公开(公告)号：US07332902B1

公开(公告)日：2008-02-19

申请号：US11205582

申请日：2005-08-16

申请人： Bert M. Vermeire ,  Farhang F. Shadman

发明人： Bert M. Vermeire ,  Farhang F. Shadman

IPC分类号： G01N27/00 ,  G01N27/26 ,  G01R27/28

CPC分类号： G01N27/07 ,  B01L3/5027 ,  B01L3/502707 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2300/0887

摘要： The present invention provides a micro sensor for monitoring the cleaning and drying processes for very high aspect ratio micro channels in dielectric films oriented parallel to the fluid-solid interface during the manufacture of ICs, MEMS and other micro-devices. The micro sensor can be used to monitor “vertical” micro features common in microelectronics fabrication or “horizontal” micro features found in MEMS or microfluidic fabrication. By forming the micro channels parallel to the interface, the channels can be made with much higher and well controlled aspect ratios. In addition, multiple sensors can sense the impedance at various points along the micro features. The addition of a guard reduces the effects of any parasitic capacitance, which extends the measurement bandwidth of the sensor.

摘要翻译： 本发明提供了一种微型传感器，用于在制造IC，MEMS和其它微器件期间，监测在平行于流体 - 固体界面定向的介电膜中的非常高的纵横比微通道的清洁和干燥过程。 微型传感器可用于监测微电子制造中常见的“垂直”微特征或在MEMS或微流体制造中发现的“水平”微特征。 通过与界面平行地形成微通道，可以制造具有更高和更好控制的纵横比的通道。 此外，多个传感器可以感测沿着微特征的各个点处的阻抗。 防护装置的增加可以减少任何寄生电容的影响，从而延长了传感器的测量带宽。

公开(公告)号：US07489141B1

公开(公告)日：2009-02-10

申请号：US11205636

申请日：2005-08-16

申请人： Bert M. Vermeire ,  Farhang F. Shadman

发明人： Bert M. Vermeire ,  Farhang F. Shadman

IPC分类号： G01R27/00 ,  G01R27/04 ,  G01R27/32 ,  G01R27/08

CPC分类号： G01D5/24

摘要： The present invention provides a micro sensor for monitoring the cleaning and drying processes of surfaces of dielectric films, micro features in porous dielectric films and biologic or other cells common in microelectronics fabrication, MEMS fabrication or microbiology test system fabrication. By embedding electrodes in the surface of a supporting dielectric, the sensor can probe the surface and pores of a covering dielectric or a cell on the covering dielectric. The addition of a guard reduces the effects of any parasitic capacitance, which extends the measurement bandwidth of the sensor and allows it to be manufactured at the scale of a single cell, a feature that is particularly important for applications in microbiology.

摘要翻译： 本发明提供了一种微型传感器，用于监测介电膜表面的清洁和干燥过程，多孔介电膜中的微观特征以及微电子制造，MEMS制造或微生物学测试系统制造中常见的生物或其它细胞。 通过将电极嵌入支撑电介质的表面，传感器可以探测覆盖电介质或覆盖电介质上的电池的表面和孔。 防护器的添加减少了任何寄生电容的影响，这扩大了传感器的测量带宽，并允许其以单个电池的规模制造，这是对微生物学应用特别重要的特征。

公开(公告)号：US07239163B1

公开(公告)日：2007-07-03

申请号：US11156022

申请日：2005-06-17

申请人： Jeremy John Ralston-Good ,  Philipp S. Spuhler ,  Bert M. Vermeire ,  Douglas Leonard Goodman

发明人： Jeremy John Ralston-Good ,  Philipp S. Spuhler ,  Bert M. Vermeire ,  Douglas Leonard Goodman

IPC分类号： G01R31/02

CPC分类号： G01R31/2884

摘要： A die-level process monitor (DLPM) provides a means for independently determining whether an IC malfunction is a result of the design or the manufacturing processing and further for gathering data on specific process parameters. The DLPM senses parameter variations that result from manufacturing process drift and outputs a measure of the process parameter. The DLPM will typically sense the mismatch of process parameters between two or more test devices as a measure of process variation between a like pair of production devices. The DLPM may be used as a diagnostic tool to determine why an IC failed to perform within specification or to gather statistics on measured process parameters for a given foundry or process.

摘要翻译： 裸片级过程监视器（DLPM）提供了一种用于独立地确定IC故障是由设计或制造处理的结果以及进一步收集关于特定工艺参数的数据的手段。 DLPM感测由制造过程漂移产生的参数变化，并输出过程参数的度量。 DLPM通常将感测两个或多个测试设备之间的过程参数的不匹配，作为类似的一对生产设备之间的过程变化的量度。 DLPM可用作诊断工具，以确定IC在规格范围内无法执行的原因，或者收集关于给定代工厂或过程的测量过程参数的统计信息。

公开(公告)号：US08253422B2

公开(公告)日：2012-08-28

申请号：US13048703

申请日：2011-03-15

申请人： Bert M. Vermeire ,  Farhang F. Shadman

发明人： Bert M. Vermeire ,  Farhang F. Shadman

IPC分类号： G01R31/08

CPC分类号： H01L21/67288 ,  G01N27/02 ,  H01L21/67028 ,  H01L21/67057

摘要： A method of improving the clean, rinse and dry processes during the manufacture of ICs, MEMS and other micro-devices to conserve solution and energy while completing the process within a specified time. An electro-chemical residue sensor (ECRS) provides in-situ and real-time measurement of residual contamination on a surface or inside void micro features within the sensor representative of conditions on production wafers. The in-situ measurements are used to design and optimize a production process. The wafers are manufactured in accordance with the production process without the ECRS.

