摘要:
A lighting system (20) comprises a plurality of light units (1, 6, 10, 11), each light unit (1, 6, 10, 11) including a photo sensor (2, 7), a light source (4, 9) and a control unit (3, 8) adapted to operate the light source (4, 9) and to modulate the light emitted by the light source (4, 9) so as to transmit data, wherein the light units (1, 6, 10, 11) are arranged according to a ring topology.
摘要:
Embodiments of the present invention generally relate to an LED lamp having a heat dissipating means as well as a headlamp (to be mounted e.g. to the front of a vehicle such as e.g. a car or a truck) comprising said LED lamp. Embodiments of the present invention also generally relate to a method for dissipating heat from an LED lamp.
摘要:
A lighting system (20) comprises a plurality of light units (1, 6, 10, 11), each light unit (1, 6, 10, 11) including a photo sensor (2, 7), a light source (4, 9) and a control unit (3, 8) adapted to operate the light source (4, 9) and to modulate the light emitted by the light source (4, 9) so as to transmit data, wherein the light units (1, 6, 10, 11) are arranged according to a ring topology.
摘要:
The invention relates to an LED assembly comprising a carrier (T, T′), at least one LED chip (2, 102) which is arranged on the carrier (T, T′), the LED chip (2, 102) being connected to at least one bonding wire (3, 103), a transparent layer (8, 108) applied over the LED chip (2, 102) and a frame (4, 104) which surrounds the at least one LED chip (2, 102). The frame (4, 104) comprises at least one web (5, 105) so as to divide the frame (4, 104) into at least a first frame region (6, 106), which comprises the at least one LED chip (2, 102), and at least a second frame region (7, 107). The first frame region (6, 106) laterally delimits the layer (8, 108) and the second frame region (7, 107) forms a protective region for the at least one bonding wire (3, 103). By means of the assembly according to the invention, an LED assembly can be achieved which is of simple construction, can be easily assembled and also effectively protects the bonding wires against mechanical influences.
摘要:
The invention relates to a device and a method for controlling the light emission (i) of at least three light sources (21, 22, 23), wherein the light emitted by the light sources (21, 22, 23) is detected in a sequence of measuring periods during a calibration phase, and calculated on the basis of the information on the brightness of each individual light source (21, 22, 23) obtained during the measuring periods. In at least one of the measuring periods, the detected light comes from a plurality of the light sources (21, 22, 23).
摘要:
An LED module having an LED semiconductor chip mounted directly or indirectly on a platform. The platform is made from silicon and is extends laterally beyond the LED semiconductor chip having an active light emitting layer and a substrate. At least one electronic component that is part of the control circuitry for the LED semiconductor chip is integrated in the silicon platform.
摘要:
The invention relates to a device and a method for controlling the light emission (1) of at least three light sources (21, 22, 23), wherein the light emitted by the light sources (21, 22, 23) is detected in a sequence of measuring periods during a calibration phase, and calculated on the basis of the information on the brightness of each individual light source (21, 22, 23) obtained during the measuring periods. In at least one of the measuring periods, the detected light comes from a plurality of the light sources (21, 22, 22).
摘要:
The invention relates to a method of manufacturing a rare-earth doped alkaline-earth silicon nitride phosphor of a stoichiometric composition. Said method comprising the step of selecting one or more compounds each comprising at least one element of the group comprising the rare-earth elements (RE), the alkaline-earth elements (AE), silicon (Si) and nitrogen (N) and together comprising the necessary elements to form the rare-earth doped alkaline-earth silicon nitride phosphor (AE2Si5N8:RE). The method further comprises the step of bringing the compounds at an elevated temperature in reaction for forming the rare-earth doped alkaline-earth silicon nitride phosphor (AE2Si5N8:RE). In such a method normally a small amount of oxygen, whether intentionally or not-intentionally added, will be incorporated in the rare-earth doped alkaline-earth silicon nitride phosphor (AE2Si5N8:RE). According to the invention the creation of defects by formation of a non-stoichiometric oxygen containing phosphor is at least partly prevented by partly substituting for the ions (AE, Si, N) of the alkaline-earth silicon nitride phosphor (AE2Si5N8:RE) suitable further elements of the periodic system by which vacancies are created, filled or annihilated resulting in the formation of a modified alkaline-earth silicon nitride phosphor (AE2Si5N8:RE) having a stoichiometric composition. In this way a modified phosphor is obtained having excellent and stable optical properties. The invention further relates to a modified phosphor obtainable by the above-mentioned method and a radiation converting device comprising such a phosphor.
摘要:
An LED module comprises at least one LED chip emitting monochromatic light having a first spectrum, a platform on which the LED chip is mounted, a reflecting wall that is separate from or integrated into the platform and surrounds the LED chip on all sides, and a dispensed layer applied above the LED chip. The dispensed layer extends in a dome-shaped manner beyond the reflecting wall such that the following equation is satisfied: 0.1*b≦h≦0.5*b where h is the height of the dome-shaped dispensed layer, measured from the topmost point of the reflecting wall to the apex of the dome, and b is the diameter of the depression formed by the reflecting wall, measured as the distance from the central axis of the wall.
摘要翻译:LED模块包括至少一个发射具有第一光谱的单色光的LED芯片,安装有LED芯片的平台,与平台分离或集成到平台中并且围绕LED芯片的所有侧面的反射壁,以及 分配层施加在LED芯片上方。 分配层以圆顶形的方式延伸超过反射壁,使得满足以下等式:0.1 * b @ h @ 0.5 * b其中h是圆顶形分配层的高度,从最顶点 反射壁到圆顶的顶点,b是由反射壁形成的凹陷的直径,测量为距离壁的中心轴线的距离。