公开(公告)号：US07615479B1

公开(公告)日：2009-11-10

申请号：US11159526

申请日：2005-06-22

申请人： Gordon S. W. Craig ,  Mark A. Hadley ,  Susan Swindlehurst ,  Ali A. Tootoonchi ,  Eric Kanemoto ,  Eric Jonathan Snyder ,  Scott Herrmann ,  Glenn Gengel ,  Lily Liong

发明人： Gordon S. W. Craig ,  Mark A. Hadley ,  Susan Swindlehurst ,  Ali A. Tootoonchi ,  Eric Kanemoto ,  Eric Jonathan Snyder ,  Scott Herrmann ,  Glenn Gengel ,  Lily Liong

IPC分类号： H01L21/4763 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/31

CPC分类号： G06K19/07718 ,  G06K19/07749 ,  G06K19/07752 ,  G06K19/07756 ,  H01L23/66 ,  H01L24/19 ,  H01L24/24 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L25/50 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/83136 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/53178 ,  H01L2224/82 ,  H01L2224/83851 ,  H01L2924/00

摘要： An electronic assembly. The assembly includes a substrate, a plurality of recessed regions, and a plurality of functional blocks. Each functional block is deposited in one of the recessed regions. A substantial amount of the plurality of functional blocks is recessed below a top surface of the substrate. Substantial amount is defined by any one of less than 10% of said functional blocks protrudes above the top surface of the substrate; less than 1% of the functional blocks protrudes above the top surface of the substrate; more than 90% of the functional blocks are recessed below the top surface of the substrate; or more than 99% of the functional blocks are recessed below the top surface of the substrate.

摘要翻译： 电子组装。 组件包括衬底，多个凹陷区域和多个功能块。 每个功能块沉积在一个凹陷区域中。 大量的多个功能块被凹入到衬底的顶表面之下。 基本上限是由少于10％的所述功能块中的任何一个突出于衬底的顶表面之上; 少于1％的功能块突出于衬底的顶表面之上; 超过90％的功能块凹陷在基板的顶表面下方; 或超过99％的功能块凹陷在基板的顶表面下方。

公开(公告)号：US06919225B2

公开(公告)日：2005-07-19

申请号：US10689906

申请日：2003-10-20

申请人： Gordon S. W. Craig ,  Eric Jonathan Snyder ,  Jay Kuang-Jieh Tu

发明人： Gordon S. W. Craig ,  Eric Jonathan Snyder ,  Jay Kuang-Jieh Tu

IPC分类号： H01L23/13 ,  H01L25/065 ,  H01L29/06 ,  H01L21/44

CPC分类号： H01L25/0655 ,  H01L23/13 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L29/0657 ,  H01L2224/24227 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10158 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  Y10S977/883 ,  H01L2924/00

摘要： An apparatus and methods of making an electronic assembly. The electronic assembly comprises a functional block having at least one asymmetric feature. The functional block comprises an integrated circuitry to perform a function pertaining to the electronic assembly. The electronic assembly further comprises a substrate having a receptor site to mate with the functional block using a fluidic self-assembly process.

摘要翻译： 制造电子组件的装置和方法。 电子组件包括具有至少一个不对称特征的功能块。 功能块包括用于执行与电子组件有关的功能的集成电路。 电子组件还包括具有受体部位的衬底，该接收部位使用流体自组装工艺与功能块配合。

公开(公告)号：US06657289B1

公开(公告)日：2003-12-02

申请号：US10193807

申请日：2002-07-11

申请人： Gordon S. W. Craig ,  Eric Jonathan Snyder ,  Jay Kuang-Jieh Tu

发明人： Gordon S. W. Craig ,  Eric Jonathan Snyder ,  Jay Kuang-Jieh Tu

IPC分类号： H01L23048

CPC分类号： H01L25/0655 ,  H01L23/13 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L29/0657 ,  H01L2224/24227 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10158 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  Y10S977/883 ,  H01L2924/00

摘要： An apparatus and methods of making an electronic assembly. The electronic assembly comprises a functional block having at least one asymmetric feature. The functional block comprises an integrated circuitry to perform a function pertaining to the electronic assembly. The electronic assembly further comprises a substrate having a receptor site to mate with the functional block using a fluidic self-assembly process.

摘要翻译： 制造电子组件的装置和方法。 电子组件包括具有至少一个不对称特征的功能块。 功能块包括用于执行与电子组件有关的功能的集成电路。 电子组件还包括具有受体部位的衬底，该接收部位使用流体自组装工艺与功能块配合。