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公开(公告)号:US5348190A
公开(公告)日:1994-09-20
申请号:US934780
申请日:1992-08-24
Applicant: John V. Mizzi , Donald A. Merte
Inventor: John V. Mizzi , Donald A. Merte
CPC classification number: B05B9/0827 , B05B9/0816
Abstract: The present invention includes an improved apparatus for discharging liquids in a spray, including a separable housing, a recyclable liquid module containing liquid to be sprayed and a weight activated air compressor or pump which supplies compressed air to the liquid module upon agitation of the entire apparatus. The liquid module including the liquid within forms part of the driving weight utilized by the pump. The liquid module is inserted into the separable housing and can reciprocate within the housing; it is connected to the pump with a conduit and coupling for the transfer of compressed air to the liquid module. A second conduit conducts liquid to be sprayed from the liquid module to the outlet valve for discharge.
Abstract translation: 本发明包括一种用于在喷雾器中排出液体的改进装置,包括可分离壳体,包含待喷射液体的可再循环液体模块和在整个装置搅动时向液体模块供应压缩空气的重量活化空气压缩机或泵 。 液体模块包括形成泵所使用的驱动重量的一部分的液体。 液体模块插入到可分离壳体中并且可以在壳体内往复运动; 它连接到具有用于将压缩空气传送到液体模块的导管和联接器的泵。 第二导管将液体从液体模块喷射到出口阀以进行排放。
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公开(公告)号:US5348198A
公开(公告)日:1994-09-20
申请号:US934781
申请日:1992-08-24
Applicant: John V. Mizzi , Donald A. Merte
Inventor: John V. Mizzi , Donald A. Merte
CPC classification number: B05B9/0827 , B05B9/0816
Abstract: A device for the spraying of liquids includes an air compressor or pump driven by a weight activated by shaking the device in an essentially vertical direction. The device consists of a resuable liquid module containing a liquid to be sprayed; a pump module attached to a screw cap for the liquid module and contained within the liquid module; a compressed air duct connecting the outlet of the air pump to the liquid module and a fluid conduit conducting the fluid to be sprayed from the liquid module to the outlet valve for discharge under the influence of the compressed air.
Abstract translation: 用于喷射液体的装置包括空气压缩机或泵,其由通过在基本上垂直的方向上摇动装置而激活的重物驱动。 该装置由含有待喷射液体的可回收液体模块组成; 泵模块,其附接到用于液体模块的螺帽并且包含在液体模块内; 将空气泵的出口连接到液体模块的压缩空气管道和将待喷射的流体从液体模块传导到出口阀的流体导管,以在压缩空气的影响下排出。
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公开(公告)号:US09048245B2
公开(公告)日:2015-06-02
申请号:US13488678
申请日:2012-06-05
Applicant: Edmund Blackshear , Thomas E. Lombardi , Donald A. Merte , Steven P. Ostrander , Thomas Weiss , Jiantao Zheng
Inventor: Edmund Blackshear , Thomas E. Lombardi , Donald A. Merte , Steven P. Ostrander , Thomas Weiss , Jiantao Zheng
IPC: B23K31/00 , B23K31/02 , B23K1/00 , B23K1/008 , B23K1/19 , B23K37/00 , B23K37/04 , H01L23/00 , H01L21/673
CPC classification number: H01L23/562 , H01L21/67333 , H01L22/12 , H01L22/20 , H01L24/81 , H01L2224/16225 , H01L2224/81024 , H01L2224/8121 , H01L2224/81815 , H01L2224/81908 , H01L2924/3511 , Y02P80/30
Abstract: A method including providing a fixture comprising a trap ring, a base plate having a recess adapted to receive a laminate substrate, the base plate including an opening and an adjustable height center button disposed in the opening, the opening being located within the recess and located in a center of the laminate substrate, characterizing the laminate substrate for warpage characteristics by using one of room temperature techniques and elevated temperature techniques, determining a horizontal plane distortion based on the warpage characteristics, and placing the laminate substrate into the fixture with an adjustment to correct the horizontal plane distortion, the adjustment is provided by the adjustable height center button, wherein the adjustable height center button contacts the laminate substrate. The method further includes fluxing the laminate substrate, placing a chip onto the laminate substrate, and placing the fixture into a reflow furnace to join the chip and the laminate substrate.
