公开(公告)号：US06856217B1

公开(公告)日：2005-02-15

申请号：US10660332

申请日：2003-09-11

Applicant: John R. Clark ,  Clark T.-C. Nguyen

Inventor： John R. Clark ,  Clark T.-C. Nguyen

IPC: B81B5/00 ,  B81B3/00 ,  H03H3/007 ,  H03H3/013 ,  H03H9/02 ,  H03H9/24 ,  H03H9/46 ,  H03H9/50 ,  H03H9/05 ,  H03H9/125

CPC classification number: H03H9/505 ,  H03H3/007 ,  H03H3/0072 ,  H03H3/013 ,  H03H9/02362 ,  H03H9/2436 ,  H03H9/46 ,  H03H9/462 ,  H03H2009/02496 ,  H03H2009/02503 ,  H03H2009/02527

Abstract: A micromechanical resonator device and a micromechanical device utilizing same are disclosed based upon a radially or laterally vibrating disk structure and capable of vibrating at frequencies well past the GHz range. The center of the disk is a nodal point, so when the disk resonator is supported at its center, anchor dissipation to the substrate is minimized, allowing this design to retain high-Q at high frequency. In addition, this design retains high stiffness at high frequencies and so maximizes dynamic range. Furthermore, the sidewall surface area of this disk resonator is often larger than that attainable in previous flexural-mode resonator designs, allowing this disk design to achieve a smaller series motional resistance than its counterparts when using capacitive (or electrostatic) transduction at a given frequency. Capacitive detection is not required in this design, and piezoelectric, magnetostrictive, etc. detection are also possible. The frequency and dynamic range attainable by this resonator makes it applicable to high-Q RF filtering and oscillator applications in a wide variety of communication systems. Its size also makes it particularly suited for portable, wireless applications, where, if used in large numbers, such a resonator can greatly lower the power consumption, increase robustness, and extend the range of application of high performance wireless transceivers.

Abstract translation: 基于径向或横向振动盘结构并且能够在远超过GHz范围的频率振动的微机械谐振器装置和利用其的微机械装置公开。 磁盘的中心是一个节点，因此当磁盘谐振器被支撑在其中心时，对基板的锚固耗散最小化，允许该设计在高频率下保持高Q。 此外，该设计在高频下保持高刚度，从而使动态范围最大化。 此外，该盘式谐振器的侧壁表面积通常大于在先前的弯曲模式谐振器设计中可获得的侧壁表面积，允许该盘设计在给定频率下使用电容（或静电）换能时获得比其对应物更小的串联运动电阻 。 该设计中不需要电容检测，压电，磁致伸缩等检测也是可能的。 该谐振器可实现的频率和动态范围使其适用于各种通信系统中的高Q RF滤波和振荡器应用。 其尺寸也使其特别适用于便携式无线应用，其中如果大量使用，这种谐振器可以大大降低功耗，增强鲁棒性，并扩展高性能无线收发器的应用范围。

公开(公告)号：US06680660B2

公开(公告)日：2004-01-20

申请号：US10342029

申请日：2003-01-14

Applicant: Clark T. C. Nguyen

Inventor： Clark T. C. Nguyen

IPC: H03H946

CPC classification number: H03H3/0078 ,  H01H59/0009 ,  H01H2059/0072 ,  H03H9/02409 ,  H03H9/24 ,  H03H9/2452 ,  H03H9/462 ,  H03H9/465 ,  H03H9/467 ,  H03H9/505 ,  H03H2009/02511 ,  H03H2009/02519 ,  H03H2009/02527

Abstract: Several MEMS-based methods and architectures which utilize vibrating micromechanical resonators in circuits to implement filtering, mixing, frequency reference and amplifying functions are provided. For example, a method and apparatus for selecting at least one desired channel in an RF receiver subsystem is shown. One of the primary benefits of the use of such architectures is a savings in power consumption by trading power for high selectivity (i.e., high Q). Consequently, the present invention relies on the use of a large number of micromechanical links in SSI to VLSI networks to implement signal processing functions with basically zero DC power consumption.

