公开(公告)号：US07145251B2

公开(公告)日：2006-12-05

申请号：US11038756

申请日：2005-01-19

申请人： Sang Hyun Ryu ,  Chan Yeok Park ,  Ji Young Chung

发明人： Sang Hyun Ryu ,  Chan Yeok Park ,  Ji Young Chung

IPC分类号： H01L29/80

CPC分类号： H05K1/0269 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/10 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45693 ,  H01L2224/48 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/85002 ,  H01L2224/85205 ,  H01L2224/85909 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H05K3/3436 ,  H05K7/1061 ,  H05K2201/10734 ,  H05K2203/041 ,  H05K2203/161 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： The surface of a solder ball and a conductive wire for a semiconductor package are coated with a predetermined colorant. Various colorants may be used according to the diameter and metal composition of the solder ball and the conductive wire. The colorant is formed by mixing organic compound and dye of a predetermined color. Examples of organic compounds excellent in physicochemical bonding with metal include benzotriazole, alkylimidazole and benzimidazole. The solder ball is fabricated by coating an organic compound of a predetermined color on the surface of a typical solder ball. The conductive wire is fabricated by coating an organic compound of a predetermined color on a general conductive wire between heat process and winding. Moreover, the solder ball is evaporated in a reflowing step after bumped via flux and the conductive wire is evaporated in a wire bonding step so that the solder ball and the conductive wire return to their unique colors.

摘要翻译： 用预定的着色剂涂覆焊球的表面和用于半导体封装的导线。 可以根据焊球和导线的直径和金属组成使用各种着色剂。 通过混合有机化合物和预定颜色的染料形成着色剂。 具有与金属物理化学键合性优异的有机化合物的实例包括苯并三唑，烷基咪唑和苯并咪唑。 焊球通过在典型的焊球的表面上涂覆预定颜色的有机化合物来制造。 导线通过在热处理和绕组之间的一般导线上涂覆预定颜色的有机化合物来制造。 此外，焊料球在通过焊剂撞击之后以回流步骤蒸发，并且导线在引线接合步骤中蒸发，使得焊球和导线恢复到其独特的颜色。

公开(公告)号：US06888242B2

公开(公告)日：2005-05-03

申请号：US10437749

申请日：2003-05-14

申请人： Sang Hyun Ryu ,  Chan Yeok Park ,  Ji Young Chung

发明人： Sang Hyun Ryu ,  Chan Yeok Park ,  Ji Young Chung

IPC分类号： H01L21/60 ,  B23K3/06 ,  H01L21/48 ,  H01L21/607 ,  H01L23/485 ,  H01L23/488 ,  H01L23/49 ,  H01L23/498 ,  H01L23/544 ,  H05K1/02 ,  H05K3/34 ,  H05K7/10 ,  H01L23/04

CPC分类号： H05K1/0269 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/10 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45693 ,  H01L2224/48 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/85002 ,  H01L2224/85205 ,  H01L2224/85909 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H05K3/3436 ,  H05K7/1061 ,  H05K2201/10734 ,  H05K2203/041 ,  H05K2203/161 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： The surface of a solder ball and a conductive wire for a semiconductor package are coated with a predetermined colorant. Various colorants may be used according to the diameter and metal composition of the solder ball and the conductive wire. The colorant is formed by mixing organic compound and dye of a predetermined color. Examples of organic compounds excellent in physicochemical bonding with metal include benzotriazole, alkylimidazole and benzimidazole. The solder ball is fabricated by coating an organic compound of a predetermined color on the surface of a typical solder ball. The conductive wire is fabricated by coating an organic compound of a predetermined color on a general conductive wire between heat process and winding. Moreover, the solder ball is evaporated in a reflowing step after bumped via flux and the conductive wire is evaporated in a wire bonding step so that the solder ball and the conductive wire return to their unique colors.

摘要翻译： 用预定的着色剂涂覆焊球的表面和用于半导体封装的导线。 可以根据焊球和导线的直径和金属组成使用各种着色剂。 通过混合有机化合物和预定颜色的染料形成着色剂。 具有与金属物理化学键合性优异的有机化合物的实例包括苯并三唑，烷基咪唑和苯并咪唑。 焊球通过在典型的焊球的表面上涂覆预定颜色的有机化合物来制造。 导线通过在热处理和绕组之间的一般导线上涂覆预定颜色的有机化合物来制造。 此外，焊料球在通过焊剂撞击之后以回流步骤蒸发，并且导线在引线接合步骤中蒸发，使得焊球和导线恢复到其独特的颜色。

公开(公告)号：US07317245B1

公开(公告)日：2008-01-08

申请号：US11279002

申请日：2006-04-07

申请人： Kyu Won Lee ,  Chan Yok Park ,  Sang Hyun Ryu

发明人： Kyu Won Lee ,  Chan Yok Park ,  Sang Hyun Ryu

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H05K3/242 ,  H01L21/4846 ,  H01L21/486 ,  H01L2924/0002 ,  H05K3/243 ,  H05K3/28 ,  H05K3/323 ,  H05K3/429 ,  H05K2201/0352 ,  H05K2203/054 ,  H05K2203/0542 ,  H05K2203/1394 ,  H05K2203/1581 ,  H01L2924/00

摘要： Disclosed is a method for manufacturing a semiconductor device substrate. A substrate having no bus line and lead-in line is efficiently manufactured. In a step needing an electroplating process, conductive film is temporarily attached to circuit patterns in order to electrically connect all circuit patterns. A plating is formed in desired regions of the circuit patterns with a predetermined thickness in an electroplating method. The conductive film is completely removed while the substrate is manufactured so that the circuit patterns are electrically independent of one another, and the resulting substrate has no bus line and lead-in line.

