公开(公告)号：US07543845B2

公开(公告)日：2009-06-09

申请号：US11326146

申请日：2006-01-04

申请人： Daniel Phillip Dailey ,  Matthew Thomas Kemp

发明人： Daniel Phillip Dailey ,  Matthew Thomas Kemp

IPC分类号： B60R21/20

CPC分类号： B60R21/205 ,  B60R21/215

摘要： An instrument panel for an automobile passenger compartment includes a substrate having an outer surface and an inner surface and defining an opening extending therethrough. An air bag door assembly is mounted to the outer surface of the substrate, and an air bag device is mounted adjacent the inner surface of the substrate and aligned with the opening formed within the substrate. The air bag door assembly includes a door panel that is mounted adjacent the opening formed within the substrate in a closed position. The door panel is pre-tensioned such that the door panel will substantially return to the closed position after deployment of the air bag through the opening within the substrate.

摘要翻译： 用于汽车乘客舱的仪表板包括具有外表面和内表面并且限定延伸穿过其中的开口的基板。 气囊门组件安装在基板的外表面上，并且气囊装置安装在基板的内表面附近并与形成在基板内的开口对准。 气囊门组件包括门板，该门板在关闭位置上邻近形成在基板内的开口安装。 门板被预张紧，使得在将气囊展开通过基板内的开口部之后，门板将基本返回到关闭位置。

公开(公告)号：US07237797B2

公开(公告)日：2007-07-03

申请号：US10692572

申请日：2003-10-24

申请人： Daniel Phillip Dailey ,  Matthew Thomas Kemp

发明人： Daniel Phillip Dailey ,  Matthew Thomas Kemp

IPC分类号： B60R21/20

CPC分类号： B60R21/205

摘要： A modular airbag door assembly includes an airbag chute having a front side and a rear side and defines an opening extending therethrough. A door panel is pivotally mounted to the front side of the airbag chute and covers the opening therein. The airbag door assembly further includes a plurality of weld studs extending from the rear side of the airbag chute. The weld studs are adapted to allow the airbag door assembly to be mounted to a substrate of an instrument panel with the rear side of the airbag chute being positioned against a front side of the substrate.

摘要翻译： 模块化安全气囊门组件包括具有前侧和后侧的安全气囊滑槽，并且限定了延伸穿过其中的开口。 门板可枢转地安装在气囊滑槽的前侧并覆盖其中的开口。 安全气囊门组件还包括从气囊滑槽的后侧延伸的多个焊接螺柱。 焊接螺柱适于允许安全气囊门组件安装到仪表板的基板上，其中气囊滑槽的后侧抵靠基板的前侧定位。

公开(公告)号：US5979043A

公开(公告)日：1999-11-09

申请号：US892463

申请日：1997-07-14

申请人： Jay DeAvis Baker ,  Robert Edward Belke, Jr. ,  Daniel Phillip Dailey ,  Andrew Z. Glovatsky ,  Richard Keith McMillan, II

发明人： Jay DeAvis Baker ,  Robert Edward Belke, Jr. ,  Daniel Phillip Dailey ,  Andrew Z. Glovatsky ,  Richard Keith McMillan, II

IPC分类号： B29C45/14 ,  H05K1/00 ,  H05K3/00 ,  H05K3/46 ,  H05K3/36

CPC分类号： H05K3/4635 ,  B29C45/14467 ,  B29C45/14778 ,  H05K3/0014 ,  H05K3/0058 ,  H05K3/462 ,  B29K2995/0005 ,  B29L2031/3493 ,  H05K1/0393 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/1327 ,  H05K3/4623 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49158

摘要： A method of manufacturing an electronic circuit assembly that includes a number of electrically interconnected flexible films, each flexible film having a flexible electrical wiring circuit. The electrical wiring circuits are interconnected between film layers and the film layers are adhered to a molded backing structure. A first flexible film is formed with a pattern of flexible electrical wiring circuits created on at least one surface thereof. The first flexible film has a passage that provides an electrical connection through the flexible film. A second flexible film is formed with a pattern of flexible electrical wiring circuits created on a least one surface thereof. The second flexible film has an electrical interconnect feature that connects with the electrical passage on the first film and electrically connects the first film with the second film. The first flexible film is overlaid juxtaposed the second flexible film so that the passage is aligned adjacent the electrical interconnect feature. The first and second flexible films are placed within an open mold. The mold is closed and a plastic material is injected within the mold adjacent at least one surface of the first and second flexible films. The molten plastic adheres to the first and second flexible films and forms an integral backing structure. The backing structure and first and second flexible films together form the circuit assembly.

