is retained within the interior of the flow of fluid since the total internal reflectivity of the flow is sufficient to do so. The flow of fluid that serves as a conduit for the beam also itself impinges on a workpiece and thus contains and washes away the plasma that forms from a laser peening operation, and this resists the plasma from reaching and possibly damaging the delivery device. The carrying of the beam in the columnar flow of fluid avoids the need to maintain a fixed distance between the delivery device and the workpiece, which simplifies the movement by a robotic manipulator of the delivery device along a non-planar surface of a workpiece during a laser peening operation.

    LASER PROCESSING SYSTEM, JET ADJUSTMENT DEVICE, AND LASER PROCESSING METHOD

    公开(公告)号:US20200061751A1

    公开(公告)日:2020-02-27

    申请号:US16546744

    申请日:2019-08-21

    Inventor: Takashi Izumi

    Abstract: A laser processing system that can effectively blow out a material of a workpiece melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system comprises a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to form a maximum point of velocity of the jet at a position away from the emission opening; and a tubular enclosure disposed between the nozzle and a workpiece and enclosing the jet, wherein the enclosure has a changeable radial inner dimension, and is configured to adjust the position of the maximum point by changing the inner dimension.

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