Abstract translation: 一种方法,包括提供包括陷阱环的固定装置,具有适于接收层压基板的凹部的基板,所述基板包括设置在所述开口中的开口和可调节的高度中心按钮,所述开口位于所述凹部内并且位于 在层压基板的中心,通过使用室温技术和高温技术中的一种来表征层压基板的翘曲特性,基于翘曲特性确定水平面变形,并将层压基板放置到固定装置中, 校正水平面失真,调节由可调高度中心按钮提供,其中可调节的高度中心按钮接触层压基板。 该方法还包括使层压基板熔化,将芯片放置在层压基板上,并将固定装置放入回流炉中以连接芯片和层叠基板。
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公开(公告)号:US08638564B2
公开(公告)日:2014-01-28
申请号:US13233748
申请日:2011-09-15
Applicant: Daniel J Buschel , Wai M Ma , Donald A Merte
Inventor: Daniel J Buschel , Wai M Ma , Donald A Merte
IPC: H05K1/14
CPC classification number: H05K3/00 , H05K3/22 , H05K3/3436 , H05K2201/10734 , H05K2203/0271 , H05K2203/085 , H05K2203/176
Abstract: An apparatus may include a housing forming an enclosure having an edge seatable on a printed circuit board (PCB). The enclosure edge may include an edge portion. The housing may be configured to transfer a force applied to the housing to a surface mount component mounted on the PCB to dismount the surface mount component. The apparatus may include a dye inlet formed by the housing and configured to conduct a dye into the enclosure. Another apparatus may include at least one gasket mounted to the enclosure edge to contact the major surface of the PCB adjacent to the surface mount component for forming a seal with the PCB. A method may include enclosing a surface mount component in an enclosure formed in a nozzle apparatus, introducing a dye into the enclosure, and applying a force to the nozzle apparatus to dismount the surface mount component.
Abstract translation: 一种装置可以包括形成具有可位于印刷电路板(PCB)上的边缘的外壳的壳体。 外壳边缘可以包括边缘部分。 壳体可以被配置为将施加到壳体的力传递到安装在PCB上的表面安装部件以卸下表面安装部件。 该装置可以包括由壳体形成并构造成将染料导入外壳的染料入口。 另一装置可以包括安装到外壳边缘的至少一个垫片,以接触邻近表面安装部件的PCB的主表面,以与PCB形成密封。 方法可以包括将表面安装部件封闭在形成在喷嘴装置中的外壳中,将染料引入外壳中,以及向喷嘴装置施加力以卸下表面安装部件。
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公开(公告)号:US20130070434A1
公开(公告)日:2013-03-21
申请号:US13233748
申请日:2011-09-15
Applicant: Daniel J. Buschel , Wai M. Ma , Donald A. Merte
Inventor: Daniel J. Buschel , Wai M. Ma , Donald A. Merte
CPC classification number: H05K3/00 , H05K3/22 , H05K3/3436 , H05K2201/10734 , H05K2203/0271 , H05K2203/085 , H05K2203/176
Abstract: An apparatus may include a housing forming an enclosure having an edge seatable on a printed circuit board (PCB). The enclosure edge may include an edge portion. The housing may be configured to transfer a force applied to the housing to a surface mount component mounted on the PCB to dismount the surface mount component. The apparatus may include a dye inlet formed by the housing and configured to conduct a dye into the enclosure. Another apparatus may include at least one gasket mounted to the enclosure edge to contact the major surface of the PCB adjacent to the surface mount component for forming a seal with the PCB. A method may include enclosing a surface mount component in an enclosure formed in a nozzle apparatus, introducing a dye into the enclosure, and applying a force to the nozzle apparatus to dismount the surface mount component.
