公开(公告)号：US20130292456A1

公开(公告)日：2013-11-07

申请号：US13979269

申请日：2012-01-12

申请人： Vahid Safavi Ardebili

发明人： Vahid Safavi Ardebili

IPC分类号： B23K20/10 ,  B23K20/24

CPC分类号： B23K20/10 ,  B23K20/004 ,  B23K20/24 ,  B23K35/383 ,  B23K35/386 ,  B23K2103/10 ,  H01L24/45 ,  H01L24/745 ,  H01L24/78 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/4554 ,  H01L2224/745 ,  H01L2224/78 ,  H01L2224/85002 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/00012 ,  H01L2224/48

摘要： An ultrasonic bonding system is provided. The system includes: a) a bond head assembly carrying an ultrasonic bonding tool; b) a conductive material supply; c) a conductive material feeding system for guiding a length of the conductive material supply to a position proximate the ultrasonic bonding tool; and d) a vapor generation system for supplying a vapor proximate the ultrasonic bonding tool, the vapor including a carrier gas and a lubricating vapor.

摘要翻译： 提供超声波接合系统。 该系统包括：a）承载超声波焊接工具的粘结头组件; b）导电材料供应; c）导电材料供给系统，用于将导电材料供应的一段长度引导到靠近超声波焊接工具的位置; 以及d）用于在超声波接合工具附近供应蒸气的蒸气产生系统，所述蒸气包括载气和润滑蒸气。

公开(公告)号：US07145251B2

公开(公告)日：2006-12-05

申请号：US11038756

申请日：2005-01-19

申请人： Sang Hyun Ryu ,  Chan Yeok Park ,  Ji Young Chung

发明人： Sang Hyun Ryu ,  Chan Yeok Park ,  Ji Young Chung

IPC分类号： H01L29/80

CPC分类号： H05K1/0269 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/10 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45693 ,  H01L2224/48 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/85002 ,  H01L2224/85205 ,  H01L2224/85909 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H05K3/3436 ,  H05K7/1061 ,  H05K2201/10734 ,  H05K2203/041 ,  H05K2203/161 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： The surface of a solder ball and a conductive wire for a semiconductor package are coated with a predetermined colorant. Various colorants may be used according to the diameter and metal composition of the solder ball and the conductive wire. The colorant is formed by mixing organic compound and dye of a predetermined color. Examples of organic compounds excellent in physicochemical bonding with metal include benzotriazole, alkylimidazole and benzimidazole. The solder ball is fabricated by coating an organic compound of a predetermined color on the surface of a typical solder ball. The conductive wire is fabricated by coating an organic compound of a predetermined color on a general conductive wire between heat process and winding. Moreover, the solder ball is evaporated in a reflowing step after bumped via flux and the conductive wire is evaporated in a wire bonding step so that the solder ball and the conductive wire return to their unique colors.

摘要翻译： 用预定的着色剂涂覆焊球的表面和用于半导体封装的导线。 可以根据焊球和导线的直径和金属组成使用各种着色剂。 通过混合有机化合物和预定颜色的染料形成着色剂。 具有与金属物理化学键合性优异的有机化合物的实例包括苯并三唑，烷基咪唑和苯并咪唑。 焊球通过在典型的焊球的表面上涂覆预定颜色的有机化合物来制造。 导线通过在热处理和绕组之间的一般导线上涂覆预定颜色的有机化合物来制造。 此外，焊料球在通过焊剂撞击之后以回流步骤蒸发，并且导线在引线接合步骤中蒸发，使得焊球和导线恢复到其独特的颜色。

公开(公告)号：US20050156327A1

公开(公告)日：2005-07-21

申请号：US11038756

申请日：2005-01-19

申请人： Sang Ryu ,  Chan Park ,  Ji Chung

发明人： Sang Ryu ,  Chan Park ,  Ji Chung

IPC分类号： H01L21/60 ,  B23K3/06 ,  H01L21/48 ,  H01L21/607 ,  H01L23/485 ,  H01L23/488 ,  H01L23/49 ,  H01L23/498 ,  H01L23/544 ,  H05K1/02 ,  H05K3/34 ,  H05K7/10 ,  H01L23/52