Abstract translation: 提供了几种利用电路中的振动微机械谐振器来实现滤波，混频，频率参考和放大功能的基于MEMS的方法和架构。 例如，示出了用于在RF接收机子系统中选择至少一个期望信道的方法和装置。 使用这种架构的主要优点之一是通过为高选择性（即高Q）的交易功率节省了功耗。 因此，本发明依赖于在SSI到VLSI网络中使用大量的微机械链路来实现基本上零直流功率消耗的信号处理功能。

公开(公告)号：US06667558B2

公开(公告)日：2003-12-23

申请号：US10413189

申请日：2003-04-14

Applicant: Ark-Chew Wong ,  Clark T.-C. Nguyen

Inventor： Ark-Chew Wong ,  Clark T.-C. Nguyen

IPC: H01L2348

CPC classification number: B81B7/007 ,  B81B2203/0361 ,  B81C1/00253 ,  B81C2203/019 ,  B81C2203/035 ,  B81C2203/038 ,  B81C2203/051 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/3011

Abstract: A module bonded together at a microplatform and an improved method for making the module are provided. The method includes providing a micromechanical device including a first substrate, the microplatform, a first plurality of bonding sites on the microplatform, a micromechanical structure fabricated and supported on the microplatform and a support structure to suspend the microplatform above the first substrate. The method further includes providing a transistor circuit wafer including a second plurality of bonding sites thereon and integrated BiCMOS transistor circuits. The first and second plurality of bonding sites are aligned and compression bonded so that the microplatform is both electrically and mechanically coupled to the second substrate to form the module. The platform carrier wafer can be torn off, leaving bonded platforms behind on the substrate wafer. This allows small form factor merging of the two different technologies.

公开(公告)号：US06569754B2

公开(公告)日：2003-05-27

申请号：US09938359

申请日：2001-08-23

Applicant: Ark-Chew Wong ,  Clark T. -C. Nguyen

Inventor： Ark-Chew Wong ,  Clark T. -C. Nguyen

IPC: H01L2144

CPC classification number: B81B7/007 ,  B81B2203/0361 ,  B81C1/00253 ,  B81C2203/019 ,  B81C2203/035 ,  B81C2203/038 ,  B81C2203/051 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/3011

Abstract: A module bonded together at a microplatform and an improved method for making the module are provided. The method includes providing a micromechanical device including a first substrate, the microplatform, a first plurality of bonding sites on the microplatform, a micromechanical structure fabricated and supported on the microplatform and a support structure to suspend the microplatform above the first substrate. The method further includes providing a transistor circuit wafer including a second plurality of bonding sites thereon and integrated BiCMOS transistor circuits. The first and second plurality of bonding sites are aligned and compression bonded so that the microplatform is both electrically and mechanically coupled to the second substrate to form the module. The platform carrier wafer can be torn off, leaving bonded platforms behind on the substrate wafer. This allows small form factor merging of the two different technologies.

Abstract translation: 提供了以微平台结合在一起的模块和用于制造模块的改进方法。 该方法包括提供微机械装置，其包括第一基板，微平台，微平台上的第一多个结合位置，在微平台上制造和支撑的微机械结构以及将微平台悬置在第一基板上方的支撑结构。 该方法还包括提供晶体管电路晶片，其上包括第二多个结合位置和集成的BiCMOS晶体管电路。 第一和第二多个结合部位被对准并压接，使得微平台与第二基板电连接和机械耦合以形成模块。 平台载体晶片可以被撕下，使粘结平台留在基片上。 这允许两种不同技术的小尺寸合并。

公开(公告)号：US06249073B1

公开(公告)日：2001-06-19

申请号：US09482670

申请日：2000-01-13

Applicant: Clark T. -C. Nguyen ,  Michael McCorquodale ,  Kun Wang

Inventor： Clark T. -C. Nguyen ,  Michael McCorquodale ,  Kun Wang

IPC: H02N100

CPC classification number: H03H9/24 ,  H01H59/0009 ,  H01H2059/0072 ,  H03H3/0078 ,  H03H9/2452 ,  H03H9/462 ,  H03H9/465

Abstract: A flexural-mode, micromechanical resonator utilizing a non-intrusive support structure to achieve measured Q's as high as 8,400 at VHF frequencies from 30-90 MHz is manufactured using polysilicon surface micromachining technology. Also, a method for extending the operating frequency of the resonator as well as other types of micromechanical resonators is disclosed. One embodiment of the method is called a differential-signaling technique. The other embodiment of the method is called a dimple-down technique. The support structure includes one or more torsional-mode support springs in the form of beams that effectively isolate a resonator beam from its anchors via quarter-wavelength impedance transformations, minimizing anchor dissipation and allowing the resonator to achieve high Q with high stiffness in the VHF frequency range. The resonator also includes one or more spacers in the form of dimples formed on the flexural resonator beam or the substrate. In operation, the dimples determine a capacitive-transducer gap of the resonator. When a large DC-bias voltage is applied between a drive electrode and the resonator beam, the dimples provide a predetermined minimum distance between the flexural resonator beam and the drive electrode.