Abstract translation: 一种装置可以包括形成具有可位于印刷电路板(PCB)上的边缘的外壳的壳体。 外壳边缘可以包括边缘部分。 壳体可以被配置为将施加到壳体的力传递到安装在PCB上的表面安装部件以卸下表面安装部件。 该装置可以包括由壳体形成并构造成将染料导入外壳的染料入口。 另一装置可以包括安装到外壳边缘的至少一个垫片,以接触邻近表面安装部件的PCB的主表面,以与PCB形成密封。 方法可以包括将表面安装部件封闭在形成在喷嘴装置中的外壳中,将染料引入外壳中,并向喷嘴装置施加力以卸下表面安装部件。
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公开(公告)号:US20130323345A1
公开(公告)日:2013-12-05
申请号:US13488693
申请日:2012-06-05
Applicant: Edmund D. Blackshear , Thomas E. Lombardi , Donald A. Merte , Steven P. Ostrander , Thomas Weiss , Jiantao Zheng
Inventor: Edmund D. Blackshear , Thomas E. Lombardi , Donald A. Merte , Steven P. Ostrander , Thomas Weiss , Jiantao Zheng
IPC: B29C53/18
CPC classification number: H01L24/75 , H01L23/562 , H01L24/81 , H01L2224/16 , H01L2224/75983 , H01L2224/75987 , H01L2224/81024 , H01L2224/81075 , H01L2224/81191 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2224/81912 , H01L2224/83192 , H01L2924/10253 , H01L2924/3511 , H01L2924/00 , H01L2924/00014
Abstract: A fixture for shaping a laminate substrate includes a trap ring, a base plate and a center button. The base plate includes a recess adapted to receive the laminate substrate. The center button is disposed in an opening in the base plate. The center button may be adjusted to shape the laminate substrate.
Abstract translation: 用于成型层压基板的固定装置包括捕获环,基板和中心按钮。 基板包括适于接收层压基板的凹部。 中心按钮设置在基板的开口中。 可以调节中心按钮以使层压基板成形。
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公开(公告)号:US20130320069A1
公开(公告)日:2013-12-05
申请号:US13488678
申请日:2012-06-05
Applicant: Edmund Blackshear , Thomas E. Lombardi , Donald A. Merte , Steven P. Ostrander , Thomas Weiss , Jiantao Zheng
Inventor: Edmund Blackshear , Thomas E. Lombardi , Donald A. Merte , Steven P. Ostrander , Thomas Weiss , Jiantao Zheng
IPC: B23K31/12
CPC classification number: H01L23/562 , H01L21/67333 , H01L22/12 , H01L22/20 , H01L24/81 , H01L2224/16225 , H01L2224/81024 , H01L2224/8121 , H01L2224/81815 , H01L2224/81908 , H01L2924/3511 , Y02P80/30
Abstract: A method for shaping a laminate substrate includes characterizing the laminate substrate for warpage characteristics. The laminate substrate is placed into a fixture with a correction to shape the laminate substrate based on the warpage characteristics. The laminate substrate is fluxed. A chip is placed onto the laminate substrate. The fixture is placed into a reflow furnace to join the chip and the laminate substrate. The fixture is removed from the reflow furnace. A warpage measurement is performed on the joined chip and laminate substrate. The correction may be modified if shorts are observed at the chip site.
Abstract translation: 用于成型层叠基板的方法包括表征层压基板的翘曲特性。 基于翘曲特性,将层压基板放置在具有校正以校正层压基板的固定装置中。 层压基板被熔化。 将芯片放置在层压基板上。 将夹具放入回流炉中以连接芯片和层压基板。 夹具从回流炉中取出。 在接合的芯片和层叠基板上进行翘曲测量。 如果在芯片位置观察到短路,则可以修改校正。
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公开(公告)号:US07808257B2
公开(公告)日:2010-10-05
申请号:US10595541
申请日:2003-11-12
Applicant: Christopher W. Cline , Edward J. Yarmchuk , Vincent A. Arena , Donald A. Merte , Thomas Picunko , Brian J. Wojszynski , Charles J. Hendricks , Michael E. Scaman , Robert S. Olyha, Jr. , Arnold Halperin
Inventor: Christopher W. Cline , Edward J. Yarmchuk , Vincent A. Arena , Donald A. Merte , Thomas Picunko , Brian J. Wojszynski , Charles J. Hendricks , Michael E. Scaman , Robert S. Olyha, Jr. , Arnold Halperin
IPC: G01R31/302
CPC classification number: G01R31/2805 , G01R19/0061 , G01R31/302
Abstract: A method and apparatus for the non-contact electrical test of both opens and shorts in electronic substrates. Top surface electrical test features are exposed to an ionization source under ambient conditions and the subsequent charge build up is measured as a drain current by probes contacting corresponding bottom surface features. Opens are detected by an absence of a drain current and shorts are detected by turning off the ionization source and re-measuring the bottom surface probes with a varying bias applied to each probe in the array.
