Semiconductor structure with flared mesa burying layers
    1.
    发明授权
    Semiconductor structure with flared mesa burying layers 失效
    半导体结构具有扩张的台面埋层

    公开(公告)号:US4935936A

    公开(公告)日:1990-06-19

    申请号:US313636

    申请日:1989-02-22

    CPC classification number: H01L33/0062 H01S5/227 H01S5/2275

    Abstract: A semiconductor structure and methods for making it, for use in opto-electronic devices, employs only MOVPE growth steps. The structure is based on a mesa having substantially non-reentrant sides. To make it, an initial semiconductor structure is produced which comprises a substrate with a mesa thereon, the mesa having a self-aligned, central stripe of metal organic vapour phase growth suppressing material on its uppermost surface. Burying layers are then grown by MOVPE at either side of the mesa, the stripe removed, and covering layers grown over the mesa and adjoining regions of the burying layers. To make an opto-electronic device, a silica window can be formed on the uppermost surface of the covering layers and contacts provided through the window and to the remote face of the substrate. Two methods of making the initial semiconductor structure are described. Devices such as optical detectors and waveguides can be made using methods according to the invention. Particularly importantly, semiconductor lasers which will operate in a single transverse mode can be made.

    Method of making ridge waveguide lasers
    4.
    发明授权
    Method of making ridge waveguide lasers 失效
    脊波导激光器的制作方法

    公开(公告)号:US4728628A

    公开(公告)日:1988-03-01

    申请号:US709196

    申请日:1985-03-07

    CPC classification number: H01S5/22 H01S5/12 H01S5/1237

    Abstract: A semiconductor device comprises a base semiconductor portion and, thereon, first and second elevated semiconductor portions separated by a channel. The uppermost surface of the first elevated semiconductor portion carries a metal electrical contact layer and the uppermost of the second a dielectric layer. The surfaces defining the channel are substantially free of metal and dielectric.The structure can be used in a ridge waveguide laser, the first elevated semiconductor portion constituting the ridge (7", 8").Distributed feedback corrugations may be incorporated in such devices (6), or in other ridge waveguide structures.

    Abstract translation: 半导体器件包括基极半导体部分,并且在其上,由沟道分开的第一和第二升高的半导体部分。 第一升高半导体部分的最上表面承载金属电接触层和第二电介质层的最上面。 限定通道的表面基本上没有金属和电介质。 该结构可以用在脊波导激光器中,第一升高半导体部分构成脊(7 + 41,8“)。 分布式反馈波纹可以结合在这种装置(6)中,或者在其他脊形波导结构中。

    Semiconductor structures and a method of manufacturing semiconductor
structures
    6.
    发明授权
    Semiconductor structures and a method of manufacturing semiconductor structures 失效
    半导体结构和半导体结构的制造方法

    公开(公告)号:US4864581A

    公开(公告)日:1989-09-05

    申请号:US019591

    申请日:1987-03-02

    CPC classification number: H01L33/0062 H01S5/227 H01S5/2275

    Abstract: A semiconductor structure and methods for making it, for use in opto-electronic devices, employs only MOVPE growth steps. The structure is based on a mesa having substantially non-reentrant sides. An initial semiconductor structure is produced which includes a substrate with a mesa having a self-aligned, central stripe of metal organic vapor phase growth suppressing material on its uppermost surface. Burying layers are then grown by MOVPE at either side of the mesa, the stripe removed, and covering layers grown over the mesa and adjoining regions of the burying layers. To make an opto-electronic device, a silica window can be formed on the uppermost surface of the covering layers and contacts provided through the window and to the remote face of the substrate. Two methods of making the initial semiconductor structure are described. Devices such as optical detectors and waveguides can be made using methods according to the invention. Particularly importantly, semiconductor lasers which will operate in a single transverse mode can be made.

    Abstract translation: PCT No.PCT / GB86 / 00387 Sec。 371日期1987年3月2日 102(e)1987年3月2日PCT PCT 1986年7月3日PCT公布。 公开号WO87 / 00348 日期:1987年1月15日。用于光电器件的半导体结构及其制造方法仅使用MOVPE生长步骤。 该结构基于具有基本上不可折入侧的台面。 制造初始半导体结构,其包括具有在其最上表面上具有自对准的中心条状金属有机气相生长抑制材料的台面的基板。 然后通过MOVPE在台面的任一侧上生长掩埋层,去除条纹,并在掩埋层的台面和邻接区域上生长覆盖层。 为了制造光电器件,可以在覆盖层的最上表面和通过窗口提供的触点和基板的远端面上形成二氧化硅窗口。 描述制作初始半导体结构的两种方法。 诸如光学检测器和波导的器件可以使用根据本发明的方法制造。 特别重要的是,可以制造将以单一横向模式操作的半导体激光器。

Patent Agency Ranking