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    METHOD FOR MANUFACTURING A FLUORESCENT RESIN FILM AND FLUORESCENT RESIN FILM MANUFACTURED THEREBY
    1.
    发明申请
    METHOD FOR MANUFACTURING A FLUORESCENT RESIN FILM AND FLUORESCENT RESIN FILM MANUFACTURED THEREBY 审中-公开
    制造荧光树脂膜和荧光树脂薄膜制造方法

    公开(公告)号：US20140141283A1

    公开(公告)日：2014-05-22

    申请号：US14127878

    申请日：2011-08-12

    申请人： Seung Jae Lee ,  Na Na Park ,  Gyeong Seon Seon Park ,  Bo Kyoung Kim ,  Jong Rak Sohn ,  Chang Hoon Kwak

    发明人： Seung Jae Lee ,  Na Na Park ,  Gyeong Seon Seon Park ,  Bo Kyoung Kim ,  Jong Rak Sohn ,  Chang Hoon Kwak

    IPC分类号： C09K11/02 ,  B05D5/06

    CPC分类号： C09K11/025 ,  B05D5/06 ,  C08J7/06 ,  C09K11/08

    摘要： A method of manufacturing a phosphor resin film and a phosphor resin film manufactured thereby are provided. The method of manufacturing a phosphor resin film includes preparing a polymer slurry by mixing a polymer resin and a latent curing agent in a solvent, spreading the polymer slurry such that it has a film shape, drying the spread polymer slurry to form a semi-hardened resin film, and providing phosphor powder to the semi-hardened resin film. A phosphor resin film includes semi-hardened resin film including a polymer resin and a latent curing agent and phosphors uniformly formed on one surface of the semi-hardened resin film.

    摘要翻译： 提供了制造荧光体树脂膜的方法和由此制造的荧光体树脂膜。 制造荧光体树脂膜的方法包括通过在溶剂中混合聚合物树脂和潜在性固化剂来制备聚合物浆料，将聚合物浆料铺展成膜形状，干燥扩展聚合物浆料以形成半硬化 树脂膜，并向半硬化树脂膜提供荧光体粉末。 荧光体树脂膜包括半固化树脂膜，其包含聚合物树脂和潜在性固化剂以及均匀地形成在半硬化树脂膜的一个表面上的荧光体。

    Camera module and method of manufacturing the same
    4.
    发明授权
    Camera module and method of manufacturing the same 失效
    相机模块及其制造方法

    公开(公告)号：US08149321B2

    公开(公告)日：2012-04-03

    申请号：US12081218

    申请日：2008-04-11

    申请人： Jin Mun Ryu ,  Jung Jin Kim ,  Bo Kyoung Kim ,  Jae Sub Cho

    发明人： Jin Mun Ryu ,  Jung Jin Kim ,  Bo Kyoung Kim ,  Jae Sub Cho

    IPC分类号： H04N5/225

    CPC分类号： H04N5/2253 ,  H04N5/2257

    摘要： Provided is a camera module including a housing that is formed in a rectangular box shape and has a cylindrical barrel coupling portion extending upward from the central portion thereof; an image sensor module that is mounted in the housing; a lens barrel that has a lens insertion port provided in the central portion thereof and a housing coupling portion extending downward therefrom, the housing coupling portion being closely coupled to the barrel coupling portion of the housing; a wafer lens that is mounted in the lens insertion port of the lens barrel; and a lens fixing cap that is covered on the upper end portion of the lens barrel.

    摘要翻译： 本发明提供一种照相机模块，其包括：壳体，其形成为矩形盒状，并且具有从其中心部向上方延伸的筒状筒状连结部; 安装在所述壳体中的图像传感器模块; 透镜筒，其具有设置在其中心部分的透镜插入口和从其向下延伸的壳体联接部分，所述壳体联接部分紧密地联接到所述壳体的镜筒联接部分; 晶片透镜，其安装在透镜镜筒的透镜插入口中; 以及覆盖在镜筒的上端部的透镜固定帽。

