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公开(公告)号：US20160254219A1
公开(公告)日：2016-09-01
申请号：US15153970
申请日：2016-05-13
申请人： Dae Sung YOO , Han Mo KOO , Ki Tae PARK , Jun Young LIM , Tae Ki HONG
发明人： Dae Sung YOO , Han Mo KOO , Ki Tae PARK , Jun Young LIM , Tae Ki HONG
IPC分类号： H01L23/498 , H01L23/31 , H01L23/492
CPC分类号： H01L23/49811 , H01L23/315 , H01L23/4924 , H01L23/49572 , H01L23/49582 , H01L23/49838 , H01L23/49894 , H01L24/50 , H01L24/86 , H01L2924/0002 , H05K7/02 , H01L2924/00
摘要： Provided is a tape for electronic devices with lead crack and a method of manufacturing the tape. According to the present invention, by forming a bending portion on a narrow circuit pattern to be connected from an inner lead to an outer lead and further forming the bending portion within a resin application portion, crack occurred in a narrow wiring width can be avoided. The tape may includes a first lead and a second lead formed on a dielectric substrate and a bending portion formed on one of the first lead and the second lead wherein the bending portion is formed within a resin application portion.
摘要翻译： 提供了一种具有铅裂的电子设备的带子和一种制造带子的方法。 根据本发明，通过在从内引线到外引线连接的窄电路图案上形成弯曲部，并且在树脂施加部内进一步形成弯曲部，可以避免窄布线宽度的裂纹。 带可以包括形成在电介质基板上的第一引线和第二引线以及形成在第一引线和第二引线之一上的弯曲部分，其中弯曲部分形成在树脂施加部分内。
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公开(公告)号：US20130308289A1
公开(公告)日：2013-11-21
申请号：US13982658
申请日：2011-10-12
申请人： Dae Sung Yoo , Han Mo Koo , Ki Tae Park , Jun Young Lim , Tae Ki Hong
发明人： Dae Sung Yoo , Han Mo Koo , Ki Tae Park , Jun Young Lim , Tae Ki Hong
IPC分类号： H05K7/02
CPC分类号： H01L23/49811 , H01L23/315 , H01L23/4924 , H01L23/49572 , H01L23/49582 , H01L23/49838 , H01L23/49894 , H01L24/50 , H01L24/86 , H01L2924/0002 , H05K7/02 , H01L2924/00
摘要： Provided is a tape for electronic devices with lead crack and a method of manufacturing the tape. According to the present invention, by forming a bending portion on a narrow circuit pattern to be connected from an inner lead to an outer lead and further forming the bending portion within a resin application portion, crack occurred in a narrow wiring width can be avoided. The tape may include a first lead and a second lead formed on a dielectric substrate and a bending portion formed on one of the first lead and the second lead wherein the bending portion is formed within a resin application portion.
摘要翻译： 提供了一种具有铅裂的电子设备的带子和一种制造带子的方法。 根据本发明，通过在从内引线到外引线连接的窄电路图案上形成弯曲部，并且在树脂施加部内进一步形成弯曲部，可以避免窄布线宽度的裂纹。 带可以包括形成在电介质基板上的第一引线和第二引线以及形成在第一引线和第二引线之一上的弯曲部分，其中弯曲部分形成在树脂施加部分内。
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公开(公告)号：US09480152B2
公开(公告)日：2016-10-25
申请号：US13188882
申请日：2011-07-22
申请人： Tae Ki Hong , Han Mo Koo , Jun Young Lim , Ki Tae Park , Sang Ki Cho , Dae Sung Yoo
发明人： Tae Ki Hong , Han Mo Koo , Jun Young Lim , Ki Tae Park , Sang Ki Cho , Dae Sung Yoo
IPC分类号： H05K1/09 , H05K1/00 , H05K1/02 , H01L23/00 , H01L23/498
CPC分类号： H05K1/028 , H01L23/4985 , H01L24/50 , H01L2924/01029 , H01L2924/14
摘要： The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.