CPC分类号： H05K1/0269 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/10 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45693 ,  H01L2224/48 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/85002 ,  H01L2224/85205 ,  H01L2224/85909 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H05K3/3436 ,  H05K7/1061 ,  H05K2201/10734 ,  H05K2203/041 ,  H05K2203/161 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： The surface of a solder ball and a conductive wire for a semiconductor package are coated with a predetermined colorant. Various colorants may be used according to the diameter and metal composition of the solder ball and the conductive wire. The colorant is formed by mixing organic compound and dye of a predetermined color. Examples of organic compounds excellent in physicochemical bonding with metal include benzotriazole, alkylimidazole and benzimidazole. The solder ball is fabricated by coating an organic compound of a predetermined color on the surface of a typical solder ball. The conductive wire is fabricated by coating an organic compound of a predetermined color on a general conductive wire between heat process and winding. Moreover, the solder ball is evaporated in a reflowing step after bumped via flux and the conductive wire is evaporated in a wire bonding step so that the solder ball and the conductive wire return to their unique colors.

摘要翻译： 用预定的着色剂涂覆焊球的表面和用于半导体封装的导线。 可以根据焊球和导线的直径和金属组成使用各种着色剂。 通过混合有机化合物和预定颜色的染料形成着色剂。 具有与金属物理化学键合性优异的有机化合物的实例包括苯并三唑，烷基咪唑和苯并咪唑。 焊球通过在典型的焊球的表面上涂覆预定颜色的有机化合物来制造。 导线通过在热处理和绕组之间的一般导线上涂覆预定颜色的有机化合物来制造。 此外，焊料球在通过焊剂撞击之后以回流步骤蒸发，并且导线在引线接合步骤中蒸发，使得焊球和导线恢复到其独特的颜色。

公开(公告)号：US20040169272A1

公开(公告)日：2004-09-02

申请号：US10792244

申请日：2004-03-03

发明人： David R. Hembree

IPC分类号： H01L023/495

CPC分类号： H01L23/3121 ,  H01L21/4871 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85002 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/05599

摘要： A thermally enhanced Chip On Board semiconductor device with a heat sink is described. In one aspect, a thermally conducting filled gel elastomer material or a silicon elastomeric material or elastomeric material, if the material is to be removed, is applied to the die surface to which the heat sink is to be bonded. During the subsequent glob top application and curing steps, difficult-to-remove glob top material which otherwise may be misapplied to the die surface adheres to the upper surface of the elastomer material. The elastomer material is removed by peeling prior to adhesion bonding of the heat sink to the die. In another aspect, the thermally conducting filled gel elastomer material is applied between a die surface and the inside attachment surface of a cap-style heat sink to eliminate overpressure on the die/substrate interface.

摘要翻译： 描述了具有散热器的热增强型片上半导体器件。 在一个方面，如果要去除材料，则导热填充的凝胶弹性体材料或硅弹性体材料或弹性体材料被施加到待结合散热器的模具表面。 在后续的全球顶部应用和固化步骤中，难以去除的球形材料，否则可能被错误地应用到模具表面附着到弹性体材料的上表面。 在将散热器粘附到模具之前，通过剥离除去弹性体材料。 在另一方面，将导热填充的凝胶弹性体材料施加在模具表面和盖式散热器的内部附接表面之间，以消除模具/衬底界面上的过压。

公开(公告)号：US09570430B2

公开(公告)日：2017-02-14

申请号：US14709924

申请日：2015-05-12

申请人： GLOBALFOUNDRIES, Inc.

发明人： Frank Kuechenmeister ,  Christian Klewer ,  Jens Oswald

IPC分类号： H01L25/00 ,  H01L23/00 ,  H01L25/065 ,  H01L23/31

CPC分类号： H01L25/50 ,  H01L23/3114 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/03009 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05572 ,  H01L2224/0603 ,  H01L2224/06051 ,  H01L2224/08147 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/48097 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81002 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/85002 ,  H01L2224/92127 ,  H01L2224/94 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2224/05599 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Articles including bonded metal structures and methods of preparing the same are provided herein. In an embodiment, a method of preparing an article that includes bonded metal structures includes providing a first substrate. A first metal structure and a second metal structure are formed on the first substrate. The first metal structure and the second metal structure each include an exposed contact surface. A bond mask is formed over the contact surface of the first metal structure. A second substrate is bonded to the first substrate through the exposed contact surface of the second metal structure. The bond mask remains disposed over the exposed contact surface of the second metal structure during bonding of the second substrate to the first substrate. A wire is bonded to the exposed contact surface of the first metal structure.