摘要翻译： 一种在制造IC，MEMS和其他微型装置的过程中改进清洁，冲洗和干燥工艺的方法，以在规定时间内完成工艺过程中节省溶液和能量。 电化学残留物传感器（ECRS）提供了现场和实时测量表面上的残留污染物或传感器内的空隙微特征，代表生产晶片上的条件。 原位测量用于设计和优化生产过程。 晶圆根据不含ECRS的生产工艺制造。

公开(公告)号：US08120368B2

公开(公告)日：2012-02-21

申请号：US13047509

申请日：2011-03-14

申请人： Bert M. Vermeire ,  Farhang F. Shadman

发明人： Bert M. Vermeire ,  Farhang F. Shadman

IPC分类号： G01R31/08 ,  G01R27/08

CPC分类号： H01L21/67288 ,  G01N27/02 ,  H01L21/67028 ,  H01L21/67057

摘要： A method of improving the clean, rinse and dry processes during the manufacture of ICs, MEMS and other micro-devices to conserve solution and energy while completing the process within a specified time. An electro-chemical residue sensor (ECRS) provides in-situ and real-time measurement of residual contamination on a surface or inside void micro features within the sensor representative of conditions on production wafers. The measured impedance can be used to determine what process variables and specifically how process conditions affect the rate of change of the measured impedance. The in-situ measurements are used to design and optimize a production process and/or to monitor the production run in real-time to control the process conditions and transfer of a patterned wafer through the processes.

摘要翻译： 一种在制造IC，MEMS和其他微型装置的过程中改进清洁，冲洗和干燥工艺的方法，以在规定时间内完成工艺过程中节省溶液和能量。 电化学残留物传感器（ECRS）提供了现场和实时测量表面上的残留污染物或传感器内的空隙微特征，代表生产晶片上的条件。 测量的阻抗可用于确定哪些过程变量，具体如何影响测量阻抗的变化率。 原位测量用于设计和优化生产过程和/或实时监控生产运行，以通过该过程控制图案化晶片的工艺条件和转移。

公开(公告)号：US08030943B2

公开(公告)日：2011-10-04

申请号：US12360046

申请日：2009-01-26

申请人： Philipp S. Spuhler ,  Bert M Vermeire ,  James P Hofmeister

发明人： Philipp S. Spuhler ,  Bert M Vermeire ,  James P Hofmeister

IPC分类号： G01R31/08

CPC分类号： G01R31/048 ,  G01R31/2884 ,  G01R31/312

摘要： The solder-joint integrity of digital electronic packages, such as FPGAs or microcontrollers that have internally connected input/output buffers, is evaluated by applying a time-varying voltage through one or more solder-joint networks to charge a charge-storage component. Each network includes an I/O buffer on the die in the package and a solder-joint connection, typically one or more such connections inside the package and between the package and a board. The time constant for charging the component is proportional to the resistance of the solder-joint network, hence the voltage across the charge-storage component is a measurement of the integrity of the solder-joint network.

摘要翻译： 数字电子封装（例如具有内部连接的输入/输出缓冲器的微控制器）的焊接完整性通过通过一个或多个焊点网络施加时变电压来对电荷存储部件进行充电来评估。 每个网络包括在封装中的管芯上的I / O缓冲器和焊接接头，通常在封装内部以及封装与板之间的一个或多个这样的连接。 用于对部件充电的时间常数与焊点网络的电阻成比例，因此电荷存储部件两端的电压是测量焊点网络的完整性。

公开(公告)号：US07932726B1

公开(公告)日：2011-04-26

申请号：US11968726

申请日：2008-01-03

申请人： Bert M. Vermeire ,  Farhang F. Shadman

发明人： Bert M. Vermeire ,  Farhang F. Shadman

IPC分类号： G01R31/08 ,  G01N27/00

CPC分类号： H01L21/67288 ,  G01N27/02 ,  H01L21/67028 ,  H01L21/67057

摘要： A method of improving the clean, rinse and dry processes during the manufacture of ICs, MEMS and other micro-devices to conserve solution and energy while completing the process within a specified time. An electro-chemical residue sensor (ECRS) provides in-situ and real-time measurement of residual contamination on a surface or inside void micro features within the sensor representative of conditions on production wafers. The measured impedance can be used to determine what process variables and specifically how process conditions affect the rate of change of the measured impedance. The in-situ measurements are used to design and optimize a production process and/or to monitor the production run in real-time to control the process conditions and transfer of a patterned wafer through the processes.

