摘要:
During a program operation of a fuse cell of a fuse circuit, all of a group of select transistors of a fuse cell are made conductive to program the fuse cell. During a test operation of a fuse cell of the fuse circuit, less than all of the group of select transistors are made conductive so that current less than a programming current flows through the fuse cell.
摘要:
A memory system including a one time programmable (OTP) memory is provided. The memory system further includes a write enable verification circuit including an asymmetric inverter stage and a symmetric inverter stage coupled at a node. The write enable verification circuit is configured to receive a write enable signal. When the write enable signal changes from a first voltage level to a second voltage level, a voltage at the node changes at a first rate and wherein when the write enable signal changes from the second voltage level to the first voltage level, the voltage at the node changes at a second rate higher than the first rate. The write enable verification circuit is further configured to generate a verified write enable signal for enabling programming of the OTP memory.
摘要:
A memory system including a one time programmable (OTP) memory is provided. The memory system further includes a write enable verification circuit including an asymmetric inverter stage and a symmetric inverter stage coupled at a node. The write enable verification circuit is configured to receive a write enable signal. When the write enable signal changes from a first voltage level to a second voltage level, a voltage at the node changes at a first rate and wherein when the write enable signal changes from the second voltage level to the first voltage level, the voltage at the node changes at a second rate higher than the first rate. The write enable verification circuit is further configured to generate a verified write enable signal for enabling programming of the OTP memory.
摘要:
The fuse array described herein is very compact and uses little semiconductor area because of its crosspoint architecture. The disclosed crosspoint architecture reduces the number of conductors that must be run horizontally or vertically through each bit cell. As a result, the area required for each bit cell is significantly reduced. In one embodiment, a selected set of voltages on various wordlines and bitlines are used to program the fuses to produce programmed fuses having a tighter distribution of impedances. Similarly, a selected set of voltages on various wordlines and bitlines are used to read the fuses.
摘要:
A circuit has a master latch having an input for receiving an input data signal, and an output. A slave latch has a first input coupled to the output of the master latch, and an output for providing an output data signal. A non-volatile storage element stores a predetermined value. The non-volatile storage element has an output coupled to the first input of the slave latch. The output data signal corresponds to one of either the input data signal or the predetermined value stored by the non-volatile storage element in response to a control signal.
摘要:
A semiconductor device (30) comprises an underlying insulating layer (34), an overlying insulating layer (42) and a charge storage layer (36) between the insulating layers (34, 42). The charge storage layer (36) and the overlying insulating layer (42) form an interface, where at least a majority of charge in the charge storage layer (36) is stored. This can be accomplished by forming a charge storage layer (36) with different materials such as silicon and silicon germanium layers or n-type and p-type material layers, in one embodiment. In another embodiment, the charge storage layer (36) comprises a dopant that is graded. By storing at least a majority of the charge at the interface between the charge storage layer (36) and the overlying insulating layer (42), the leakage of charge through the underlying insulating layer is decreased allowing for a thinner underlying insulating layer (34) to be used.
摘要:
A semiconductor process and apparatus use a predetermined sequence of patterning and etching steps to etch a gate stack (62) formed over a substrate (11) and a first spacer structure (42), thereby forming etched gate structures (72, 74) that are physically separated from one another but that control a substrate channel (71) subsequently defined in the substrate (11) by source/drain regions (82, 102, 84, 104) that are implanted around the etched gate structures (72, 74). Depending on how the first spacer structure (42) is positioned and configured, the channel (71) may be controlled to provide either a logical AND gate (100) or logical OR gate (200) functionality.
摘要:
A multiport memory cell (200, 300, 600) includes a first word line (WL1) coupled to a gate electrode of a first transistor (201, 301, 601). A second word line (WL2) is coupled to a gate electrode of a second transistor (202, 302, 602). Importantly, the memory cell (200, 300, 600) includes a conductive path (215, 315) between an electrically floating body (426) of the first transistor (201) and an electrically floating body (426) of the second transistor (202). The first word line (WL1) may overlie a first portion of a common body (426) and the second word line (WL2) may overlie a second portion of the common body (426). The common body (426) may be positioned vertically between a buried oxide layer (427) and a gate dielectric layer (430) and laterally between first and second source/drain regions (401, 407) formed in a semiconductor layer (425). The cell (200, 300, 600) may include a third transistor (603) including a third word line (613) where the shared transistor body (610) is shared with the third transistor (603) and wherein the conductive path is connected to the third transistor (603).
摘要:
A non-volatile memory (10) includes at least two buried bit lines (45, 47) formed within a semiconductor substrate (12), a charge storage layer (18) overlying the semiconductor substrate (12); a control gate (26) overlying the charge storage layer (18); an insulating liner (30) overlying the control gate; and first and second conductive sidewall spacer control gates (32, 34). Multiple programmable charge storage regions (42) and (41, 44) are created within the charge storage layer (18) beneath respective ones of the control gate (26) and the first and second sidewall spacer control gates (32, 34). Also, the non-volatile memory (10) is a virtual ground NOR type multi-bit flash EEPROM (electrically erasable programmable read only memory). By using conductive sidewall spacers as the control gates, a very dense multi-bit non-volatile memory can be manufactured.
摘要:
An integrated circuit includes a memory cell and a sense amplifier coupled to the memory cell via a first bit line and a second bit line. The sense amplifier includes first and second inverters cross-coupled to provide a latch. The first inverter is responsive to a first data signal provided by the memory cell over the first bit line. The second inverter is responsive to a second data signal as provided by the memory cell over the second bit line. A first negative bias temperature instability (NBTI) compensation transistor includes a source electrode coupled to receive a reference voltage, a drain electrode coupled to a source electrode of the first inverter, and a gate electrode coupled to first logic responsive to the first data signal. A second NBTI compensation transistor includes a source electrode coupled to receive the reference voltage, a drain electrode coupled to a source electrode of the second inverter, and a gate electrode coupled to second logic responsive to the second data signal, wherein the second data signal is a logical complement of the first data signal.