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    Device and method for cleaving a liquid sample
    1.
    发明授权
    Device and method for cleaving a liquid sample 有权

    公开(公告)号：US11119012B2

    公开(公告)日：2021-09-14

    申请号：US15962426

    申请日：2018-04-25

    Applicant: Dimitry Boguslavsky ,  Mark Kovler

    Inventor： Dimitry Boguslavsky ,  Mark Kovler

    IPC: G01N1/28 ,  B26F3/00 ,  B28D5/00 ,  G01N1/42

    Abstract: An apparatus and method for cleaving a liquid sample are disclosed. The apparatus includes a load lock chamber containing a cleaving module, a cryo-cooler, a vacuum chamber configured to receive the cleaving module from the load lock chamber, and a gate valve between the load lock chamber and the vacuum chamber. The cleaving module is configured to cleave a crystalline sample holder and the liquid sample. The liquid sample includes one or more liquid phase materials and is cleavable by the cleaving module when in the solid phase. The cryo-cooler is configured to cool and/or maintain a temperature of the sample holder and the sample below the melting point of each of the liquid phase materials. The gate valve has at least one opening therein configured to (i) allow the cleaving module to enter and exit the vacuum chamber and/or (ii) permit gaseous communication between the load lock chamber and the vacuum chamber.

    Device and method for cleaving a crystalline sample
    3.
    发明授权
    Device and method for cleaving a crystalline sample 有权

    公开(公告)号：US10213940B2

    公开(公告)日：2019-02-26

    申请号：US14871668

    申请日：2015-09-30

    Applicant: Dimitry Boguslavsky ,  Mark Kovler

    Inventor： Dimitry Boguslavsky ,  Mark Kovler

    IPC: B28D5/00 ,  H01L21/67 ,  H01L21/78

    Abstract: A device for cleaving a crystalline sample, the device comprises: upper and lower bending elements that are arranged to contact upper and lower surfaces of the crystalline sample and to apply a bending moment on the crystalline sample; a first surface impact element that contacts a first surface of the crystalline sample; a cleaving element that is arranged to impact a second surface of the crystalline sample while the bending moment is applied on the crystalline element; wherein the second surface is opposite to the first side and oriented to the upper and lower surfaces of the crystalline sample wherein the device excludes any second surface alignment element for aligning the crystalline sample by contacting the second surface.

    Device and Method for Cleaving a Liquid Sample
    4.
    发明申请
    Device and Method for Cleaving a Liquid Sample 审中-公开

    公开(公告)号：US20180306685A1

    公开(公告)日：2018-10-25

    申请号：US15962426

    申请日：2018-04-25

    Applicant: Dimitry BOGUSLAVSKY ,  Mark KOVLER

    Inventor： Dimitry BOGUSLAVSKY ,  Mark KOVLER

    IPC: G01N1/28 ,  B28D5/00 ,  B26F3/00

    CPC classification number: G01N1/286 ,  B26F3/002 ,  B28D5/0011 ,  G01N1/2806 ,  G01N2001/2873

    Abstract: An apparatus and method for cleaving a liquid sample are disclosed. The apparatus includes a load lock chamber containing a cleaving module, a cryo-cooler, a vacuum chamber configured to receive the cleaving module from the load lock chamber, and a gate valve between the load lock chamber and the vacuum chamber. The cleaving module is configured to cleave a crystalline sample holder and the liquid sample. The liquid sample includes one or more liquid phase materials and is cleavable by the cleaving module when in the solid phase. The cryo-cooler is configured to cool and/or maintain a temperature of the sample holder and the sample below the melting point of each of the liquid phase materials. The gate valve has at least one opening therein configured to (i) allow the cleaving module to enter and exit the vacuum chamber and/or (ii) permit gaseous communication between the load lock chamber and the vacuum chamber.