摘要翻译： 公开了半导体器件基板的制造方法。 没有总线和引入线的基板被有效地制造。 在需要电镀工艺的步骤中，导电膜临时连接到电路图案上，以便电连接所有电路图案。 在电镀方法中以预定的厚度在电路图案的期望区域中形成电镀。 在制造基板时，导电膜被完全去除，使得电路图案彼此电独立，并且所得到的基板没有总线和引入线。

公开(公告)号：US06825062B2

公开(公告)日：2004-11-30

申请号：US10152945

申请日：2002-05-22

申请人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

发明人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

IPC分类号： H01L2144

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the corners of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.

摘要翻译： 公开了一种用于制造半导体封装的引线框架。 引线框架的引线包括提供在每个内引线的自由端处的引线锁，其适于增加内引线与树脂封装件的结合力，从而有效地防止内引线的分离在所涉及的单个加工过程中发生 制造半导体封装。 还公开了使用引线框制造的半导体封装和用于半导体封装的制造方法。 引线框架包括桨，用于支撑桨的角的多个连杆，多个引线，其布置在桨的四个侧面或两个相对的侧面中，使得它们与相邻侧面间隔开 的叶片，同时垂直于桨叶的相关侧延伸，每个引线具有引线分离防止装置，其适于增加引线与随后模制的树脂封装件的结合力，以封装引线框架以制造半导体封装， 和用于支撑引线和连接条的阻挡条。 另外的封装实施例包括从引线向下延伸的暴露突起。 在焊球附着步骤之前，用激光照射暴露的突起以去除固化树脂。

公开(公告)号：US06448633B1

公开(公告)日：2002-09-10

申请号：US09444035

申请日：1999-11-19

申请人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

发明人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

IPC分类号： H01L23495

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the comers of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.

摘要翻译： 公开了一种用于制造半导体封装的引线框架。 引线框架的引线包括提供在每个内引线的自由端处的引线锁，其适于增加内引线与树脂封装件的结合力，从而有效地防止内引线的分离在所涉及的单个加工过程中发生 制造半导体封装。 还公开了使用引线框制造的半导体封装和用于半导体封装的制造方法。 引线框架包括桨，用于支撑桨的角的多个连杆，多个引线布置在桨的四个侧面或两个相对的侧面中，使得它们与相邻侧面间隔开 的叶片，同时垂直于桨叶的相关侧延伸，每个引线具有引线分离防止装置，其适于增加引线与随后模制的树脂封装件的结合力，以封装引线框架以制造半导体封装， 和用于支撑引线和连接条的阻挡条。 另外的封装实施例包括从引线向下延伸的暴露突起。 在焊球附着步骤之前，用激光照射暴露的突起以去除固化树脂。

公开(公告)号：US07564122B2

公开(公告)日：2009-07-21

申请号：US11365246

申请日：2006-03-01

申请人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

发明人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the corners of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.

摘要翻译： 公开了一种用于制造半导体封装的引线框架。 引线框架的引线包括提供在每个内引线的自由端处的引线锁，其适于增加内引线与树脂封装件的结合力，从而有效地防止内引线的分离在所涉及的单个加工过程中发生 制造半导体封装。 还公开了使用引线框制造的半导体封装和用于半导体封装的制造方法。 引线框架包括桨，用于支撑桨的角的多个连杆，多个引线，其布置在桨的四个侧面或两个相对的侧面中，使得它们与相邻侧面间隔开 的叶片，同时垂直于桨叶的相关侧延伸，每个引线具有引线分离防止装置，其适于增加引线与随后模制的树脂封装件的结合力，以封装引线框架以制造半导体封装， 和用于支撑引线和连接条的阻挡条。 另外的封装实施例包括从引线向下延伸的暴露突起。 在焊球附着步骤之前，用激光照射暴露的突起以去除固化树脂。

公开(公告)号：US07057280B2

公开(公告)日：2006-06-06

申请号：US10667227

申请日：2003-09-18

申请人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

发明人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

IPC分类号： H01L23/04

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the corners of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.

摘要翻译： 公开了一种用于制造半导体封装的引线框架。 引线框架的引线包括提供在每个内引线的自由端处的引线锁，其适于增加内引线与树脂封装件的结合力，从而有效地防止内引线的分离在所涉及的单个加工过程中发生 制造半导体封装。 还公开了使用引线框制造的半导体封装和用于半导体封装的制造方法。 引线框架包括桨，用于支撑桨的角的多个连杆，多个引线，其布置在桨的四个侧面或两个相对的侧面中，使得它们与相邻侧面间隔开 的叶片，同时垂直于桨叶的相关侧延伸，每个引线具有引线分离防止装置，其适于增加引线与随后模制的树脂封装件的结合力，以封装引线框架以制造半导体封装， 和用于支撑引线和连接条的阻挡条。 另外的封装实施例包括从引线向下延伸的暴露突起。 在焊球附着步骤之前，用激光照射暴露的突起以去除固化树脂。