Ring-tone Detection in a VoIP Call
    1.
    发明申请
    Ring-tone Detection in a VoIP Call 有权
    VoIP呼叫中的铃声检测

    公开(公告)号:US20120140680A1

    公开(公告)日:2012-06-07

    申请号:US12959927

    申请日:2010-12-03

    IPC分类号: H04L12/16

    摘要: Alerting a calling party in a Voice over IP (VoIP) setting that a called party might not be able to hear ring-tones. In response to a call arriving on an IP connection, the audible level of ring-tones that are generated by a microphone associated with a VoIP computer application is sampled, and responsive to the audible level of ring-tones being below a minimum threshold, a message is transmitting to the calling party via any available connection that the called party might be unable to hear the ring-tones.

    摘要翻译: 通过IP(VoIP)设置呼叫主叫方,被叫方可能无法听到铃声。 响应于在IP连接上到达的呼叫,由与VoIP计算机应用相关联的麦克风生成的铃声的可听级别被采样,并且响应于可听级别的铃声低于最小阈值, 消息通过被叫方可能无法听到铃声的任何可用连接正在向主叫方发送。

    Integrated circuit testing methods using well bias modification
    2.
    发明授权
    Integrated circuit testing methods using well bias modification 失效
    集成电路测试方法采用偏置修正

    公开(公告)号:US07564256B2

    公开(公告)日:2009-07-21

    申请号:US12119834

    申请日:2008-05-13

    IPC分类号: G01R31/26

    摘要: Methods for testing a semiconductor circuit (10) including testing the circuit and modifying a well bias (14, 18) of the circuit during testing. The methods improve the resolution of voltage-based and IDDQ testing and diagnosis by modifying well bias during testing. In addition, the methods provide more efficient stresses during stress testing. The methods apply to ICs where the semiconductor well (wells and/or substrates) are wired separately from the chip VDD and GND, allowing for external control (40) of the well potentials during test. In general, the methods rely on using the well bias to change transistor threshold voltages.

    摘要翻译: 测试半导体电路(10)的方法,包括在测试期间测试电路和修改电路的阱偏压(14,18)。 该方法通过在测试过程中改善阱偏差来提高基于电压和IDDQ测试和诊断的分辨率。 此外,这些方法在应力测试期间提供更有效的应力。 该方法适用于半导体阱(阱和/或衬底)与芯片VDD和GND分开接线的IC,允许在测试期间外部控制(40)阱电位。 通常,这些方法依靠使用阱偏置来改变晶体管阈值电压。

    Query dispatching system and method

    公开(公告)号:US10754874B2

    公开(公告)日:2020-08-25

    申请号:US15944819

    申请日:2018-04-04

    摘要: A computer receives a database request to be executed on a source database or a target database. The source database is configured to efficiently process database queries of a first query type, the target database is configured to efficiently process database queries of a second query type, data changes in the source database are asynchronously replicated to the target database, and all changed data in the source database impacting a result of the database request are replicated to the target database before executing the database request. The computer determines a latency time to asynchronously complete a replication of unreplicated data changes and determines a velocity of replication. The computer predicts, using the latency time and velocity of replication, which of the databases will complete an execution of the database request first and dispatches the database request to the database predicted to complete the execution of the database request first.

    Altering in-flight streamed data from a relational database

    公开(公告)号:US09836467B1

    公开(公告)日:2017-12-05

    申请号:US15339819

    申请日:2016-10-31

    IPC分类号: G06F7/00 G06F17/00 G06F17/30

    摘要: A database which receives input from a data streaming application may include in-flight streamed data within the scope of a command which alters database data. Preferably, the streaming application produces data tuples for input to at least one table of the database. A user submitting modify data commands to apply to multiple tuples meeting some specified logical parameters may define the command scope to include in-flight data in the streaming application, causing the database manager to forward the command to the streaming application. A streaming application manager invokes database agents in respective nodes of the streaming application, which identify in-flight data meeting the specified logical parameters of the command, and apply the modify data operation to such data.

    Event-based dynamic resource provisioning
    7.
    发明授权
    Event-based dynamic resource provisioning 有权
    基于事件的动态资源配置

    公开(公告)号:US08977752B2

    公开(公告)日:2015-03-10

    申请号:US12424893

    申请日:2009-04-16

    IPC分类号: G06F15/173 G06F15/16 G06F9/50

    CPC分类号: G06F9/5011 G06F9/5061

    摘要: Disclosed are a method, a system and a computer program product for automatically allocating and de-allocating resources for jobs executed or processed by one or more supercomputer systems. In one or more embodiments, a supercomputing system can process multiple jobs with respective supercomputing resources. A global resource manager can automatically allocate additional resources to a first job and de-allocate resources from a second job. In one or more embodiments, the global resource manager can provide the de-allocated resources to the first job as additional supercomputing resources. In one or more embodiments, the first job can use the additional supercomputing resources to perform data analysis at a higher resolution, and the additional resources can compensate for an amount of time the higher resolution analysis would take using originally allocated supercomputing resources.

