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公开(公告)号：USD574337S1
公开(公告)日：2008-08-05
申请号：US29285459
申请日：2007-03-29
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2.发明授权公开(公告)号：US06925238B2
公开(公告)日：2005-08-02
申请号：US10313919
申请日：2002-12-06
CPC分类号： G01M11/35 , G02B6/2852 , G02B6/30 , G02B6/4214
摘要： A method for testing an optical chip, while the optical chip is still on a wafer, utilizing an optical probe, includes the steps of creating an access point on the wafer adjacent the optical chip. The optical chip having a waveguide having an axis. A portion of the waveguide is removed to form the access point such that light exiting the planar optical waveguide is directed in a direction substantially different from the axis of the waveguide. An optical probe is placed along a propagation path of the exiting light to optically couple the optical probe and optical chip.
摘要翻译： 利用光学探针的光学芯片仍在晶片上的同时测试光学芯片的方法包括以下步骤：在邻近光学芯片的晶片上形成接入点。 光学芯片具有具有轴的波导。 去除波导的一部分以形成接入点，使得离开平面光波导的光在与波导的轴线基本上不同的方向上被引导。 沿着出射光的传播路径放置光学探针以光学耦合光学探针和光学芯片。
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公开(公告)号：USD617289S1
公开(公告)日：2010-06-08
申请号：US29285460
申请日：2007-03-29
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公开(公告)号：US07692207B2
公开(公告)日：2010-04-06
申请号：US11210013
申请日：2005-08-23
申请人： Alexei A. Erchak , Paul Panaccione , Robert F. Karlicek, Jr. , Michael Lim , Elefterios Lidorikis , Jo A. Venezia , Christian Hoepfner
发明人： Alexei A. Erchak , Paul Panaccione , Robert F. Karlicek, Jr. , Michael Lim , Elefterios Lidorikis , Jo A. Venezia , Christian Hoepfner
IPC分类号： H01L23/14
CPC分类号： H01L24/24 , F21K9/00 , H01L33/385 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： Light-emitting devices, and related components, processes, systems and methods are disclosed.
摘要翻译： 公开了发光器件及相关部件，工艺，系统和方法。
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公开(公告)号：USD576968S1
公开(公告)日：2008-09-16
申请号：US29285433
申请日：2007-03-29
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公开(公告)号：US07170100B2
公开(公告)日：2007-01-30
申请号：US11209957
申请日：2005-08-23
申请人： Alexei A. Erchak , Paul Panaccione , Robert F. Karlicek, Jr. , Michael Lim , Elefterios Lidorikis , Jo A. Venezia , Christian Hoepfner
发明人： Alexei A. Erchak , Paul Panaccione , Robert F. Karlicek, Jr. , Michael Lim , Elefterios Lidorikis , Jo A. Venezia , Christian Hoepfner
IPC分类号： H01L29/18
CPC分类号： H01L25/0753 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2924/01012 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： Light-emitting devices, and related components, processes, systems and methods are disclosed.
摘要翻译： 公开了发光器件及相关部件，工艺，系统和方法。
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公开(公告)号：US20060163587A1
公开(公告)日：2006-07-27
申请号：US11209957
申请日：2005-08-23
申请人： Alexei Erchak , Paul Panaccione , Robert Karlicek , Michael Lim , Elefterios Lidorikis , Jo Venezia , Christian Hoepfner
发明人： Alexei Erchak , Paul Panaccione , Robert Karlicek , Michael Lim , Elefterios Lidorikis , Jo Venezia , Christian Hoepfner
IPC分类号： H01L31/12
CPC分类号： H01L25/0753 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2924/01012 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： Light-emitting devices, and related components, processes, systems and methods are disclosed.
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公开(公告)号：US08092064B2
公开(公告)日：2012-01-10
申请号：US11757734
申请日：2007-06-04
申请人： Alexei A. Erchak , Robert F. Karlicek , David Doyle , Gianni Taraschi , Michael A. Joffe , Christian Hoepfner
发明人： Alexei A. Erchak , Robert F. Karlicek , David Doyle , Gianni Taraschi , Michael A. Joffe , Christian Hoepfner
IPC分类号： F21V7/04
CPC分类号： G02B6/0085 , G02B6/0018 , G02B6/0028 , G02F1/133615 , G02F2001/133628 , G02F2201/36 , Y10T29/49826
摘要： Illumination assemblies, components, and related methods are described. An illumination assembly is provided that comprises a plurality of illumination tiles each having a light emission surface. The plurality of illumination tiles are arranged in a two-dimensional array. The illumination tiles are constructed and arranged so as to provide a substantially contiguous illumination surface comprising the light emission surfaces of the plurality of the illumination tiles. Each illumination tile is illuminated by at least one solid state light-emitting device. A method of local dimming an illumination assembly of a display (e.g., LCD) backlight unit is also provided.
摘要翻译： 描述照明组件，组件和相关方法。 提供一种照明组件，其包括多个具有发光表面的照明瓦片。 多个照明瓦片被布置成二维阵列。 照明瓦片被构造和布置成提供包括多个照明瓦片的光发射表面的基本上邻接的照明表面。 每个照明瓦片由至少一个固态发光装置照射。 还提供了一种局部调光显示器（例如，LCD）背光单元的照明组件的方法。
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公开(公告)号：USD624029S1
公开(公告)日：2010-09-21
申请号：US29285428
申请日：2007-03-29
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公开(公告)号：USD623609S1
公开(公告)日：2010-09-14
申请号：US29285434
申请日：2007-03-29
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