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16 条记录 (耗时 0.019 秒)

    Coated Optical Fiber and Grating and Processes for Forming Same
    3.
    发明申请
    Coated Optical Fiber and Grating and Processes for Forming Same 审中-公开
    涂层光纤及其成型工艺

    公开(公告)号：US20070189687A1

    公开(公告)日：2007-08-16

    申请号：US11562552

    申请日：2006-11-22

    申请人： Christopher Walker ,  Larry Boardman ,  Dora Paolucci

    发明人： Christopher Walker ,  Larry Boardman ,  Dora Paolucci

    IPC分类号： G02B6/036

    CPC分类号： G02B6/02123 ,  C03C25/106 ,  C03C25/12 ,  C03C25/6226 ,  C09D183/04 ,  G02B6/02104 ,  G02B6/02395 ,  G02B2006/02161 ,  C08L83/00 ,  C08L2666/52

    摘要： A curable coating composition that may be converted to a cured coating for an optical fiber during a continuous fiber coating process. The curable coating composition comprises an organohydrogenpolysiloxane, an alkenyl functional polysiloxane, and an ultraviolet radiation absorbing hydrosilation photocatalyst in an amount for crosslink formation between the organohydrogenpolysiloxane and the alkenyl functional polysiloxane. The curable coating composition crosslinks under the influence of ultraviolet radiation to provide a cured coating having a high level of transparency to ultraviolet radiation. Application of heat to the curable coating composition accelerates the rate of cured coating formation. The high level of transparency of the cured coating allows from about 70% to about 99% of radiation of wavelengths from about 240 nm to about 275 nm to pass through the coating for writing a refractive index grating to produce an optical fiber Bragg grating .

    摘要翻译： 一种可固化的涂料组合物，其可在连续纤维涂布过程中转化为光纤的固化涂层。 可固化涂料组合物包含有机氢聚硅氧烷，链烯基官能聚硅氧烷和有机氢聚硅氧烷与烯基官能聚硅氧烷之间的交联形成量的紫外线吸收硅氢化光催化剂。 可固化涂料组合物在紫外线辐射的作用下交联，提供对紫外线辐射具有高透明度的固化涂层。 对可固化涂料组合物的热量加速了固化涂层形成的速度。 固化涂层的高水平透明度允许从约240nm至约275nm的波长的约70％至约99％的辐射通过用于写入折射率光栅的涂层以产生光纤布拉格光栅。

    Method of making light emitting device with silicon-containing encapsulant
    7.
    发明申请
    Method of making light emitting device with silicon-containing encapsulant 审中-公开
    用含硅密封剂制造发光器件的方法

    公开(公告)号：US20070092736A1

    公开(公告)日：2007-04-26

    申请号：US11255711

    申请日：2005-10-21

    申请人： Larry Boardman ,  D. Thompson ,  Catherine Leatherdale ,  Andrew Ouderkirk

    发明人： Larry Boardman ,  D. Thompson ,  Catherine Leatherdale ,  Andrew Ouderkirk

    IPC分类号： B32B27/04 ,  H01L21/56 ,  C08L83/04 ,  C08G77/04

    CPC分类号： C08J3/243 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08J2383/04 ,  C08L83/04 ,  H01L33/56 ,  H01L2224/45144 ,  H01L2224/48091 ,  Y10T428/31663 ,  C08L83/00 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A method of making a light emitting device is disclosed herein. The method includes the steps of: (A) providing a light emitting diode; and (B) contacting the light emitting diode with a photopolymerizable composition having: a silicon-containing resin comprising silicon-bonded hydrogen and aliphatic unsaturation; a first metal-containing catalyst that may be activated by actinic radiation; and a second metal-containing catalyst that may be activated by heat but not the actinic radiation. The method may further include the step of: (C) applying actinic radiation of 700 nm or less to initiate hydrosilylation within the silicon-containing resin. The method may also include the step of: (D) heating the photopolymerizable composition to less than 150° C. to further initiate hydrosilylation, or (D) simultaneously applying actinic radiation and heat.

    摘要翻译： 本文公开了一种制造发光器件的方法。 该方法包括以下步骤：（A）提供发光二极管; 和（B）使所述发光二极管与光聚合组合物接触，所述组合物具有：含硅键合的氢和脂族不饱和的含硅树脂; 可以通过光化辐射活化的第一含金属催化剂; 和可以通过热而不是光化辐射活化的第二含金属催化剂。 该方法还可以包括以下步骤：（C）施加700nm或更小的光化辐射以引发含硅树脂内的氢化硅烷化。 该方法还可以包括以下步骤：（D）将可光聚合组合物加热至低于150℃以进一步引发氢化硅烷化，或（D）同时施加光化辐射和加热。

    Method of making LED encapsulant with undulating surface
    9.
    发明申请
    Method of making LED encapsulant with undulating surface 审中-公开
    制造具有起伏表面的LED密封剂的方法

    公开(公告)号：US20060189013A1

    公开(公告)日：2006-08-24

    申请号：US11064686

    申请日：2005-02-24

    申请人： Craig Schardt ,  David Thompson ,  Larry Boardman

    发明人： Craig Schardt ,  David Thompson ,  Larry Boardman

    IPC分类号： H01L21/56

    CPC分类号： H01L33/54 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： An LED package includes an LED die and a light-transmissive material encapsulating the die. The encapsulant is formed by dispensing a curable material onto a substrate, such as a carrier on which is mounted the LED die, to form a liquid mass thereon, the liquid mass having an unconstrained smooth outer surface. The dispensed material is then cured to convert the liquid mass to a solid encapsulant having an outer encapsulant surface, the curing being performed under conditions to provide the outer encapsulant surface with undulating surface features. The encapsulant can alternatively be formed on a release liner or other film and after curing be affixed to an LED, such as an LED die, an LED die mounted to another substrate, or an LED die mounted to another substrate and encapsulated initially in another light transmissive material.

    摘要翻译： LED封装包括LED管芯和封装管芯的透光材料。 密封剂通过将可固化材料分配到诸如其上安装有LED管芯的载体上的基板上以在其上形成液体物质而形成，液体物质具有无约束的光滑的外表面。 然后将分配的材料固化以将液体物质转化为具有外部密封剂表面的固体密封剂，该固化在使外部密封剂表面具有起伏的表面特征的条件下进行。 封装剂可替换地形成在剥离衬垫或其它膜上，并且在固化之后固定到诸如LED管芯的LED，安装到另一衬底的LED管芯或安装到另一个衬底上的LED管芯，并且最初封装在另一个光 透射材料。