Abstract translation: 用于电子基板中的开口和短路的非接触电测试的方法和装置。 顶部表面电测试特征在环境条件下暴露于电离源,随后的电荷积聚通过探针接触相应的底表面特征作为漏极电流测量。 通过不存在漏极电流来检测开路,并且通过关闭电离源并且利用施加到阵列中的每个探针的变化偏置来重新测量底表面探针来检测短路。
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公开(公告)号:US5348197A
公开(公告)日:1994-09-20
申请号:US934779
申请日:1992-08-24
Applicant: John V. Mizzi , Donald A. Merte
Inventor: John V. Mizzi , Donald A. Merte
CPC classification number: B05B9/0827 , B05B9/0816
Abstract: The present invention includes an improved apparatus for discharging liquids in a spray, including a recyclable liquid module containing a liquid to be sprayed, and a separable pump module containing an air compressor or pump driven by a weight activated by shaking the device in an essentially vertical direction. The liquid stand alone module is side coupled by a common wall with the pump module with a coupling extension providing a connection between the two modules for the transfer of compressed air from the pump module to the liquid module. Since the outlet check valve of the pump is located within the liquid module, the liquid module remains pressurized even with the pump module detached. A fluid conduit within the liquid module conducts the fluid to be sprayed to the outlet valve for discharge under the influence of the compressed air.
Abstract translation: 本发明包括一种用于在喷雾器中排出液体的改进装置,包括含有待喷射液体的可再循环液体模块,以及一个可分离的泵组件,其包含空气压缩机或泵,该空气压缩机或泵由通过基本垂直 方向。 液体独立模块通过公共壁与泵模块侧面耦合,具有耦合延伸部,其提供两个模块之间的连接,用于将压缩空气从泵模块传送到液体模块。 由于泵的出口止回阀位于液体模块内,所以即使泵模块分离,液体模块也保持加压。 液体模块内的流体导管将被喷射的流体导引到出口阀,以在压缩空气的影响下排出。
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公开(公告)号:US09059240B2
公开(公告)日:2015-06-16
申请号:US13488693
申请日:2012-06-05
Applicant: Edmund D. Blackshear , Thomas E. Lombardi , Donald A. Merte , Steven P. Ostrander , Thomas Weiss , Jiantao Zheng
Inventor: Edmund D. Blackshear , Thomas E. Lombardi , Donald A. Merte , Steven P. Ostrander , Thomas Weiss , Jiantao Zheng
CPC classification number: H01L24/75 , H01L23/562 , H01L24/81 , H01L2224/16 , H01L2224/75983 , H01L2224/75987 , H01L2224/81024 , H01L2224/81075 , H01L2224/81191 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2224/81912 , H01L2224/83192 , H01L2924/10253 , H01L2924/3511 , H01L2924/00 , H01L2924/00014
Abstract: A fixture for shaping a laminate substrate includes a trap ring, a base plate and a center button. The base plate includes a recess adapted to receive the laminate substrate. The center button is disposed in an opening in the base plate. The center button may be adjusted to shape the laminate substrate.
Abstract translation: 用于成型层压基板的固定装置包括捕获环,基板和中心按钮。 基板包括适于接收层压基板的凹部。 中心按钮设置在基板的开口中。 可以调节中心按钮以使层压基板成形。
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