摘要:
A circuit and method for controlling charge injection in a circuit are disclosed. In one embodiment, the circuit and method are employed in a semiconductor-on-insulator (SOI) Radio Frequency (RF) switch. In one embodiment, an SOI RF switch comprises a plurality of switching transistors coupled in series, referred to as “stacked” transistors, and implemented as a monolithic integrated circuit on an SOI substrate. Charge injection control elements are coupled to receive injected charge from resistively-isolated nodes located between the switching transistors, and to convey the injected charge to at least one node that is not resistively-isolated. In one embodiment, the charge injection control elements comprise resistors. In another embodiment, the charge injection control elements comprise transistors. A method for controlling charge injection in a switch circuit is disclosed whereby injected charge is generated at resistively-isolated nodes between series coupled switching transistors, and the injected charge is conveyed to at least one node of the switch circuit that is not resistively-isolated.
摘要:
A method and apparatus are disclosed for use in improving the gate oxide reliability of semiconductor-on-insulator (SOI) metal-oxide-silicon field effect transistor (MOSFET) devices using accumulated charge control (ACC) techniques. The method and apparatus are adapted to remove, reduce, or otherwise control accumulated charge in SOI MOSFETs, thereby yielding improvements in FET performance characteristics. In one embodiment, a circuit comprises a MOSFET, operating in an accumulated charge regime, and means for controlling the accumulated charge, operatively coupled to the SOI MOSFET. A first determination is made of the effects of an uncontrolled accumulated charge on time dependent dielectric breakdown (TDDB) of the gate oxide of the SOI MOSFET. A second determination is made of the effects of a controlled accumulated charge on TDDB of the gate oxide of the SOI MOSFET. The SOI MOSFET is adapted to have a selected average time-to-breakdown, responsive to the first and second determinations, and the circuit is operated using techniques for accumulated charge control operatively coupled to the SOI MOSFET. In one embodiment, the accumulated charge control techniques include using an accumulated charge sink operatively coupled to the SOI MOSFET body.
摘要:
A method and apparatus are disclosed for use in improving the gate oxide reliability of semiconductor-on-insulator (SOI) metal-oxide-silicon field effect transistor (MOSFET) devices using accumulated charge control (ACC) techniques. The method and apparatus are adapted to remove, reduce, or otherwise control accumulated charge in SOI MOSFETs, thereby yielding improvements in FET performance characteristics. In one embodiment, a circuit comprises a MOSFET, operating in an accumulated charge regime, and means for controlling the accumulated charge, operatively coupled to the SOI MOSFET. A first determination is made of the effects of an uncontrolled accumulated charge on time dependent dielectric breakdown (TDDB) of the gate oxide of the SOI MOSFET. A second determination is made of the effects of a controlled accumulated charge on TDDB of the gate oxide of the SOI MOSFET. The SOI MOSFET is adapted to have a selected average time-to-breakdown, responsive to the first and second determinations, and the circuit is operated using techniques for accumulated charge control operatively coupled to the SOI MOSFET. In one embodiment, the accumulated charge control techniques include using an accumulated charge sink operatively coupled to the SOI MOSFET body.
摘要:
A power-on-reset (POR) circuit having a zero or substantially zero current state while the supply voltage is in a predetermined, valid range is disclosed. The POR circuit includes a state machine, an oscillator, and output circuitry that are electrically coupled to one another and to a supply voltage. Output from the output circuitry is also provided to the integrated circuit to which the POR circuit is coupled. The state machine includes a plurality of sequential circuits such as latches, flip-flops, and the like that are electrically coupled in a cascade, to provide a ripple counter. The output circuitry is structured and arranged to reset or initialize all of the logic elements on the chip by generating a POR output logic HI (1) signal by Boolean operation of the logic circuitry signal of the state machine for all Boolean states except one. The oscillator is disabled when the POR output logic signal is LO (0), which causes the POR circuit to enter a zero or substantially zero current state.
摘要:
A thermal accelerometer device that provides a compensation for sensitivity variations over temperature. The thermal accelerometer includes signal conditioning circuitry operative to receive analog signals representing a differential temperature is indicative of a sensed acceleration. The signal conditioning circuitry includes serially connected A-to-D and D-to-A converters, which implement a temperature dependent function and process the received signals to provide a compensation for sensitivity variations over a range of ambient temperature. To provide a ratiometric compensation for variations in power supply voltage, a buffered voltage proportional to the supply voltage is provided as a reference voltage to the D-to-A converter. The thermal accelerometer includes a self-test circuit for verifying the integrity of a heater, temperature sensors, and circuitry included within the device.