    Camera module
    5.
    发明申请
    Camera module 审中-公开
    相机模块

    公开(公告)号：US20080278621A1

    公开(公告)日：2008-11-13

    申请号：US12149834

    申请日：2008-05-08

    申请人： Jae Sub Cho ,  Jung Jin Kim ,  Jin Mun Ryu ,  Bo Kyoung Kim

    发明人： Jae Sub Cho ,  Jung Jin Kim ,  Jin Mun Ryu ,  Bo Kyoung Kim

    IPC分类号： H04N5/225

    CPC分类号： H04N5/2253 ,  G02B7/022 ,  G03B17/12 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00014

    摘要： The present invention relates to a camera module capable of being surface mounted (SMT) on a main substrate.In accordance with the present invention, the camera module includes a housing provided with a cylindrical barrel coupling unit extended upward from a central part of the housing, wherein a female screw unit is formed on an inner circumferential surface of the cylindrical barrel coupling unit and an opening unit is formed on a top portion of the cylindrical barrel coupling unit; a lens barrel provided with a male screw unit on an outer circumferential surface by being formed in a cylindrical shape to be conformally combined with the barrel coupling unit and screw-coupled to the female screw unit by being inserted through the opening unit of the barrel coupling unit; a wafer lens mounted in the lens barrel; and a substrate with an image sensor mounted on a top surface of the substrate by a wire bonding and closely coupled to a lower part of the housing by being provided with surface mounting pads on each lateral surface thereof and has advantages that the process for mounting the camera module onto the substrate is simplified and further a process cost is reduced by removing an additional connection device for electrically connecting the camera module to the main substrate.

    摘要翻译： 本发明涉及能够在主基板上进行表面安装（SMT）的相机模块。 根据本发明，摄像机模块包括：壳体，其具有从壳体的中心部分向上延伸的圆柱形筒形联接单元，其中，内螺纹单元形成在圆筒形筒形联接单元的内圆周表面上， 开口单元形成在圆筒形筒连接单元的顶部上; 透镜筒，通过形成为圆柱形形状的外圆周表面上的外螺纹单元，以与圆筒联接单元共形组合，并通过插入筒形联接器的开口单元而螺纹联接到阴螺纹单元 单元; 安装在镜筒中的晶片透镜; 以及具有图像传感器的基板，其通过引线接合安装在基板的顶表面上，并且通过在其每个侧表面上设置有表面安装垫并且紧密地耦合到壳体的下部，并且具有以下优点： 相机模块被简化，并且通过去除用于将相机模块电连接到主基板的附加连接装置，进一步降低了处理成本。

    Camera module and method of manufacturing the same
    6.
    发明申请
    Camera module and method of manufacturing the same 失效
    相机模块及其制造方法

    公开(公告)号：US20080252775A1

    公开(公告)日：2008-10-16

    申请号：US12081218

    申请日：2008-04-11

    申请人： Jin Mun Ryu ,  Jung Jin Kim ,  Bo Kyoung Kim ,  Jae Sub Cho

    发明人： Jin Mun Ryu ,  Jung Jin Kim ,  Bo Kyoung Kim ,  Jae Sub Cho

    IPC分类号： H04N5/225 ,  H01L21/00

    CPC分类号： H04N5/2253 ,  H04N5/2257

    摘要： Provided is a camera module including a housing that is formed in a rectangular box shape and has a cylindrical barrel coupling portion extending upward from the central portion thereof; an image sensor module that is mounted in the housing; a lens barrel that has a lens insertion port provided in the central portion thereof and a housing coupling portion extending downward therefrom, the housing coupling portion being closely coupled to the barrel coupling portion of the housing; a wafer lens that is mounted in the lens insertion port of the lens barrel; and a lens fixing cap that is covered on the upper end portion of the lens barrel.

    摘要翻译： 本发明提供一种照相机模块，其包括：壳体，其形成为矩形盒状，并且具有从其中心部向上方延伸的筒状筒状连结部; 安装在所述壳体中的图像传感器模块; 透镜筒，其具有设置在其中心部分的透镜插入口和从其向下延伸的壳体联接部分，所述壳体联接部分紧密地联接到所述壳体的镜筒联接部分; 晶片透镜，其安装在透镜镜筒的透镜插入口中; 以及覆盖在镜筒的上端部的透镜固定帽。