摘要翻译： 本文提供了包含粘结金属结构的物质及其制备方法。 在一个实施方案中，制备包含粘合金属结构的制品的方法包括提供第一基底。 在第一基板上形成第一金属结构和第二金属结构。 第一金属结构和第二金属结构各自包括暴露的接触表面。 在第一金属结构的接触表面上形成接合掩模。 第二衬底通过第二金属结构的暴露的接触表面结合到第一衬底。 在第二衬底与第一衬底接合期间，接合掩模保持设置在第二金属结构的暴露的接触表面上。 线接合到第一金属结构的暴露的接触表面。

公开(公告)号：US20140001632A1

公开(公告)日：2014-01-02

申请号：US13537388

申请日：2012-06-29

申请人： Trent S. Uehling ,  Burton J. Carpenter ,  Brett P. Wilkerson

发明人： Trent S. Uehling ,  Burton J. Carpenter ,  Brett P. Wilkerson

IPC分类号： H01L23/498 ,  H01L21/56

CPC分类号： H01L24/83 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83002 ,  H01L2224/85002 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1811 ,  H01L2924/18165 ,  H01L2924/182 ,  H01L2924/183 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A package structure includes a package substrate having a top surface and a bottom surface. A semiconductor die having a top surface and a bottom surface. The semiconductor die is mounted to the package substrate. The bottom surface of the semiconductor die is adjacent to the top surface of the package substrate. An air gap is between the bottom surface of the package substrate and the bottom surface of semiconductor die.

摘要翻译： 封装结构包括具有顶表面和底表面的封装衬底。 一种具有顶表面和底表面的半导体管芯。 将半导体管芯安装到封装衬底。 半导体管芯的底表面与封装衬底的顶表面相邻。 在封装衬底的底表面和半导体管芯的底表面之间存在气隙。

公开(公告)号：US06784113B2

公开(公告)日：2004-08-31

申请号：US10200929

申请日：2002-07-22

申请人： David R. Hembree

发明人： David R. Hembree

IPC分类号： H01L2148

CPC分类号： H01L23/3121 ,  H01L21/4871 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85002 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/05599

摘要： A process for forming a thermally enhanced Chip On Board semiconductor device with a heat sink is described. In one aspect, a thermally conductive-filled gel elastomer or a silicon elastomeric material or elastomeric material, if the material is to be removed, is applied to the die surface to which the heat sink is to be bonded. During the subsequent glob top application and curing steps, difficult-to-remove glob top material which otherwise may be misapplied to the die surface adheres to the upper surface of the elastomer material. The elastomer material is removed by peeling prior to adhesion bonding of the heat sink to the die. In another aspect, the thermally conductive-filled gel elastomer is applied between a die surface and the inside attachment surface of a cap-style heat sink to eliminate overpressure on the die/substrate interface.

摘要翻译： 描述了一种用于形成具有散热器的散热增强型片上半导体器件的工艺。 在一个方面，如果要除去材料，则将导热填充的凝胶弹性体或硅弹性体材料或弹性体材料施加到待结合散热器的模具表面。 在后续的全球顶部应用和固化步骤中，难以去除的球形材料，否则可能被错误地应用到模具表面附着到弹性体材料的上表面。 在将散热器粘附到模具之前，通过剥离除去弹性体材料。 在另一方面，将导热填充的凝胶弹性体施加在模具表面和盖式散热器的内部附接表面之间，以消除模具/衬底界面上的过压。