摘要翻译： 一种在制造IC，MEMS和其他微型装置的过程中改进清洁，冲洗和干燥工艺的方法，以在规定时间内完成工艺过程中节省溶液和能量。 电化学残留物传感器（ECRS）提供了现场和实时测量表面上的残留污染物或传感器内的空隙微特征，代表生产晶片上的条件。 测量的阻抗可用于确定哪些过程变量，具体如何影响测量阻抗的变化率。 原位测量用于设计和优化生产过程和/或实时监控生产运行，以通过该过程控制图案化晶片的工艺条件和转移。

公开(公告)号：US20090160457A1

公开(公告)日：2009-06-25

申请号：US12360046

申请日：2009-01-26

申请人： Philipp S. Spuhler ,  Bert M. Vermeire ,  James P. Hofmeister

发明人： Philipp S. Spuhler ,  Bert M. Vermeire ,  James P. Hofmeister

IPC分类号： G01R31/02

CPC分类号： G01R31/048 ,  G01R31/2884 ,  G01R31/312

摘要： The solder-joint integrity of digital electronic packages, such as FPGAs or microcontrollers that have internally connected input/output buffers, is evaluated by applying a time-varying voltage through one or more solder-joint networks to charge a charge-storage component. Each network includes an I/O buffer on the die in the package and a solder-joint connection, typically one or more such connections inside the package and between the package and a board. The time constant for charging the component is proportional to the resistance of the solder-joint network, hence the voltage across the charge-storage component is a measurement of the integrity of the solder-joint network.

摘要翻译： 数字电子封装（例如具有内部连接的输入/输出缓冲器的微控制器）的焊接完整性通过通过一个或多个焊点网络施加时变电压来对电荷存储部件进行充电来评估。 每个网络包括在封装中的管芯上的I / O缓冲器和焊接接头，通常在封装内部以及封装与板之间的一个或多个这样的连接。 用于对部件充电的时间常数与焊点网络的电阻成比例，因此电荷存储部件两端的电压是测量焊点网络的完整性。

公开(公告)号：US07501832B2

公开(公告)日：2009-03-10

申请号：US11325076

申请日：2006-01-04

申请人： Philipp S. Spuhler ,  Bert M. Vermeire ,  James P. Hofmeister

发明人： Philipp S. Spuhler ,  Bert M. Vermeire ,  James P. Hofmeister

IPC分类号： G01R31/02

CPC分类号： G01R31/048 ,  G01R31/2884 ,  G01R31/312

摘要： The solder-joint integrity of digital electronic packages, such as FPGAs or microcontrollers that have internally connected input/output buffers, is evaluated by applying a time-varying voltage through one or more solder-joint networks to charge a charge-storage component. Each network includes an I/O buffer on the die in the package and a solder-joint connection, typically one or more such connections inside the package and between the package and a board. The time constant for charging the component is proportional to the resistance of the solder-joint network, hence the voltage across the charge-storage component is a measurement of the integrity of the solder-joint network.

摘要翻译： 数字电子封装（例如具有内部连接的输入/输出缓冲器的微控制器）的焊接完整性通过通过一个或多个焊点网络施加时变电压来对电荷存储部件进行充电来评估。 每个网络包括在封装中的管芯上的I / O缓冲器和焊接接头，通常在封装内部以及封装与板之间的一个或多个这样的连接。 用于对部件充电的时间常数与焊点网络的电阻成比例，因此电荷存储部件两端的电压是测量焊点网络的完整性。

公开(公告)号：US07196294B2

公开(公告)日：2007-03-27

申请号：US11350446

申请日：2006-02-09

申请人： James P. Hofmeister ,  Philipp S. Spuhler ,  Bert M. Vermeire

发明人： James P. Hofmeister ,  Philipp S. Spuhler ,  Bert M. Vermeire

IPC分类号： H05B1/02

CPC分类号： G01R31/048 ,  B23K1/0016 ,  B23K2101/40 ,  G01R31/2884 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/0401

摘要： A solder-joint detection circuit uses a resistive bridge and a differential detector to detect faults in the solder-joint network both inside and outside the digital electronic package during operation. The resistive bridge is preferably coupled to a high supply voltage used to power the package. Resistors R1 and R2 are connected in series at a first junction between the high and low supply voltages and a resistor R3 is coupled to the high supply voltage and connected in series with the resistance of the solder-network at a second junction. The network is held at a low voltage on the die. The detector compares the sensitivity and detection voltages and outputs a Pass/Fail signal for the solder-joint network.

摘要翻译： 焊接检测电路使用电阻桥和差分检测器来检测数字电子封装内部和外部的焊点网络中的故障。 电阻桥优选地耦合到用于为封装供电的高电源电压。 电阻器R 1和R 2在高电源电压和低电源电压之间的第一连接处串联连接，并且电阻器R 3耦合到高电源电压并且在第二连接处与焊料网络的电阻串联连接。 网络在模具上保持低电压。 检测器比较灵敏度和检测电压，并输出焊点网络的通过/失败信号。