INTEGRATED OPTICAL PHASED ARRAY
    2.
    发明公开

    公开(公告)号:US20240272513A1

    公开(公告)日:2024-08-15

    申请号:US18569460

    申请日:2022-06-30

    发明人: Yong Liu Hao Hu

    IPC分类号: G02F1/295 G02F1/29

    摘要: The present disclosure relates to an integrated optical phased array (OPA) with a large field of view (FOV), possibly up to 180 degrees FOV. One embodiment regards a chip integrated optical phased array, comprising: a phase shifter array having N input light channels and configured for tuning the phase of the N input light channels; a beam splitter configured for splitting light from a light source into the N input channels of the phase shifter array; a waveguide array configured for squeezing the phase tuned N light channels to a narrow pitch output end such that the light form N channels interfere to form a plane wave at the output end; and a plane emitting surface configured for transforming the plane wave to light emittance out of the chip with a predefined field of view (FOV). Another embodiment regards an OPA with an on-chip beam expander for small beam divergence with a relatively low number of channels.

    POWER CONVERTER EMBODIED IN A SEMICONDUCTOR SUBSTRATE MEMBER

    公开(公告)号:US20230275120A1

    公开(公告)日:2023-08-31

    申请号:US18169730

    申请日:2023-02-15

    摘要: A power converter is embodied on a semiconductor substrate member and has a first region with a passive electrical component with a first electrically conductive layer pattern of an electrically conductive material and a second electrically conductive layer pattern of an electrically conductive material deposited on respective sides of the semiconductor substrate member. A trench or through-hole is formed (by etching) in the substrate within the first region, and the electrically conductive material is deposited at least on a bottom portion of the trench or on a sidewall of the through-hole and electrically connected to one or both of the first conductive layer pattern and the second conductive layer pattern. A second region has an active semiconductor component integrated with the semiconductor substrate by being fabricated by a semiconductor fabrication process. There is also provided a power supply, such as a DC-DC converter, embedded the semiconductor substrate member.