NONVOLATILE MEMORY DEVICE AND METHOD OF FORMING THE SAME
    3.
    发明申请
    NONVOLATILE MEMORY DEVICE AND METHOD OF FORMING THE SAME 有权
    非易失性存储器件及其形成方法

    公开(公告)号:US20120037971A1

    公开(公告)日:2012-02-16

    申请号:US13181700

    申请日:2011-07-13

    IPC分类号: H01L29/78 H01L27/06 H01L29/94

    摘要: A nonvolatile memory device has a first active region and a second active region defined in a substrate by a device isolation layer, a Metal Oxide Silicon Field-Effect Transistor (MOSFET) disposed on the first active region and including a first electrode pattern, and a Metal Oxide Silicon (MOS) capacitor disposed on the second active region and including a second electrode pattern, and in which the first electrode pattern is narrower in the widthwise direction of the channel of the MOSFET than the first active region.

    摘要翻译: 非易失性存储器件具有通过器件隔离层在衬底中限定的第一有源区和第二有源区,设置在第一有源区上并包括第一电极图的金属氧化物半导体场效应晶体管(MOSFET) 金属氧化物硅(MOS)电容器,其设置在第二有源区并且包括第二电极图案,并且其中第一电极图案在MOSFET的沟道的宽度方向上比第一有源区域窄。

    Cell structure of EPROM device and method for fabricating the same
    4.
    发明授权
    Cell structure of EPROM device and method for fabricating the same 有权
    EPROM器件的单元结构及其制造方法

    公开(公告)号:US07348241B2

    公开(公告)日:2008-03-25

    申请号:US11384727

    申请日:2006-03-20

    IPC分类号: H01L21/336

    摘要: Provided are a cell structure of an EPROM device and a method for fabricating the same. The cell structure includes a gate stack, which includes a first floating gate, an insulating pattern including a nitride layer, and a control gate that are sequentially stacked on a semiconductor substrate, and includes a window for exposing the top surface or both sidewalls of the first floating gate on both sides of the control gate, so that charges of the first floating gate can be erased by ultraviolet rays. The cell structure further includes a floating gate transistor, which includes a gate insulating layer formed on the semiconductor substrate, a second floating gate that is formed on the gate insulating layer and is connected to the first floating gate in the gate stack, and a source/drain that is formed in the semiconductor substrate so as to be aligned to the second floating gate. In the cell structure, the window is formed on the top surface or both sidewalls of the first floating gate of the gate stack. Thus, ultraviolet rays can penetrate through the window and easily erase charges of the programmed cell.

    摘要翻译: 提供EPROM器件的单元结构及其制造方法。 电池结构包括栅极堆叠,其包括第一浮置栅极,包括氮化物层的绝缘图案和顺序地堆叠在半导体衬底上的控制栅极,并且包括用于暴露所述顶部表面或两个侧壁的窗口 第一个浮动栅极位于控制栅极的两侧,使得第一个浮动栅极的电荷可以被紫外线消除。 电池结构还包括浮栅晶体管,其包括形成在半导体衬底上的栅极绝缘层,形成在栅极绝缘层上并连接到栅堆叠中的第一浮栅的第二浮栅,以及源极 /漏极,其形成在半导体衬底中以便与第二浮栅对准。 在电池结构中,窗口形成在栅堆叠的第一浮栅的顶表面或两个侧壁上。 因此,紫外线可以穿过窗口并容易地擦除编程单元的电荷。

    Stabilizer circuit for high-voltage discharge lamp
    5.
    发明申请
    Stabilizer circuit for high-voltage discharge lamp 失效
    稳压电路用于高压放电灯

    公开(公告)号:US20060138970A1

    公开(公告)日:2006-06-29

    申请号:US11317708

    申请日:2005-12-22

    IPC分类号: H05B41/24

    摘要: A stabilizer circuit for a high-voltage discharge lamp is provided. The stabilizer comprises an electromagnetic interference (EMI) filter; a rectifying unit; a power factor correction (PFC) circuit; a buck converter; a commutator; an igniter; a high-voltage discharge lamp; a current detector; a voltage detector; an igniter voltage controller for receiving the voltage output from the igniter and controlling the voltage when abnormality in the high-voltage discharge lamp occurs.

    摘要翻译: 提供了一种用于高压放电灯的稳定电路。 稳定器包括电磁干扰(EMI)滤波器; 整流单元 功率因数校正(PFC)电路; 降压转换器; 换向器 点火器 高压放电灯; 电流检测器; 电压检测器; 点火器电压控制器,用于接收从点火器输出的电压并且在高压放电灯中发生异常时控制电压。

    Cell structure of non-volatile memory device and method for fabricating the same

    公开(公告)号:US06995421B2

    公开(公告)日:2006-02-07

    申请号:US10621571

    申请日:2003-07-18

    IPC分类号: H01L29/788

    摘要: A cell structure of a non-volatile memory device, which uses a nitride layer as a floating gate spacer, includes a gate stack and a floating gate transistor formed over a semiconductor substrate. The gate stack includes a first portion of a floating gate, a control gate formed over the first portion of the floating gate, and a non-nitride spacer adjacent to sidewalls of the first portion of floating gate. The floating gate transistor includes a second portion of the floating gate, which substantially overlaps a source and/or drain formed in the substrate. The application of ultraviolet rays to the non-nitride spacer of a programmed cell can causes the second portion of the floating gate to discharge, thereby easily erasing the programmed cell.