摘要翻译： 一种制造包括多个电互连柔性膜的电子电路组件的方法，每个柔性膜具有柔性电布线电路。 电气布线电路在膜层之间相互连接，并且膜层粘附到模制背衬结构上。 第一柔性膜形成有在其至少一个表面上形成的柔性电布线的图案。 第一柔性膜具有通过柔性膜提供电连接的通路。 第二柔性膜形成有在其至少一个表面上形成的柔性电布线的图案。 第二柔性膜具有与第一膜上的电通路连接并将第一膜与第二膜电连接的电互连特征。 第一柔性膜叠置在第二柔性膜上，使得通道对准邻近电互连特征。 第一和第二柔性膜被放置在开放模具内。 模具关闭，并且塑料材料在模具内相邻于第一和第二柔性膜的至少一个表面注入。 熔融的塑料粘附到第一和第二柔性膜上并形成整体的背衬结构。 背衬结构和第一和第二柔性膜一起形成电路组件。

公开(公告)号：US06555015B1

公开(公告)日：2003-04-29

申请号：US09712838

申请日：2000-11-09

申请人： Daniel Phillip Dailey ,  Robert Edward Belke, Jr. ,  Jay DeAvis Baker ,  Achyuta Achari ,  Myron Lemecha ,  Michael George Todd

发明人： Daniel Phillip Dailey ,  Robert Edward Belke, Jr. ,  Jay DeAvis Baker ,  Achyuta Achari ,  Myron Lemecha ,  Michael George Todd

IPC分类号： H01B1300

CPC分类号： H05K3/4092 ,  H05K3/4685

摘要： Method of manufacturing a multi-layer printed circuit board adapted for reduce interfacial sheer stresses includes a laminate substrate having a top layer forming a first major surface, a middle layer having a predetermined thickness and a bottom layer forming a second major surface opposed to the first major surface. Etch resists are disposed on the first and second surfaces corresponding to reverse images of desired conductor patterns. The first and second surfaces are thereafter etched and the photoresist removed. The laminate substrate is secured via a low modules adhesive layer to a major surface of a base. The middle layer of the laminate substrate is thereafter selectively etched so as to isolate selected portions of the first and second surfaces and to define inner connect regions therebetween having a height equal to the predetermined thickness.

公开(公告)号：US06197145B1

公开(公告)日：2001-03-06

申请号：US09134729

申请日：1998-08-17

申请人： Michael George Todd ,  Rexanne M. Coyner ,  Andrew Zachary Glovatsky ,  Daniel Phillip Dailey ,  Robert Edward Belke

发明人： Michael George Todd ,  Rexanne M. Coyner ,  Andrew Zachary Glovatsky ,  Daniel Phillip Dailey ,  Robert Edward Belke

IPC分类号： H05K300

CPC分类号： B29C45/14811 ,  B29K2715/006 ,  B29K2995/0005 ,  H05K1/0393 ,  H05K3/0064 ,  H05K2203/1105 ,  H05K2203/1327 ,  Y10T29/49146 ,  Y10T29/49158

摘要： A method of attaching a flexible plastic film having electronic circuit traces to a rigid plastic substrate. The film and substrate are made from different incompatible plastic materials that do not bond to one another and have different CTE. The use of different or incompatible materials is useful where the properties of the backing structure and film are selected to achieve different results. For example, the flexible film may be selected from a material that provides a high melting point to withstand soldering while the backing material is selected from a low-cost and light weight plastic material that has a lower melting point. The film has conductive traces on at least one surface thereof and a backing surface. A heat activated adhesive is applied to the backing surface. The film is placed within an open injection mold and the mold is closed. A hot plastic resin is injected into the mold adjacent the adhesive. The resin heats the adhesive above its activation temperature and causes the adhesive to bond to both the backing surface and the plastic resin. The resin is allowed to cool and the finished circuit assembly is removed from the mold.