公开(公告)号：US20030219927A1

公开(公告)日：2003-11-27

申请号：US10437749

申请日：2003-05-14

发明人： Sang Hyun Ryu ,  Chan Yeok Park ,  Ji Young Chung

IPC分类号： H01L021/48

CPC分类号： H05K1/0269 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/10 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45693 ,  H01L2224/48 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/85002 ,  H01L2224/85205 ,  H01L2224/85909 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H05K3/3436 ,  H05K7/1061 ,  H05K2201/10734 ,  H05K2203/041 ,  H05K2203/161 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： The surface of a solder ball and a conductive wire for a semiconductor package are coated with a predetermined colorant. Various colorants may be used according to the diameter and metal composition of the solder ball and the conductive wire. The colorant is formed by mixing organic compound and dye of a predetermined color. Examples of organic compounds excellent in physicochemical bonding with metal include benzotriazole, alkylimidazole and benzimidazole. The solder ball is fabricated by coating an organic compound of a predetermined color on the surface of a typical solder ball. The conductive wire is fabricated by coating an organic compound of a predetermined color on a general conductive wire between heat process and winding. Moreover, the solder ball is evaporated in a reflowing step after bumped via flux and the conductive wire is evaporated in a wire bonding step so that the solder ball and the conductive wire return to their unique colors.

摘要翻译： 用预定的着色剂涂覆焊球的表面和用于半导体封装的导线。 可以根据焊球和导线的直径和金属组成使用各种着色剂。 通过混合有机化合物和预定颜色的染料形成着色剂。 具有与金属物理化学键合性优异的有机化合物的实例包括苯并三唑，烷基咪唑和苯并咪唑。 焊球通过在典型的焊球的表面上涂覆预定颜色的有机化合物来制造。 导线通过在热处理和绕组之间的一般导线上涂覆预定颜色的有机化合物来制造。 此外，焊料球在通过焊剂撞击之后以回流步骤蒸发，并且导线在引线接合步骤中蒸发，使得焊球和导线恢复到其独特的颜色。

公开(公告)号：US06630371B2

公开(公告)日：2003-10-07

申请号：US10189097

申请日：2002-07-02

申请人： David R. Hembree

发明人： David R. Hembree

IPC分类号： H01L2148

CPC分类号： H01L23/3121 ,  H01L21/4871 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85002 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/05599

摘要： A process for forming a thermally enhanced Chip On Board semiconductor device with a heat sink is described. In one aspect, a thermally conducting filled gel elastomer material or a silicon elastomeric material or elastomeric material, if the material is to be removed, is applied to the die surface to which the heat sink is to be bonded. During the subsequent glob top application and curing steps, difficult-to-remove glob top material which otherwise may be misapplied to the die surface adheres to the upper surface of the elastomer material. The elastomer material is removed by peeling prior to adhesion bonding of the heat sink to the die. In another aspect, the thermally conducting filled gel elastomer material is applied between a die surface and the inside attachment surface of a cap-style heat sink to eliminate overpressure on the die/substrate interface.

公开(公告)号：US09368470B2

公开(公告)日：2016-06-14

申请号：US14529744

申请日：2014-10-31

申请人： FREESCALE SEMICONDUCTOR, INC.

发明人： Chu-Chung Lee ,  Burton J. Carpenter ,  Tu-Anh N. Tran

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/44 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L24/45 ,  H01L24/05 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/4555 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45573 ,  H01L2224/45574 ,  H01L2224/45618 ,  H01L2224/45623 ,  H01L2224/45624 ,  H01L2224/45664 ,  H01L2224/484 ,  H01L2224/4845 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48507 ,  H01L2224/48824 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/78304 ,  H01L2224/85002 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/8593 ,  H01L2224/85943 ,  H01L2924/00011 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01049

摘要： A semiconductor device includes a bond formed on a bond pad. The bond is formed of a wire that includes a central core of conductive metal, a first coating over the central core of conductive metal that is more chemically active than the conductive metal, and a second coating over the central core of conductive metal that is less chemically active than the central core of conductive metal.

摘要翻译： 半导体器件包括形成在接合焊盘上的键。 该键由包括导电金属的中心芯的导线形成，导电金属的中心芯上的第一涂层比导电金属更具化学活性，并且导电金属的中心芯上的第二涂层较少 比导电金属的中心芯化学活性。