    SOI semiconductor integrated circuit for eliminating floating body effects in SOI MOSFETs and method of fabricating the same
    7.
    发明授权
    SOI semiconductor integrated circuit for eliminating floating body effects in SOI MOSFETs and method of fabricating the same 有权
    用于消除SOI MOSFET中的浮体效应的SOI半导体集成电路及其制造方法

    公开(公告)号:US06703280B2

    公开(公告)日:2004-03-09

    申请号:US10330404

    申请日:2002-12-27

    IPC分类号: H01L218244

    CPC分类号: H01L29/78615

    摘要: A silicon-on-insulator (SOI) integrated circuit and a method of fabricating the SOI integrated circuit are provided. At least one isolated transistor active region and a body line are formed on an SOI substrate. The transistor active region and the body line are surrounded by an isolation layer which is in contact with a buried insulating layer of the SOI substrate. A portion of the sidewall of the transistor active region is extended to the body line. Thus, the transistor active region is electrically connected to the body line through a body extension. The body extension is covered with a body insulating layer. An insulated gate pattern is formed over the transistor active region, and one end of the gate pattern is overlapped with the body insulating layer.

    摘要翻译: 提供了绝缘体上硅(SOI)集成电路和制造SOI集成电路的方法。 在SOI衬底上形成至少一个隔离晶体管有源区和体线。 晶体管有源区和体线被与SOI衬底的掩埋绝缘层接触的隔离层围绕。 晶体管有源区的侧壁的一部分延伸到主体线。 因此,晶体管有源区域通过主体延伸部电连接到主体线路。 身体延伸部分覆盖有身体绝缘层。 绝缘栅图案形成在晶体管有源区上方,栅极图案的一端与主体绝缘层重叠。

    SOI semiconductor integrated circuit for eliminating floating body effects in SOI MOSFETs and method of fabricating the same
    8.
    发明授权
    SOI semiconductor integrated circuit for eliminating floating body effects in SOI MOSFETs and method of fabricating the same 有权
    用于消除SOI MOSFET中的浮体效应的SOI半导体集成电路及其制造方法

    公开(公告)号:US06521959B2

    公开(公告)日:2003-02-18

    申请号:US09782116

    申请日:2001-02-13

    IPC分类号: H01L2972

    CPC分类号: H01L29/78615

    摘要: A silicon-on-insulator (SOI) integrated circuit and a method of fabricating the SOI integrated circuit are provided. At least one isolated transistor active region and a body line are formed on an SOI substrate. The transistor active region and the body line are surrounded by an isolation layer which is in contact with a buried insulating layer of the SOI substrate. A portion of the sidewall of the transistor active region is extended to the body line. Thus, the transistor active region is electrically connected to the body line through a body extension. The body extension is covered with a body insulating layer. An insulated gate pattern is formed over the transistor active region, and one end of the gate pattern is overlapped with the body insulating layer.

    摘要翻译: 提供了绝缘体上硅(SOI)集成电路和制造SOI集成电路的方法。 在SOI衬底上形成至少一个隔离晶体管有源区和体线。 晶体管有源区和体线被与SOI衬底的掩埋绝缘层接触的隔离层围绕。 晶体管有源区的侧壁的一部分延伸到主体线。 因此,晶体管有源区域通过主体延伸部电连接到主体线路。 身体延伸部分覆盖有身体绝缘层。 绝缘栅图案形成在晶体管有源区上方,栅极图案的一端与主体绝缘层重叠。

    Semiconductor device having silicon on insulator and fabricating method therefor

    公开(公告)号:US06407429B1

    公开(公告)日:2002-06-18

    申请号:US09658099

    申请日:2000-09-08

    IPC分类号: H01L310392

    CPC分类号: H01L27/1203 H01L21/84

    摘要: The present invention relates to an SOI semiconductor device and a method for fabricating an SOI semiconductor device, in which the portions formed with silicide layers are laterally restricted by spacers to a predetermined range in the diffusion regions to be used for diodes or well resistors. In this manner, it is possible to fix the length of distance between the sides of a silicide layer and a diffusion region, greater than that available in the prior art techniques, thereby minimizing power leakage at the sides of the diffusion regions. In the SOI semiconductor device thus constructed, the diffusion regions to be used for diodes (or well resistors) are constructed with spacers in a double junction structure of different density of impurity layers (for instance, a P− or N− layer respectively surrounds a P+ or N+ layer), in other words, only onto a high density of impurity layer, the P+ or N+ layer, or in a single junction structure in which the spacers restrict a range of space for forming the silicide layer in the diffusion region.