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33 条记录 (耗时 0.027 秒)

    Method of manufacturing a circuit assembly from two or more layers of flexible film
    1.
    发明授权
    Method of manufacturing a circuit assembly from two or more layers of flexible film 失效
    从两层或多层柔性膜制造电路组件的方法

    公开(公告)号：US5979043A

    公开(公告)日：1999-11-09

    申请号：US892463

    申请日：1997-07-14

    申请人： Jay DeAvis Baker ,  Robert Edward Belke, Jr. ,  Daniel Phillip Dailey ,  Andrew Z. Glovatsky ,  Richard Keith McMillan, II

    发明人： Jay DeAvis Baker ,  Robert Edward Belke, Jr. ,  Daniel Phillip Dailey ,  Andrew Z. Glovatsky ,  Richard Keith McMillan, II

    IPC分类号： B29C45/14 ,  H05K1/00 ,  H05K3/00 ,  H05K3/46 ,  H05K3/36

    CPC分类号： H05K3/4635 ,  B29C45/14467 ,  B29C45/14778 ,  H05K3/0014 ,  H05K3/0058 ,  H05K3/462 ,  B29K2995/0005 ,  B29L2031/3493 ,  H05K1/0393 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/1327 ,  H05K3/4623 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49158

    摘要： A method of manufacturing an electronic circuit assembly that includes a number of electrically interconnected flexible films, each flexible film having a flexible electrical wiring circuit. The electrical wiring circuits are interconnected between film layers and the film layers are adhered to a molded backing structure. A first flexible film is formed with a pattern of flexible electrical wiring circuits created on at least one surface thereof. The first flexible film has a passage that provides an electrical connection through the flexible film. A second flexible film is formed with a pattern of flexible electrical wiring circuits created on a least one surface thereof. The second flexible film has an electrical interconnect feature that connects with the electrical passage on the first film and electrically connects the first film with the second film. The first flexible film is overlaid juxtaposed the second flexible film so that the passage is aligned adjacent the electrical interconnect feature. The first and second flexible films are placed within an open mold. The mold is closed and a plastic material is injected within the mold adjacent at least one surface of the first and second flexible films. The molten plastic adheres to the first and second flexible films and forms an integral backing structure. The backing structure and first and second flexible films together form the circuit assembly.

    摘要翻译： 一种制造包括多个电互连柔性膜的电子电路组件的方法，每个柔性膜具有柔性电布线电路。 电气布线电路在膜层之间相互连接，并且膜层粘附到模制背衬结构上。 第一柔性膜形成有在其至少一个表面上形成的柔性电布线的图案。 第一柔性膜具有通过柔性膜提供电连接的通路。 第二柔性膜形成有在其至少一个表面上形成的柔性电布线的图案。 第二柔性膜具有与第一膜上的电通路连接并将第一膜与第二膜电连接的电互连特征。 第一柔性膜叠置在第二柔性膜上，使得通道对准邻近电互连特征。 第一和第二柔性膜被放置在开放模具内。 模具关闭，并且塑料材料在模具内相邻于第一和第二柔性膜的至少一个表面注入。 熔融的塑料粘附到第一和第二柔性膜上并形成整体的背衬结构。 背衬结构和第一和第二柔性膜一起形成电路组件。

    Multi-layer printed circuit board and method of making same
    3.
    发明授权
    Multi-layer printed circuit board and method of making same 失效
    多层印刷电路板及其制作方法

    公开(公告)号：US06528736B1

    公开(公告)日：2003-03-04

    申请号：US08786494

    申请日：1997-01-21

    申请人： Daniel Phillip Dailey ,  Robert Edward Belke, Jr. ,  Jay DeAvis Baker ,  Achyuta Achari ,  Myron Lemecha ,  Michael George Todd

    发明人： Daniel Phillip Dailey ,  Robert Edward Belke, Jr. ,  Jay DeAvis Baker ,  Achyuta Achari ,  Myron Lemecha ,  Michael George Todd

    IPC分类号： H01R909

    CPC分类号： H05K3/4092 ,  H05K3/4685

    摘要： Method of manufacturing a multi-layer printed circuit board adapted for reduce interfacial sheer stresses includes a laminate substrate having a top layer forming a first major surface, a middle layer having a predetermined thickness and a bottom layer forming a second major surface opposed to the first major surface. Etch resists are disposed on the first and second surfaces corresponding to reverse images of desired conductor patterns. The first and second surfaces are thereafter etched and the photoresist removed. The laminate substrate is secured via a low modules adhesive layer to a major surface of a base. The middle layer of the laminate substrate is thereafter selectively etched so as to isolate selected portions of the first and second surfaces and to define inner connect regions therebetween having a height equal to the predetermined thickness.