摘要:
An integrated convective accelerometer device. The device includes a thermal acceleration sensor having a thermopile and a heater element; control circuitry for providing closed-loop control of the thermopile common-mode voltage; an instrumentation amplifier; clock generation circuitry; voltage reference circuitry; a temperature sensor; and, output amplifiers. The device can be operated in an absolute or ratiometric mode. Further, the device is formed in a silicon substrate using standard semiconductor processes and is packaged in a standard integrated circuit package.
摘要:
A method and apparatus are disclosed for use in improving the gate oxide reliability of semiconductor-on-insulator (SOI) metal-oxide-silicon field effect transistor (MOSFET) devices using accumulated charge control (ACC) techniques. The method and apparatus are adapted to remove, reduce, or otherwise control accumulated charge in SOI MOSFETs, thereby yielding improvements in FET performance characteristics. In one embodiment, a circuit comprises a MOSFET, operating in an accumulated charge regime, and means for controlling the accumulated charge, operatively coupled to the SOI MOSFET. A first determination is made of the effects of an uncontrolled accumulated charge on time dependent dielectric breakdown (TDDB) of the gate oxide of the SOI MOSFET. A second determination is made of the effects of a controlled accumulated charge on TDDB of the gate oxide of the SOI MOSFET. The SOI MOSFET is adapted to have a selected average time-to-breakdown, responsive to the first and second determinations, and the circuit is operated using techniques for accumulated charge control operatively coupled to the SOI MOSFET. In one embodiment, the accumulated charge control techniques include using an accumulated charge sink operatively coupled to the SOI MOSFET body.
摘要:
A method and apparatus are disclosed for use in improving the gate oxide reliability of semiconductor-on-insulator (SOI) metal-oxide-silicon field effect transistor (MOSFET) devices using accumulated charge control (ACC) techniques. The method and apparatus are adapted to remove, reduce, or otherwise control accumulated charge in SOI MOSFETs, thereby yielding improvements in FET performance characteristics. In one embodiment, a circuit comprises a MOSFET, operating in an accumulated charge regime, and means for controlling the accumulated charge, operatively coupled to the SOI MOSFET. A first determination is made of the effects of an uncontrolled accumulated charge on time dependent dielectric breakdown (TDDB) of the gate oxide of the SOI MOSFET. A second determination is made of the effects of a controlled accumulated charge on TDDB of the gate oxide of the SOI MOSFET. The SOI MOSFET is adapted to have a selected average time-to-breakdown, responsive to the first and second determinations, and the circuit is operated using techniques for accumulated charge control operatively coupled to the SOI MOSFET. In one embodiment, the accumulated charge control techniques include using an accumulated charge sink operatively coupled to the SOI MOSFET body.
摘要:
A circuit and method for controlling charge injection in a circuit are disclosed. In one embodiment, the circuit and method are employed in a semiconductor-on-insulator (SOI) Radio Frequency (RF) switch. In one embodiment, an SOI RF switch comprises a plurality of switching transistors coupled in series, referred to as “stacked” transistors, and implemented as a monolithic integrated circuit on an SOI substrate. Charge injection control elements are coupled to receive injected charge from resistively-isolated nodes located between the switching transistors, and to convey the injected charge to at least one node that is not resistively-isolated. In one embodiment, the charge injection control elements comprise resistors. In another embodiment, the charge injection control elements comprise transistors. A method for controlling charge injection in a switch circuit is disclosed whereby injected charge is generated at resistively-isolated nodes between series coupled switching transistors, and the injected charge is conveyed to at least one node of the switch circuit that is not resistively-isolated.
摘要:
A digital-to-analog converter with cascaded coarse and fine resistor divider strings. The fine resistor string contains 2.sup.N or more resistor segments controlled by N number of fine divider control bits. Resistors located at each end of the fine divider string are a fraction of the nominal value for the remaining fine divider resistor segments. The on-resistance of switches coupling the coarse and fine resistor divider strings is less than or equal to a predetermined fraction of the nominal value for the fine divider resistor segments to minimize contributions to linearity error. The DAC uses all CMOS devices including NMOS and PMOS switches which utilize approximately the full rail-to-rail voltage of the voltage source without the use of additional amplifiers. The DAC provides linearity of about one-fourth LSB.