摘要翻译： 本发明涉及一种制造TAB龙头的方法。 该方法包括在基膜上形成具有输入/输出端子图案的电路图案区域，并且在具有用于露出基底膜的链轮孔的输送区域处形成曝光区域。 因此，本发明提供一种TAB带，其通过基本上防止金属颗粒的产生而形成暴露区域，从而通过选择性地蚀刻和去除在 TAB带，并且具有链轮孔，并且通过在不具有通过蚀刻形成在其上的电路图案的预定区域部分地去除基底膜来防止短路。
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公开(公告)号：US20120186862A1
公开(公告)日：2012-07-26
申请号：US13188882
申请日：2011-07-22
申请人： Tae Ki Hong , Han Mo Koo , Jun Young Lim , Ki Tae Park , Sang Ki Cho , Dae Sung Yoo
发明人： Tae Ki Hong , Han Mo Koo , Jun Young Lim , Ki Tae Park , Sang Ki Cho , Dae Sung Yoo
CPC分类号： H05K1/028 , H01L23/4985 , H01L24/50 , H01L2924/01029 , H01L2924/14
摘要： The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.
摘要翻译： 本发明涉及一种制造TAB龙头的方法。 该方法包括在基膜上形成具有输入/输出端子图案的电路图案区域，并且在具有用于露出基底膜的链轮孔的输送区域处形成曝光区域。 因此，本发明提供一种TAB带，其通过基本上防止金属颗粒的产生而形成暴露区域，从而通过选择性地蚀刻和去除在 TAB带，并且具有链轮孔，并且通过在不具有通过蚀刻形成在其上的电路图案的预定区域部分地去除基底膜来防止短路。
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公开(公告)号：US20110100687A1
公开(公告)日：2011-05-05
申请号：US12710926
申请日：2010-02-23
申请人： Tae Ki Hong , Dong Guk Jo , Han Mo Koo , Jun Young Lim , Ki Tae Park , Sang Ki Cho , Dae Sung Yoo , Nak Ho Song , Joo Chul Kim , Jae Sung Jo
发明人： Tae Ki Hong , Dong Guk Jo , Han Mo Koo , Jun Young Lim , Ki Tae Park , Sang Ki Cho , Dae Sung Yoo , Nak Ho Song , Joo Chul Kim , Jae Sung Jo
CPC分类号： H01L24/50 , H01L23/49838 , H01L23/4985 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/37001 , H05K1/11 , Y10T29/49155 , H01L2924/00
摘要： The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a wiring pattern and a metal plating layer formed on a base film comprises a transfer area including a row of sprocket holes arranged along the edges of the base film at predetermined intervals, and wherein the transfer area includes an exposure area from which the base film is exposed, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.
摘要翻译： 本发明涉及一种用于TAB封装的载带及其制造方法，其中包括布线图案和形成在基膜上的金属镀层的TAB带包括传送区域，其包括沿着边缘布置的一排链轮孔 并且其中转印区域包括暴露于基膜的曝光区域，使得本发明具有如下优点：在链轮的一部分处不存在Cu层或金属层 在驱动IC和芯片/驱动IC和面板之间的组装工作期间由驱动辊产生摩擦的孔，以省去诸如Cu颗粒的异物的产生，从而提高产品的可靠性。
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公开(公告)号：US08791370B2
公开(公告)日：2014-07-29
申请号：US12710926
申请日：2010-02-23
申请人： Tae Ki Hong , Dong Guk Jo , Han Mo Koo , Jun Young Lim , Ki Tae Park , Sang Ki Cho , Dae Sung Yoo , Nak Ho Song , Joo Chul Kim , Jae Sung Jo
发明人： Tae Ki Hong , Dong Guk Jo , Han Mo Koo , Jun Young Lim , Ki Tae Park , Sang Ki Cho , Dae Sung Yoo , Nak Ho Song , Joo Chul Kim , Jae Sung Jo
CPC分类号： H01L24/50 , H01L23/49838 , H01L23/4985 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/37001 , H05K1/11 , Y10T29/49155 , H01L2924/00
摘要： The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a wiring pattern and a metal plating layer formed on a base film comprises a transfer area including a row of sprocket holes arranged along the edges of the base film at predetermined intervals, and wherein the transfer area includes an exposure area from which the base film is exposed, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.
摘要翻译： 本发明涉及一种用于TAB封装的载带及其制造方法，其中包括布线图案和形成在基膜上的金属镀层的TAB带包括传送区域，其包括沿着边缘布置的一排链轮孔 并且其中转印区域包括暴露于基膜的曝光区域，使得本发明具有如下优点：在链轮的一部分处不存在Cu层或金属层 在驱动IC和芯片/驱动IC和面板之间的组装工作期间由驱动辊产生摩擦的孔，以省去诸如Cu颗粒的异物的产生，从而提高产品的可靠性。
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