    摘要翻译： 适用于减少界面剪切应力的多层印刷电路板的制造方法包括具有形成第一主表面的顶层，具有预定厚度的中间层和形成与第一主表面相对的第二主表面的底层的层压基板 主要表面。 蚀刻抗蚀剂设置在对应于所需导体图案的反向图像的第一和第二表面上。 此后蚀刻第一表面和第二表面，并除去光致抗蚀剂。 层压基板通过低模块粘合剂层固定到基体的主表面。 之后选择性地蚀刻层压基板的中间层，以隔离第一和第二表面的选定部分，并且限定其间具有等于预定厚度的高度的内部连接区域。

    Apparatus for routing electrical signals in an engine
    5.
    发明授权
    Apparatus for routing electrical signals in an engine 失效
    用于在发动机中布置电信号的装置

    公开(公告)号：US06186106B1

    公开(公告)日：2001-02-13

    申请号：US08999077

    申请日：1997-12-29

    申请人： Andrew Z. Glovatsky ,  Myron Lemecha ,  Mark Miller ,  Jay DeAvis Baker

    发明人： Andrew Z. Glovatsky ,  Myron Lemecha ,  Mark Miller ,  Jay DeAvis Baker

    IPC分类号： F02P2300

    CPC分类号： F02M35/10249 ,  B60R16/0215 ,  F02D41/3005 ,  F02D2400/18 ,  F02D2400/21 ,  F02D2400/22 ,  F02M35/10216 ,  F02M35/10288 ,  F02M35/10301 ,  F02M35/10347 ,  F02M35/112 ,  F02M35/116 ,  F02M35/161 ,  F02M51/005 ,  H05K1/118

    摘要： There is disclosed herein an apparatus for routing electrical signals in an engine having n cylinders and an intake manifold, one embodiment of which comprises: (1) a generally rigid housing generally conforming in shape with and being removably attachable to a top surface of the intake manifold; (2) at least n carrier members attached to the housing and extending outward therefrom, wherein each carrier member is arranged in general proximity with a respective cylinder; (3) a plurality of conductive circuit traces arranged on or within an underside or other surface of the housing and on or within each carrier member; and (4) at least one input/output connector for connection to at least one of an external signal source, an external power source, an external signal destination, and an external power destination, wherein each input/output connector is attached to the housing and is electrically connected to at least one of the circuit traces. Each circuit trace carried by each carrier member terminates in a termination electrically connectable with an electrical engine element, such as an ignition coil, an electronic fuel injector, a spark plug, and/or a glow plug.

    摘要翻译： 本文公开了一种用于在具有n个气缸和进气歧管的发动机中布置电信号的装置，其一个实施例包括：（1）大体上刚性的壳体，其大致符合形状并且可移除地附接到进气口的顶表面 歧管 （2）至少n个承载构件，其附接到壳体并从其向外延伸，其中每个承载构件总体上布置在相应的气缸附近; （3）多个导电电路迹线布置在壳体的下侧或其他表面上或其内表面上，并位于每个载体构件上或内部; 和（4）至少一个用于连接至外部信号源，外部电源，外部信号目的地和外部电力目的地中的至少一个的输入/输出连接器，其中每个输入/输出连接器附接到壳体 并且电连接到至少一个电路迹线。 由每个载体构件承载的每个电路迹线终止于可与诸如点火线圈，电子燃料喷射器，火花塞和/或电热塞之类的电动发动机元件电连接的终端。

    Environmentally-sealed electronic assembly and method of making same
    7.
    发明授权
    Environmentally-sealed electronic assembly and method of making same 失效
    环保密封电子组件及其制造方法

    公开(公告)号：US06320128B1

    公开(公告)日：2001-11-20

    申请号：US09578394

    申请日：2000-05-25

    申请人： Andrew Zachary Glovatsky ,  Brenda Joyce Nation ,  Charles Frederick Schweitzer ,  Daniel Phillip Dailey ,  Delin Li ,  Jay DeAvis Baker ,  Lakhi Nandlal Goenka ,  Lawrence LeRoy Kneisel ,  Myron Lemecha

    发明人： Andrew Zachary Glovatsky ,  Brenda Joyce Nation ,  Charles Frederick Schweitzer ,  Daniel Phillip Dailey ,  Delin Li ,  Jay DeAvis Baker ,  Lakhi Nandlal Goenka ,  Lawrence LeRoy Kneisel ,  Myron Lemecha

    IPC分类号： H01L2328

    CPC分类号： H05K3/284 ,  H01L23/5387 ,  H01L2924/0002 ,  H05K1/189 ,  H05K5/0095 ,  H01L2924/00

    摘要： An electronic assembly includes a flexible multilayer substrate having integral electrically-conductive traces that also includes, as a lowermost layer, a metal foil. A plurality of uppermost layers, likewise including a metal foil, form a thin barrier member that is sealingly attached to the substrate's other layers. In this manner, a plurality of electronic components, mounted on the substrate's other layers so as to be electrically interconnected with the traces before sealingly attaching the barrier member, are encapsulated within metal foil to provide an environmentally-sealed assembly featuring improved resistance to moisture diffusion and penetration/permeation of other substances characteristic of the assembly's service environment into the assembly. A filler material, also encapsulated within the metal foil, is operative to neutralize a predetermined amount of a penetrant, further improving the operability and service life of the assembly. Preferably, a relatively-rigid polymeric material is formed in touching contact with the substrate, as by overmolding the plastic material on the environmentally-sealed assembly, to thereby provide a plastic part incorporating the assembly.

    摘要翻译： 电子组件包括具有整体导电迹线的柔性多层基板，其还包括作为最下层的金属箔。 同样包括金属箔的多个最上层形成密封地附接到基底的其它层的薄的阻挡构件。 以这种方式，将多个电子部件安装在基板的其它层上，以便在密封地附接阻挡构件之前与迹线电互连，被封装在金属箔内以提供环境密封的组件，其特征在于具有改进的抗潮湿扩散性 以及组装服务环境特征的其他物质的渗透/渗透。 还封装在金属箔内的填充材料可操作以中和预定量的渗透剂，进一步提高组件的可操作性和使用寿命。 优选地，相对刚性的聚合物材料形成为与基底接触接触，如通过将环境密封的组件上的塑料材料包覆成型，从而提供结合该组件的塑料部件。