    Method and system for milling and imaging an object
    5.
    发明授权
    Method and system for milling and imaging an object 有权
    用于研磨和成像物体的方法和系统

    公开(公告)号：US08721907B2

    公开(公告)日：2014-05-13

    申请号：US13282492

    申请日：2011-10-27

    Applicant: Dimitry Boguslavsky ,  Colin Smith

    Inventor： Dimitry Boguslavsky ,  Colin Smith

    IPC: C23F1/00

    CPC classification number: G01N1/286 ,  G01N2001/2873 ,  H01J37/3023 ,  H01J2237/31745

    Abstract: A system and a method for milling and inspecting an object. The method may include performing at least one iteration of a sequence that includes: milling, by a particle beam, a first surface of the object, during a first surface milling period; obtaining, by an electron detector, an image of a second surface of the object during at least a majority of the first surface milling period; wherein the object is expected to comprise an element of interest (EOI) that is positioned between the first and second surfaces; milling, by the particle beam, the second surface of the object during a second surface milling period; wherein each of the first surface milling period and the second surface milling period has a duration that exceeds a long duration threshold; obtaining by the electron detector an image of the first surface of the object during at least a majority of the second surface milling period.

    Abstract translation: 用于铣削和检查物体的系统和方法。 该方法可以包括执行序列的至少一次迭代，其包括：在第一表面研磨周期期间，通过粒子束研磨物体的第一表面; 在所述第一表面研磨周期的至少大部分期间，通过电子检测器获得所述物体的第二表面的图像; 其中所述物体预期包括位于所述第一和第二表面之间的感兴趣元件（EOI）; 在第二表面研磨周期期间通过所述粒子束研磨所述物体的第二表面; 其中所述第一表面研磨周期和所述第二表面研磨周期中的每一个具有超过长持续时间阈值的持续时间; 在第二表面研磨周期的至少大部分期间，由电子检测器获得物体的第一表面的图像。

    Device and Method for Cleaving a Crystalline Sample
    6.
    发明申请
    Device and Method for Cleaving a Crystalline Sample 审中-公开
    切割结晶样品的装置和方法

    公开(公告)号：US20160089813A1

    公开(公告)日：2016-03-31

    申请号：US14871668

    申请日：2015-09-30

    Applicant: Dimitry BOGUSLAVSKY ,  Mark KOVLER

    Inventor： Dimitry BOGUSLAVSKY ,  Mark KOVLER

    IPC: B28D5/00 ,  H01L21/78 ,  H01L21/67

    CPC classification number: B28D5/0017 ,  B28D5/0052 ,  H01L21/67092 ,  H01L21/78

    Abstract: A device for cleaving a crystalline sample, the device comprises: upper and lower bending elements that are arranged to contact upper and lower surfaces of the crystalline sample and to apply a bending moment on the crystalline sample; a first surface impact element that contacts a first surface of the crystalline sample; a cleaving element that is arranged to impact a second surface of the crystalline sample while the bending moment is applied on the crystalline element; wherein the second surface is opposite to the first side and oriented to the upper and lower surfaces of the crystalline sample wherein the device excludes any second surface alignment element for aligning the crystalline sample by contacting the second surface.

    Abstract translation: 一种用于切割结晶样品的装置，该装置包括：上和下弯曲元件，其布置成接触结晶样品的上表面和下表面，并在结晶样品上施加弯矩; 与所述结晶样品的第一表面接触的第一表面冲击元件; 该切割元件被布置成在弯曲力矩施加到结晶元件上时冲击晶体样品的第二表面; 其中所述第二表面与所述第一侧相对并且定向到所述结晶样品的上表面和下表面，其中所述装置排除任何第二表面对准元件，以通过接触所述第二表面来对准所述结晶样品。

    Methods, Apparatuses, Systems and Software for Treatment of a Specimen by Ion-Milling
    7.
    发明申请
    Methods, Apparatuses, Systems and Software for Treatment of a Specimen by Ion-Milling 有权
    用于通过离子铣削处理样品的方法，装置，系统和软件

