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13 条记录 (耗时 0.033 秒)

    Environmentally-sealed electronic assembly and method of making same
    1.
    发明授权
    Environmentally-sealed electronic assembly and method of making same 失效
    环保密封电子组件及其制造方法

    公开(公告)号：US06320128B1

    公开(公告)日：2001-11-20

    申请号：US09578394

    申请日：2000-05-25

    申请人： Andrew Zachary Glovatsky ,  Brenda Joyce Nation ,  Charles Frederick Schweitzer ,  Daniel Phillip Dailey ,  Delin Li ,  Jay DeAvis Baker ,  Lakhi Nandlal Goenka ,  Lawrence LeRoy Kneisel ,  Myron Lemecha

    发明人： Andrew Zachary Glovatsky ,  Brenda Joyce Nation ,  Charles Frederick Schweitzer ,  Daniel Phillip Dailey ,  Delin Li ,  Jay DeAvis Baker ,  Lakhi Nandlal Goenka ,  Lawrence LeRoy Kneisel ,  Myron Lemecha

    IPC分类号： H01L2328

    CPC分类号： H05K3/284 ,  H01L23/5387 ,  H01L2924/0002 ,  H05K1/189 ,  H05K5/0095 ,  H01L2924/00

    摘要： An electronic assembly includes a flexible multilayer substrate having integral electrically-conductive traces that also includes, as a lowermost layer, a metal foil. A plurality of uppermost layers, likewise including a metal foil, form a thin barrier member that is sealingly attached to the substrate's other layers. In this manner, a plurality of electronic components, mounted on the substrate's other layers so as to be electrically interconnected with the traces before sealingly attaching the barrier member, are encapsulated within metal foil to provide an environmentally-sealed assembly featuring improved resistance to moisture diffusion and penetration/permeation of other substances characteristic of the assembly's service environment into the assembly. A filler material, also encapsulated within the metal foil, is operative to neutralize a predetermined amount of a penetrant, further improving the operability and service life of the assembly. Preferably, a relatively-rigid polymeric material is formed in touching contact with the substrate, as by overmolding the plastic material on the environmentally-sealed assembly, to thereby provide a plastic part incorporating the assembly.

    摘要翻译： 电子组件包括具有整体导电迹线的柔性多层基板，其还包括作为最下层的金属箔。 同样包括金属箔的多个最上层形成密封地附接到基底的其它层的薄的阻挡构件。 以这种方式，将多个电子部件安装在基板的其它层上，以便在密封地附接阻挡构件之前与迹线电互连，被封装在金属箔内以提供环境密封的组件，其特征在于具有改进的抗潮湿扩散性 以及组装服务环境特征的其他物质的渗透/渗透。 还封装在金属箔内的填充材料可操作以中和预定量的渗透剂，进一步提高组件的可操作性和使用寿命。 优选地，相对刚性的聚合物材料形成为与基底接触接触，如通过将环境密封的组件上的塑料材料包覆成型，从而提供结合该组件的塑料部件。

    Method for protecting electronic components
    2.
    发明授权
    Method for protecting electronic components 失效
    保护电子部件的方法

    公开(公告)号：US5968386A

    公开(公告)日：1999-10-19

    申请号：US993112

    申请日：1997-12-18

    申请人： Lakhi Nandlal Goenka ,  Delin Li ,  Daniel Phillip Dailey ,  Charles Frederick Schweitzer ,  Michael Bednarz ,  Brenda Joyce Nation

    发明人： Lakhi Nandlal Goenka ,  Delin Li ,  Daniel Phillip Dailey ,  Charles Frederick Schweitzer ,  Michael Bednarz ,  Brenda Joyce Nation

    IPC分类号： H05K3/28 ,  H05K5/06 ,  H05B1/00

    CPC分类号： H05K5/068 ,  H05K3/284

    摘要： An an electronic circuit having improved protection against harsh environments, a preferred embodiment thereof including: a substrate 10 having a top surface 12; an electronic component 14 attached to the top surface of the substrate; a plastic and metal foil laminated barrier 16 having an outer periphery 18 thereabout, the outer periphery being sealably attached to the top surface 12 of the substrate so as to define a closed pocket 20 between the top surface 12 and the barrier 16 within which the electronic component 14 is enclosed; and a desiccant element 50. The desiccant element 50 includes: a case 51 having an internal chamber, an inlet orifice 58, and an outlet orifice 59, wherein the inlet and outlet orifices are each in communication with the internal chamber; a predetermined amount of desiccant material 53 contained within the internal chamber; a normally-open interior valve 54 situated between the inlet orifice 58 and the internal chamber; a normally-closed exterior valve 56 situated between the outlet orifice 59 and the internal chamber; and heating means 52 for selectably heating the desiccant material 53 preferably above a regeneration temperature thereof. The desiccant element 50 is situated such that at least the interior orifice 54 thereof is sealably enclosed within the closed pocket 20.