Abstract translation: 使用多晶硅表面微机械加工技术制造了使用非侵入式支撑结构的挠曲模式微机械谐振器，以在30-90MHz的VHF频率下实现高达8,400的测量Q。 此外，公开了一种用于扩展谐振器的工作频率以及其它类型的微机械谐振器的方法。 该方法的一个实施例称为差分信号技术。 该方法的另一个实施例称为凹陷技术。 支撑结构包括一个或多个波束形式的扭转模式支撑弹簧，其通过四分之一波长阻抗变换有效地将谐振器束与其锚定器隔离，从而最小化锚固耗散，并允许谐振器在VHF中实现高刚度的高Q 频率范围。 谐振器还包括形成在弯曲谐振器梁或衬底上的凹坑形式的一个或多个间隔物。 在操作中，凹坑确定谐振器的电容 - 换能器间隙。 当在驱动电极和谐振器光束之间施加大的直流偏置电压时，凹坑在弯曲谐振器光束和驱动电极之间提供预定的最小距离。

公开(公告)号：US06169321A

公开(公告)日：2001-01-02

申请号：US09305513

申请日：1999-05-05

Applicant: Clark T. -C Nguyen ,  Kun Wang

Inventor： Clark T. -C Nguyen ,  Kun Wang

IPC: H01L2940

CPC classification number: H03H9/02401

Abstract: A batch-compatible, post-fabrication annealing method and system are described that can be used to trim the resonance frequency and enhance the quality factor of mechanical microstructures, particularly micromechanical structures, such as micromechanical resonators. The technique involves running a current through a micromechanical structure, or through a nearby microstructure (e.g., a nearby resistor), thereby dissipating power and heating the structure to temperatures high enough to change its microstructure and/or its material properties, which then lead to changes in the microstructure's resonance frequency and quality factor. For micromechanical structures, this technique is particularly useful, since it allows for convenient, simultaneous trimming of many microstructures all at once, and can be implemented via the simple application of a voltage across the anchor points of a micromechanical structure.

Abstract translation: 描述了一种批量兼容的后制造退火方法和系统，其可用于修整共振频率并增强机械微观结构的质量因子，特别是微机械结构，例如微机械谐振器。 该技术涉及通过微机械结构或通过附近的微结构（例如，附近的电阻器）运行电流，从而耗散功率并将结构加热到高到足以改变其微结构和/或其材料性质的温度，其然后导致 微观结构的共振频率和质量因子的变化。 对于微机械结构，该技术特别有用，因为它允许一次性地方便地同时修整许多微结构，并且可以通过简单地在微机械结构的锚点上施加电压来实现。

公开(公告)号：US07295088B2

公开(公告)日：2007-11-13

申请号：US11040766

申请日：2005-01-21

Applicant: Clark T.-C. Nguyen ,  Sheng-Shian Li

Inventor： Clark T.-C. Nguyen ,  Sheng-Shian Li

IPC: H03H9/02 ,  H03H9/46 ,  H03H9/48

CPC classification number: H03H9/505 ,  H03H3/0072 ,  H03H9/02338 ,  H03H9/2431 ,  H03H9/462 ,  H03H2009/02496 ,  H03H2009/02503

Abstract: High-Q micromechanical resonator devices and filters utilizing same are provided. The devices and filters include a vibrating polysilicon micromechanical “hollow-disk” ring resonators obtained by removing quadrants of material from solid disk resonators, but purposely leaving intact beams or spokes of material with quarter-wavelength dimensions to non-intrusively support the resonators. The use of notched support attachments closer to actual extensional ring nodal points further raises the Q. Vibrating micromechanical hollow-disk ring filters including mechanically coupled resonators with resonator Q's greater than 10,000 achieve filter Q's on the order of thousands via a low-velocity coupling scheme. A longitudinally mechanical spring is utilized to attach the notched-type, low-velocity coupling locations of the resonators in order to achieve a extremely narrow passband.

Abstract translation: 提供了使用其的高Q微机械谐振器装置和滤波器。 器件和滤波器包括通过从固体盘谐振器去除象限的材料获得的振动多晶硅微机械“中空盘”环形谐振器，但有意地留下具有四分之一波长尺寸的完整的梁或辐条，以非侵入式地支撑谐振器。 使用更接近实际延伸环节点的切口支撑附件进一步提高了Q.振动微机械中空盘环形滤波器，包括谐振器Q大于10,000的机械耦合谐振器，通过低速耦合方案实现了数千级的滤波器Q 。 使用纵向机械弹簧来连接谐振器的缺口型低速耦合位置，以便实现非常窄的通带。