摘要翻译： 将具有电子电路迹线的柔性塑料膜附接到刚性塑料基板的方法。 膜和基底由不相互粘合并具有不同CTE的不相容的塑料材料制成。 当选择背衬结构和膜的性质以获得不同的结果时，使用不同的或不相容的材料是有用的。 例如，柔性膜可以选自提供高熔点以承受焊接的材料，而背衬材料选自具有较低熔点的低成本且重量轻的塑料材料。 该膜在其至少一个表面和背衬表面上具有导电迹线。 将热活化粘合剂施加到背衬表面。 将薄膜放置在开放式注射模具内，模具关闭。 将热塑性树脂注入邻近粘合剂的模具中。 树脂将粘合剂加热到其活化温度以上，并使粘合剂粘合到背衬表面和塑料树脂上。 使树脂冷却，并将完成的电路组件从模具中取出。

公开(公告)号：US5968386A

公开(公告)日：1999-10-19

申请号：US993112

申请日：1997-12-18

申请人： Lakhi Nandlal Goenka ,  Delin Li ,  Daniel Phillip Dailey ,  Charles Frederick Schweitzer ,  Michael Bednarz ,  Brenda Joyce Nation

发明人： Lakhi Nandlal Goenka ,  Delin Li ,  Daniel Phillip Dailey ,  Charles Frederick Schweitzer ,  Michael Bednarz ,  Brenda Joyce Nation

IPC分类号： H05K3/28 ,  H05K5/06 ,  H05B1/00

CPC分类号： H05K5/068 ,  H05K3/284

摘要： An an electronic circuit having improved protection against harsh environments, a preferred embodiment thereof including: a substrate 10 having a top surface 12; an electronic component 14 attached to the top surface of the substrate; a plastic and metal foil laminated barrier 16 having an outer periphery 18 thereabout, the outer periphery being sealably attached to the top surface 12 of the substrate so as to define a closed pocket 20 between the top surface 12 and the barrier 16 within which the electronic component 14 is enclosed; and a desiccant element 50. The desiccant element 50 includes: a case 51 having an internal chamber, an inlet orifice 58, and an outlet orifice 59, wherein the inlet and outlet orifices are each in communication with the internal chamber; a predetermined amount of desiccant material 53 contained within the internal chamber; a normally-open interior valve 54 situated between the inlet orifice 58 and the internal chamber; a normally-closed exterior valve 56 situated between the outlet orifice 59 and the internal chamber; and heating means 52 for selectably heating the desiccant material 53 preferably above a regeneration temperature thereof. The desiccant element 50 is situated such that at least the interior orifice 54 thereof is sealably enclosed within the closed pocket 20.

摘要翻译： 一种具有改善的防恶劣环境保护的电子电路，其优选实施例包括：具有顶表面12的基板10; 电子部件14，其安装在基板的上表面上; 塑料和金属箔层压壁板16，其周边具有外周边18，外周边密封地附接到基板的顶表面12，以便在顶表面12和阻挡层16之间形成封闭的袋20， 组件14被封闭; 干燥剂元件50包括：具有内部室的壳体51，入口孔58和出口孔59，其中入口孔和出口孔各自与内部室连通; 包含在内部室内的预定量的干燥剂材料53; 位于入口孔58和内室之间的常开内部阀54; 位于出口孔59和内室之间的常闭外部阀56; 以及用于可选地加热干燥剂材料53的加热装置52，优选地在其再生温度之上。 干燥剂元件50被定位成使得至少其内孔54密封地封闭在封闭的口袋20内。

公开(公告)号：US06601296B1

公开(公告)日：2003-08-05

申请号：US09347735

申请日：1999-07-06

申请人： Daniel Phillip Dailey ,  Mohan R. Paruchuri ,  Prathap Amerwai Reddy

发明人： Daniel Phillip Dailey ,  Mohan R. Paruchuri ,  Prathap Amerwai Reddy

IPC分类号： H01R4324

CPC分类号： H01R43/18 ,  H01R13/035 ,  H05K1/119 ,  H05K3/101 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10378 ,  H05K2203/0113 ,  H05K2203/128 ,  Y10T29/49158 ,  Y10T29/49176 ,  Y10T29/49215 ,  Y10T29/4922 ,  Y10T29/49222

摘要： A method of making an article, such as an electrical connector includes an injection-molded plastic substrate and a pattern of injection-molded metal conductors supported on and mechanically interlocked with the substrate, wherein one of the substrate and the conductors is over-molded onto the other of the substrate and the conductors.