    摘要翻译： 一种具有改善的防恶劣环境保护的电子电路，其优选实施例包括：具有顶表面12的基板10; 电子部件14，其安装在基板的上表面上; 塑料和金属箔层压壁板16，其周边具有外周边18，外周边密封地附接到基板的顶表面12，以便在顶表面12和阻挡层16之间形成封闭的袋20， 组件14被封闭; 干燥剂元件50包括：具有内部室的壳体51，入口孔58和出口孔59，其中入口孔和出口孔各自与内部室连通; 包含在内部室内的预定量的干燥剂材料53; 位于入口孔58和内室之间的常开内部阀54; 位于出口孔59和内室之间的常闭外部阀56; 以及用于可选地加热干燥剂材料53的加热装置52，优选地在其再生温度之上。 干燥剂元件50被定位成使得至少其内孔54密封地封闭在封闭的口袋20内。

    Method for the connection and repair of flex and other circuits
    5.
    发明授权
    Method for the connection and repair of flex and other circuits 失效
    柔性和其他电路的连接和修复方法

    公开(公告)号：US06601292B2

    公开(公告)日：2003-08-05

    申请号：US09891697

    申请日：2001-06-26

    申请人： Delin Li ,  Jay DeAvis Baker ,  Achyuta Achari ,  Brenda Joyce Nation ,  John Trublowski

    发明人： Delin Li ,  Jay DeAvis Baker ,  Achyuta Achari ,  Brenda Joyce Nation ,  John Trublowski

    IPC分类号： H05K300

    CPC分类号： H05K3/361 ,  H05K1/0293 ,  H05K1/117 ,  H05K1/118 ,  H05K3/0052 ,  H05K3/225 ,  H05K2201/053 ,  H05K2201/09127 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/0979 ,  H05K2203/0228 ,  H05K2203/175 ,  Y10T29/49124 ,  Y10T29/49169 ,  Y10T29/4973 ,  Y10T29/49732

    摘要： A method for making and repairing connections between first and second circuits, such as flex circuits. An article 10 includes: a flexible dielectric substrate 12 having first and second edges 14/16, and a plurality of conductive circuit traces 18 arranged on or within the substrate, wherein each of the traces extends from proximate the first edge 14 to proximate the second edge 16. Each of the circuit traces 18 includes: a first connection feature 20 disposed proximate the first edge 14; a second connection feature 22 disposed proximate the second edge 16; and at least one third connection feature 24 disposed between the first and second edges 14/16. Each of the first, second, and third connection features 20/22/24 is a plated through hole, a plated blind via, or a mounting pad. This article 10 may be used to connect together the first and second circuits 50/60 using the first and second connection features 20/22, such as by soldering. If either of the two circuits needs to be subsequently detached (e.g., because of a component failure), the article 10 may be cut so as to present a set of third connection features 24 to which a new replacement circuit may be connected.

    摘要翻译： 用于制造和修复第一和第二电路之间的连接的方法，例如柔性电路。 物品10包括：具有第一和第二边缘14/16的柔性电介质基底12和布置在基底上或内部的多个导电电路迹线18，其中每个迹线从靠近第一边缘14延伸到接近第二边缘14 每个电路迹线18包括：靠近第一边缘14设置的第一连接特征20; 设置在第二边缘16附近的第二连接特征22; 以及设置在第一和第二边缘14/16之间的至少一个第三连接特征24。 第一，第二和第三连接特征20/22/24中的每一个是电镀通孔，电镀盲孔或安装垫。 本文10可以用于使用第一和第二连接特征20/22（例如通过焊接）将第一和第二电路50/60连接在一起。 如果两个电路中的任一个需要随后分离（例如，由于部件故障），则可以切割物品10以便呈现一组第三连接特征24，新的替换电路可以连接到该组。

    Multi-connectable printed circuit board
    7.
    发明授权
    Multi-connectable printed circuit board 有权

    公开(公告)号：US06270354B1

    公开(公告)日：2001-08-07

    申请号：US09387202

    申请日：1999-08-31

    申请人： Delin Li ,  Jay DeAvis Baker ,  Achyuta Achari ,  Brenda Joyce Nation ,  John Trublowski

    发明人： Delin Li ,  Jay DeAvis Baker ,  Achyuta Achari ,  Brenda Joyce Nation ,  John Trublowski

    IPC分类号： H01R1200

    摘要： A multi-connectable printed circuit assembly, comprising: (a) a printed circuit substrate 11 having a first edge 22 and first and second edge regions 44/55, wherein at least the first edge region 44 is defined along the first edge 22; (b) a first array 77 of electrical connection features 66 disposed on or within the substrate proximate the first edge region 44; (c) a second array 88 of electrical connection features 66 disposed on or within the substrate proximate the second edge region 55, wherein the second array 88 is substantially a duplication or a mirror image of the first array 77; and (d) a plurality of circuit traces 99 disposed on or within the substrate such that each electrical connection feature 66 of the first array 77 is connected by one of the circuit traces 99 to a corresponding electrical connection feature 66 of the second array 88.