公开(公告)号：US06742389B2

公开(公告)日：2004-06-01

申请号：US10055210

申请日：2002-01-23

Applicant: Clark T.-C. Nguyen ,  Mustafa U. Demirci

Inventor： Clark T.-C. Nguyen ,  Mustafa U. Demirci

IPC: G01P904

CPC classification number: G01P15/0802 ,  G01C19/5719

Abstract: A method and system for measuring angular speed of an object uses a micromechanical filter apparatus and allows Q-multiplication in both drive and sense modes. The invention takes advantage of the constant amplitude region of a filter spectrum within a passband of the filter apparatus to sense with a constant scaling factor that is independent of frequency variations with the passband. Thus, the system has much less sensitivity to drive mode resonance frequency shifts due to temperature variations, fabrication non-idealities and aging. The system senses angular rate or speed at resonance, which results in a great improvement over conventional gyroscopes operated off-resonance.

Abstract translation: 用于测量物体的角速度的方法和系统使用微机械滤波器装置并且允许驱动和感测模式中的Q倍增。 本发明利用滤波器​​装置的通带内的滤波器频谱的恒定幅度区域来利用与通带无关的频率变化的恒定缩放因子进行感测。 因此，由于温度变化，制造非理想性和老化，系统对驱动模式共振频移的灵敏度要低得多。 该系统感应共振时的角速率或速度，这导致比传统陀螺仪操作的非共振的改进。

公开(公告)号：US06713938B2

公开(公告)日：2004-03-30

申请号：US09839436

申请日：2001-04-20

Applicant: Clark T.-C. Nguyen

Inventor： Clark T.-C. Nguyen

IPC: H02N200

CPC classification number: H03H3/0078 ,  H01H59/0009 ,  H01H2059/0072 ,  H03H9/02409 ,  H03H9/24 ,  H03H9/2452 ,  H03H9/462 ,  H03H9/465 ,  H03H9/505 ,  H03H2009/02511 ,  H03H2009/02519 ,  H03H2009/02527

Abstract: Several MEMS-based methods and architectures which utilize vibrating micromechanical resonators in circuits to implement filtering, mixing, frequency reference and amplifying functions are provided. Apparatus is provided for filtering signals utilizing vibrating micromechanical resonators. One of the primary benefits of the use of such architectures is a savings in power consumption by trading power for high selectivity (i.e., high Q). Consequently, the present invention relies on the use of a large number of micromechanical links in SSI networks to implement signal processing functions with basically zero DC power consumption.

Abstract translation: 提供了几种利用电路中的振动微机械谐振器来实现滤波，混频，频率参考和放大功能的基于MEMS的方法和架构。 提供了利用振动微机械谐振器对信号进行滤波的装置。 使用这种架构的主要优点之一是通过为高选择性（即高Q）的交易功率节省了功耗。 因此，本发明依赖于在SSI网络中使用大量的微机械连接来实现基本上零直流功率消耗的信号处理功能。

公开(公告)号：US06628177B2

公开(公告)日：2003-09-30

申请号：US09938358

申请日：2001-08-23

Applicant: John R. Clark ,  Clark T.-C. Nguyen

Inventor： John R. Clark ,  Clark T.-C. Nguyen

IPC: H03H924

CPC classification number: H03H9/505 ,  H03H3/007 ,  H03H3/0072 ,  H03H3/013 ,  H03H9/02362 ,  H03H9/2436 ,  H03H9/46 ,  H03H9/462 ,  H03H2009/02496 ,  H03H2009/02503 ,  H03H2009/02527

Abstract: A micromechanical resonator device and a micromechanical device utilizing same are disclosed based upon a radially or laterally vibrating disk structure and capable of vibrating at frequencies well past the GHz range. The center of the disk is a nodal point, so when the disk resonator is supported at its center, anchor dissipation to the substrate is minimized, allowing this design to retain high-Q at high frequency. In addition, this design retains high stiffness at high frequencies and so maximizes dynamic range. Furthermore, the sidewall surface area of this disk resonator is often larger than that attainable in previous flexural-mode resonator designs, allowing this disk design to achieve a smaller series motional resistance than its counterparts when using capacitive (or electrostatic) transduction at a given frequency. Capacitive detection is not required in this design, and piezoelectric, magnetostrictive, etc. detection are also possible. The frequency and dynamic range attainable by this resonator makes it applicable to high-Q RF filtering and oscillator applications in a wide variety of communication systems. Its size also makes it particularly suited for portable, wireless applications, where, if used in large numbers, such a resonator can greatly lower the power consumption, increase robustness, and extend the range of application of high performance wireless transceivers.