    摘要翻译: 公开了一种用于为由一个或多个超级计算机系统执行或处理的作业自动分配和分配资源的方法,系统和计算机程序产品。 在一个或多个实施例中,超级计算系统可以使用相应的超级计算资源处理多个作业。 全局资源管理器可以自动为第一个作业分配额外的资源,并从第二个作业中分配资源。 在一个或多个实施例中,全局资源管理器可以将去分配的资源作为附加的超级计算资源提供给第一作业。 在一个或多个实施例中,第一作业可以使用额外的超级计算资源以更高的分辨率执行数据分析,并且附加资源可以补偿使用原始分配的超级计算资源的更高分辨率分析所花费的时间量。

    FinFET parasitic capacitance reduction using air gap
    8.
    发明授权
    FinFET parasitic capacitance reduction using air gap 有权
    使用气隙对FinFET寄生电容进行减小

    公开(公告)号:US08637930B2

    公开(公告)日:2014-01-28

    申请号:US13272409

    申请日:2011-10-13

    IPC分类号: H01L29/78 H01L21/336

    CPC分类号: H01L29/66803 H01L29/785

    摘要: A transistor, for example a FinFET, includes a gate structure disposed over a substrate. The gate structure has a width and also a length and a height defining two opposing sidewalls of the gate structure. The transistor further includes at least one electrically conductive channel between a source region and a drain region that passes through the sidewalls of the gate structure; a dielectric layer disposed over the gate structure and portions of the electrically conductive channel that are external to the gate structure; and an air gap underlying the dielectric layer. The air gap is disposed adjacent to the sidewalls of the gate structure and functions to reduce parasitic capacitance of the transistor. At least one method to fabricate the transistor is also disclosed.

    摘要翻译: 晶体管,例如FinFET,包括设置在衬底上的栅极结构。 栅极结构具有宽度以及限定栅极结构的两个相对侧壁的长度和高度。 晶体管还包括通过栅极结构的侧壁的源极区域和漏极区域之间的至少一个导电沟道; 设置在所述栅极结构上方的电介质层和在所述栅极结构外部的所述导电沟道的部分; 以及介电层下面的气隙。 气隙设置成与栅极结构的侧壁相邻,并且用于减小晶体管的寄生电容。 还公开了制造晶体管的至少一种方法。

    METHOD TO REDUCE THE WIRELENGTH OF ANALYTICAL PLACEMENT TECHNIQUES BY MODULATION OF SPREADING FORCES VECTORS
    9.
    发明申请
    METHOD TO REDUCE THE WIRELENGTH OF ANALYTICAL PLACEMENT TECHNIQUES BY MODULATION OF SPREADING FORCES VECTORS 审中-公开
    通过扩展力矢量调制降低分析放置技术的线性的方法

    公开(公告)号:US20080066037A1

    公开(公告)日:2008-03-13

    申请号:US11531322

    申请日:2006-09-13

    IPC分类号: G06F17/50

    CPC分类号: G06F17/5072

    摘要: A method of force directed placement programming is presented. The method includes sorting objects of a netlist for placement by magnitude of their spreading force and selecting a plurality of the objects. The method further includes waiving (or nullifying) the spreading force for the selected objects in a subsequent non-linear program solver step of the force directed placement program. The positions of the objects after the subsequent non-linear program solver step are based only on their connections to other objects in the netlist. The selected objects no longer retain their relative ordering as obtained during a previous non-linear program solve step of the force directed placement program. An alternative method of force directed placement programming is also present, which includes identifying objects from a netlist for placement that have a very high spreading force magnitude. The method further includes controlling the spreading force magnitude for the objects identified in the force directed placement programming to reduce wirelength in a chip design without sacrificing spreading of the objects.

    摘要翻译: 提出了一种强制定向布置程序的方法。 该方法包括对网表的对象进行排序,以便按照其展开力的大小进行放置并选择多个对象。 该方法还包括在力定向放置程序的随后非线性程序解算器步骤中放弃(或消除)所选对象的展开力。 在后续非线性程序求解器步骤之后的对象的位置仅基于它们与网表中其他对象的连接。 所选择的对象不再保留在力定向放置程序的先前非线性程序解决步骤中获得的相对排序。 还存在一种替代的力定向放置编程的方法,其包括从具有非常高的铺展力量级的用于放置的网表识别对象。 该方法还包括控制在力定向放置编程中识别的物体的展开力大小以减少芯片设计中的线长度,而不牺牲物体的扩展。

    Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly
    10.
    发明授权
    Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly 有权
    一种采用集成热交换组件的电子模块的冷却装置和方法

    公开(公告)号:US07184269B2

    公开(公告)日:2007-02-27

    申请号:US11008359

    申请日:2004-12-09

    IPC分类号: H05K7/20

    CPC分类号: H05K7/2079 H05K7/20781

    摘要: A cooling apparatus for an electronics assembly having a substrate and one or more electronics devices includes an enclosure sealably engaging the substrate to form a cavity, with the electronics devices and a heat exchange assembly being disposed within the cavity. The heat exchange assembly defines a primary coolant flow path and a separate, secondary coolant flow path. The primary coolant flow path includes first and second chambers in fluid communication, and the secondary flow path includes a third chamber disposed between the first and second chambers. The heat exchange assembly provides a first thermal conduction path between primary coolant in the first chamber and secondary coolant in the third chamber, and a second thermal conduction path between primary coolant in the second chamber and secondary coolant in the third chamber. The heat exchange assembly further includes coolant nozzles to direct primary coolant towards the electronics devices.

    摘要翻译: 一种用于具有衬底和一个或多个电子器件的电子组件的冷却装置,包括密封地接合衬底以形成空腔的外壳,电子设备和热交换组件设置在空腔内。 热交换组件限定了主冷却剂流动路径和单独的二次冷却剂流动路径。 主冷却剂流动路径包括流体连通的第一和第二腔室,并且二次流动路径包括设置在第一和第二腔室之间的第三腔室。 热交换组件提供在第一室中的主要冷却剂和第三室中的二次冷却剂之间的第一热传导路径,以及在第二室中的一次冷却剂和第三室中的二次冷却剂之间的第二热传导路径。 热交换组件还包括冷却剂喷嘴以将主冷却剂引向电子设备。