摘要:
A reference cell layout includes a plurality of active areas, in parallel to each other, and a first contact of the active areas, and a first gate, the first contact shorting the active areas. A memory device includes the reference cell layout and a corresponding array of memory cells having active areas sized substantially identical to the active areas of the reference cell layout and plural second contacts respectively contacting the active areas of the memory cells.
摘要:
A process for forming floating gate non-volatile memory cells in a cell matrix with associated control circuitry comprising both N-channel and P-channel MOS transistors is provided. The process includes forming active areas in a substrate for the cell matrix and the associated control circuitry. A first thin oxide layer and a first polysilicon layer are deposited on the active areas to produce floating gate regions of the memory cells, and a second dielectric layer is deposited on the active areas. A second polysilicon layer is then deposited on the active areas. A masking and etching step is performed for exposing the substrate for the associated control circuitry followed by the deposition of a third polysilicon layer. The third polysilicon layer is defined to produce the gate regions of the transistors for the associated control circuitry while the third polysilicon layer is removed from the cell matrix. A self-aligned etching step is performed to define the gate regions of the memory cells, and dopants are implanted in the junction areas to produce the source/drain regions of the memory cells.
摘要:
A process creates contacts in semiconductor electronic devices and in particular on bit lines of non-volatile memories with cross-point structure. The cross-point structure includes memory cell matrices in which the bit lines are parallel unbroken diffusion strips extending along a column of the matrix with the contacts being provided through associated contact apertures defined through a dielectric layer deposited over a contact region defined on a semiconductor substrate at one end of the bit lines. The process calls for a step of implantation and following diffusion of contact areas provided in the substrate at opposite sides of each bit line to be contacted to widen the area designed to receive the contacts.
摘要:
A voltage regulator for electrically programmable non-volatile semiconductor memory devices of the type comprising a gain stage (3), supplied by a programming voltage (Vpp) and having an input terminal connected to a divider (6) of said programming voltage (Vpp) and an output terminal (U) connected to a programming line (5) of at least one memory cell (2) comprises at least one circuit element (4) capable of adapting the line programming voltage (5) to the length (L) of the memory cell (2). This provides a drain voltage, on the bit line of the memory device, which varies according to the actual length of the memory cell.
摘要:
An integrated circuit includes a semiconductor substrate including first and second portions, with first electronic devices adjacent the first portion. Each first electronic device includes a first region comprising at least one first conductive layer projecting from the semiconductor substrate. First protective spacers are adjacent sidewalls of the first regions of the first electronic devices. The first protective spacers are defined by first and second sealing layers adjacent one another. Second electronic devices are adjacent the second portion of the semiconductor substrate. Each second electronic device includes a second region comprising a second conductive layer projecting from the semiconductor substrate. Second protective spacers are adjacent sidewalls of the second regions of the second electronic devices. The second protective spacers are defined by other portions of the second sealing layer. The second sealing layer has a thickness less than a thickness of the first sealing layer.
摘要:
An integrated non-volatile memory device may include a first matrix of memory cells organized into rows (or word lines) and columns (or bit lines), corresponding row and column decoding circuits, and read, modify and erase circuits for reading and modifying data stored in the memory cells. Furthermore, the memory device may also include a test structure including a second matrix of memory cells smaller than the first. The second memory matrix may include word line couplings each having a different contact to gate distance. That is, each coupling is aligned a different distance from its respective gate than adjacent couplings.
摘要:
A method and a related circuit structure are described for improving the effectiveness of ESD protection in circuit structures realized in a semiconductor substrate overlaid with an epitaxial layer and including at least one ESD protection lateral bipolar transistor realized in the surface of the epitaxial layer. The method consists of forming under the transistor an isolating well that isolates the transistor from the substrate. Advantageously, the transistor can be fully isolated from the substrate by first and second N wells which extend from the surface of the epitaxial layer down to and in contact with the buried well.
摘要:
A voltage regulator for electrically programmable non-volatile semiconductor memory devices of the type comprising a gain stage (3), supplied by a programming voltage (Vpp) and having an input terminal connected to a divider (6) of said programming voltage (Vpp) and an output terminal (U) connected to a programming line (5) of at least one memory cell (2) comprises at least one circuit element (4) capable of adapting the line programming voltage (5) to the length (L) of the memory cell (2). This provides a drain voltage, on the bit line of the memory device, which varies according to the actual length of the memory cell.
摘要:
Since fault phenomena such as lowering of the cell gain and cell emptying occur during normal operation the present invention proposes that in the memory device the row and/or column address decoding means (RDEC,CDEC) comprise at least one non-volatile memory (NVM) for address mapping and that the reading and writing control logic (CL) comprise means (TST) designed to identify cell faults, such as low grain, in the rows and/or columns of the matrix (MAT) of the memory device and writing means (WM) designed to write on said non-volatile memory (NVM) during normal operation addresses corresponding to redundant rows and/or columns (RID) present in the matrix (MAT) to rectify said faults.
摘要:
Briefly, embodiments of non-volatile memory and embodiments of fabrication thereof are disclosed. For example, a non-volatile memory device having a gate assembly with a floating gate and a control gate assembly is described. The control gate assembly includes a non-metal conductive control gate and a metal control gate in one embodiment. Additional embodiments are described, including use of a sacrificial nitride layer and forming contact recesses to create source or drain contacts, as other examples.