公开(公告)号：US07145251B2

公开(公告)日：2006-12-05

申请号：US11038756

申请日：2005-01-19

申请人： Sang Hyun Ryu ,  Chan Yeok Park ,  Ji Young Chung

发明人： Sang Hyun Ryu ,  Chan Yeok Park ,  Ji Young Chung

IPC分类号： H01L29/80

CPC分类号： H05K1/0269 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/10 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45693 ,  H01L2224/48 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/85002 ,  H01L2224/85205 ,  H01L2224/85909 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H05K3/3436 ,  H05K7/1061 ,  H05K2201/10734 ,  H05K2203/041 ,  H05K2203/161 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： The surface of a solder ball and a conductive wire for a semiconductor package are coated with a predetermined colorant. Various colorants may be used according to the diameter and metal composition of the solder ball and the conductive wire. The colorant is formed by mixing organic compound and dye of a predetermined color. Examples of organic compounds excellent in physicochemical bonding with metal include benzotriazole, alkylimidazole and benzimidazole. The solder ball is fabricated by coating an organic compound of a predetermined color on the surface of a typical solder ball. The conductive wire is fabricated by coating an organic compound of a predetermined color on a general conductive wire between heat process and winding. Moreover, the solder ball is evaporated in a reflowing step after bumped via flux and the conductive wire is evaporated in a wire bonding step so that the solder ball and the conductive wire return to their unique colors.

摘要翻译： 用预定的着色剂涂覆焊球的表面和用于半导体封装的导线。 可以根据焊球和导线的直径和金属组成使用各种着色剂。 通过混合有机化合物和预定颜色的染料形成着色剂。 具有与金属物理化学键合性优异的有机化合物的实例包括苯并三唑，烷基咪唑和苯并咪唑。 焊球通过在典型的焊球的表面上涂覆预定颜色的有机化合物来制造。 导线通过在热处理和绕组之间的一般导线上涂覆预定颜色的有机化合物来制造。 此外，焊料球在通过焊剂撞击之后以回流步骤蒸发，并且导线在引线接合步骤中蒸发，使得焊球和导线恢复到其独特的颜色。

公开(公告)号：US06888242B2

公开(公告)日：2005-05-03

申请号：US10437749

申请日：2003-05-14

申请人： Sang Hyun Ryu ,  Chan Yeok Park ,  Ji Young Chung

发明人： Sang Hyun Ryu ,  Chan Yeok Park ,  Ji Young Chung

IPC分类号： H01L21/60 ,  B23K3/06 ,  H01L21/48 ,  H01L21/607 ,  H01L23/485 ,  H01L23/488 ,  H01L23/49 ,  H01L23/498 ,  H01L23/544 ,  H05K1/02 ,  H05K3/34 ,  H05K7/10 ,  H01L23/04

CPC分类号： H05K1/0269 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/10 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45693 ,  H01L2224/48 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/85002 ,  H01L2224/85205 ,  H01L2224/85909 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H05K3/3436 ,  H05K7/1061 ,  H05K2201/10734 ,  H05K2203/041 ,  H05K2203/161 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： The surface of a solder ball and a conductive wire for a semiconductor package are coated with a predetermined colorant. Various colorants may be used according to the diameter and metal composition of the solder ball and the conductive wire. The colorant is formed by mixing organic compound and dye of a predetermined color. Examples of organic compounds excellent in physicochemical bonding with metal include benzotriazole, alkylimidazole and benzimidazole. The solder ball is fabricated by coating an organic compound of a predetermined color on the surface of a typical solder ball. The conductive wire is fabricated by coating an organic compound of a predetermined color on a general conductive wire between heat process and winding. Moreover, the solder ball is evaporated in a reflowing step after bumped via flux and the conductive wire is evaporated in a wire bonding step so that the solder ball and the conductive wire return to their unique colors.

摘要翻译： 用预定的着色剂涂覆焊球的表面和用于半导体封装的导线。 可以根据焊球和导线的直径和金属组成使用各种着色剂。 通过混合有机化合物和预定颜色的染料形成着色剂。 具有与金属物理化学键合性优异的有机化合物的实例包括苯并三唑，烷基咪唑和苯并咪唑。 焊球通过在典型的焊球的表面上涂覆预定颜色的有机化合物来制造。 导线通过在热处理和绕组之间的一般导线上涂覆预定颜色的有机化合物来制造。 此外，焊料球在通过焊剂撞击之后以回流步骤蒸发，并且导线在引线接合步骤中蒸发，使得焊球和导线恢复到其独特的颜色。