摘要翻译： 制造诸如电连接器的制品的方法包括注模的塑料基板和支撑在基板上并机械地与基板机械地互锁的注射成型的金属导体的图案，其中基板和导体之一被过模制到 基板和导体中的另一个。

公开(公告)号：US06528736B1

公开(公告)日：2003-03-04

申请号：US08786494

申请日：1997-01-21

申请人： Daniel Phillip Dailey ,  Robert Edward Belke, Jr. ,  Jay DeAvis Baker ,  Achyuta Achari ,  Myron Lemecha ,  Michael George Todd

发明人： Daniel Phillip Dailey ,  Robert Edward Belke, Jr. ,  Jay DeAvis Baker ,  Achyuta Achari ,  Myron Lemecha ,  Michael George Todd

IPC分类号： H01R909

CPC分类号： H05K3/4092 ,  H05K3/4685

摘要： Method of manufacturing a multi-layer printed circuit board adapted for reduce interfacial sheer stresses includes a laminate substrate having a top layer forming a first major surface, a middle layer having a predetermined thickness and a bottom layer forming a second major surface opposed to the first major surface. Etch resists are disposed on the first and second surfaces corresponding to reverse images of desired conductor patterns. The first and second surfaces are thereafter etched and the photoresist removed. The laminate substrate is secured via a low modules adhesive layer to a major surface of a base. The middle layer of the laminate substrate is thereafter selectively etched so as to isolate selected portions of the first and second surfaces and to define inner connect regions therebetween having a height equal to the predetermined thickness.

摘要翻译： 适用于减少界面剪切应力的多层印刷电路板的制造方法包括具有形成第一主表面的顶层，具有预定厚度的中间层和形成与第一主表面相对的第二主表面的底层的层压基板 主要表面。 蚀刻抗蚀剂设置在对应于所需导体图案的反向图像的第一和第二表面上。 此后蚀刻第一表面和第二表面，并除去光致抗蚀剂。 层压基板通过低模块粘合剂层固定到基体的主表面。 之后选择性地蚀刻层压基板的中间层，以隔离第一和第二表面的选定部分，并且限定其间具有等于预定厚度的高度的内部连接区域。

公开(公告)号：US06320128B1

公开(公告)日：2001-11-20

申请号：US09578394

申请日：2000-05-25

申请人： Andrew Zachary Glovatsky ,  Brenda Joyce Nation ,  Charles Frederick Schweitzer ,  Daniel Phillip Dailey ,  Delin Li ,  Jay DeAvis Baker ,  Lakhi Nandlal Goenka ,  Lawrence LeRoy Kneisel ,  Myron Lemecha

发明人： Andrew Zachary Glovatsky ,  Brenda Joyce Nation ,  Charles Frederick Schweitzer ,  Daniel Phillip Dailey ,  Delin Li ,  Jay DeAvis Baker ,  Lakhi Nandlal Goenka ,  Lawrence LeRoy Kneisel ,  Myron Lemecha

IPC分类号： H01L2328

CPC分类号： H05K3/284 ,  H01L23/5387 ,  H01L2924/0002 ,  H05K1/189 ,  H05K5/0095 ,  H01L2924/00

摘要： An electronic assembly includes a flexible multilayer substrate having integral electrically-conductive traces that also includes, as a lowermost layer, a metal foil. A plurality of uppermost layers, likewise including a metal foil, form a thin barrier member that is sealingly attached to the substrate's other layers. In this manner, a plurality of electronic components, mounted on the substrate's other layers so as to be electrically interconnected with the traces before sealingly attaching the barrier member, are encapsulated within metal foil to provide an environmentally-sealed assembly featuring improved resistance to moisture diffusion and penetration/permeation of other substances characteristic of the assembly's service environment into the assembly. A filler material, also encapsulated within the metal foil, is operative to neutralize a predetermined amount of a penetrant, further improving the operability and service life of the assembly. Preferably, a relatively-rigid polymeric material is formed in touching contact with the substrate, as by overmolding the plastic material on the environmentally-sealed assembly, to thereby provide a plastic part incorporating the assembly.

摘要翻译： 电子组件包括具有整体导电迹线的柔性多层基板，其还包括作为最下层的金属箔。 同样包括金属箔的多个最上层形成密封地附接到基底的其它层的薄的阻挡构件。 以这种方式，将多个电子部件安装在基板的其它层上，以便在密封地附接阻挡构件之前与迹线电互连，被封装在金属箔内以提供环境密封的组件，其特征在于具有改进的抗潮湿扩散性 以及组装服务环境特征的其他物质的渗透/渗透。 还封装在金属箔内的填充材料可操作以中和预定量的渗透剂，进一步提高组件的可操作性和使用寿命。 优选地，相对刚性的聚合物材料形成为与基底接触接触，如通过将环境密封的组件上的塑料材料包覆成型，从而提供结合该组件的塑料部件。