    公开(公告)号：US20150255248A1

    公开(公告)日：2015-09-10

    申请号：US14642138

    申请日：2015-03-09

    Applicant: Dimitry BOGUSLAVSKY ,  Mark KOVLER

    Inventor： Dimitry BOGUSLAVSKY ,  Mark KOVLER

    IPC: H01J37/305 ,  G01N1/32

    CPC classification number: H01J37/3056 ,  G01N1/32 ,  H01J37/147 ,  H01J37/20 ,  H01J2237/0245 ,  H01J2237/0827 ,  H01J2237/1505 ,  H01J2237/31745 ,  H01J2237/31749

    Abstract: Methods, apparatuses, systems and software for ion beam milling or machining are disclosed. The apparatus includes a specimen holder, a table, one or more ion sources, rotatable ion optics, and an imaging device. The specimen holder is configured to hold a specimen in a stationary position during milling or machining. The table is configured to change the stationary position of the specimen holder in any of three orthogonal linear directions and an angular direction. The rotatable ion optics are configured to emit an ion beam towards a predetermined location on the specimen from any of the one or more ion sources at any angle around an axis that is orthogonal to a horizontal surface of the table when the angular direction of the table is 0°. The imaging device is configured to generate an image of the specimen including the predetermined location, thereby enabling real-time monitoring of the milling or machining process.

    Abstract translation: 公开了用于离子束铣削或加工的方法，装置，系统和软件。 该装置包括样本保持器，台，一个或多个离子源，可旋转的离子光学器件和成像装置。 样品架被配置成在铣削或加工过程中将样品保持在静止位置。 该台被配置为在三个正交的线性方向和角度方向中的任一个中改变样本保持器的静止位置。 可旋转离子光学器件被配置为当表的角度方向与表的水平表面垂直的轴线以任何角度从任何一个或多个离子源发射离子束到样品上的预定位置 是0°。 成像装置被配置为生成包括预定位置的样本的图像，从而能够实时地监视铣削或加工过程。

    METHOD AND SYSTEM FOR MILLING AND IMAGING AN OBJECT
    10.
    发明申请
    METHOD AND SYSTEM FOR MILLING AND IMAGING AN OBJECT 有权
    用于铣削和成像对象的方法和系统

    公开(公告)号：US20120103938A1

    公开(公告)日：2012-05-03

    申请号：US13282492

    申请日：2011-10-27

    Applicant: Dimitry Boguslavsky ,  Colin Smith

    Inventor： Dimitry Boguslavsky ,  Colin Smith

    IPC: B44C1/22

    CPC classification number: G01N1/286 ,  G01N2001/2873 ,  H01J37/3023 ,  H01J2237/31745

    Abstract: A system and a method for milling and inspecting an object. The method may include performing at least one iteration of a sequence that includes: milling, by a particle beam, a first surface of the object, during a first surface milling period; obtaining, by an electron detector, an image of a second surface of the object during at least a majority of the first surface milling period; wherein the object is expected to comprise an element of interest (EOI) that is positioned between the first and second surfaces; milling, by the particle beam, the second surface of the object during a second surface milling period; wherein each of the first surface milling period and the second surface milling period has a duration that exceeds a long duration threshold; obtaining by the electron detector an image of the first surface of the object during at least a majority of the second surface milling period.

    Abstract translation: 用于铣削和检查物体的系统和方法。 该方法可以包括执行序列的至少一次迭代，其包括：在第一表面研磨周期期间，通过粒子束研磨物体的第一表面; 在所述第一表面研磨周期的至少大部分期间，通过电子检测器获得所述物体的第二表面的图像; 其中所述物体预期包括位于所述第一和第二表面之间的感兴趣元件（EOI）; 在第二表面研磨周期期间通过所述粒子束研磨所述物体的第二表面; 其中所述第一表面研磨周期和所述第二表面研磨周期中的每一个具有超过长持续时间阈值的持续时间; 在第二表面研磨周期的至少大部分期间，由电子检测器获得物体的第一表面的图像。

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