公开(公告)号：US20070025108A1

公开(公告)日：2007-02-01

申请号：US11495043

申请日：2006-07-28

申请人： Howard Kingsford ,  Kristel Ferry ,  William Clune ,  Mark Clarner ,  Bryan Blackmon

发明人： Howard Kingsford ,  Kristel Ferry ,  William Clune ,  Mark Clarner ,  Bryan Blackmon

IPC分类号： F21V29/00

CPC分类号： H05K3/0014 ,  B29C2043/465 ,  B29L2031/729 ,  F21S4/20 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/183 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/301 ,  H05K3/326 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/066 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2201/2036 ,  H05K2201/209 ,  H05K2203/0108 ,  H05K2203/0113 ,  H05K2203/0143 ,  H05K2203/1189 ,  H05K2203/1545 ,  Y10S362/80

摘要： A flexible circuit has a roll-molded thermoplastic resin base sheet with an integrally molded mounting structure located to receive a light emitting diode device in an illuminating position. The mounting structure is a pin receptacle constructed to receive a pin of the light emitting diode device. An electrically conductive portion is carried by the resin base and positioned for electric connection to conductors of the device. Another flexible circuit carries discrete integrated circuit chips and a field of fastener elements extending from a surface of a resin strip carrying conductive traces interconnecting the chips.

摘要翻译： 柔性电路具有卷成型热塑性树脂基片，其具有整体模制的安装结构，其被定位成在发光位置接收发光二极管器件。 安装结构是构造成接收发光二极管器件的引脚的引脚插座。 导电部分由树脂基底承载并且定位成与装置的导体电连接。 另一个柔性电路承载分离的集成电路芯片和从承载导电迹线的树脂带的表面延伸的紧固件元件的领域，互连芯片。